FR2867589B1 - Procede de fabrication de carte a puce sans contact et carte a puce sans contact - Google Patents

Procede de fabrication de carte a puce sans contact et carte a puce sans contact

Info

Publication number
FR2867589B1
FR2867589B1 FR0502293A FR0502293A FR2867589B1 FR 2867589 B1 FR2867589 B1 FR 2867589B1 FR 0502293 A FR0502293 A FR 0502293A FR 0502293 A FR0502293 A FR 0502293A FR 2867589 B1 FR2867589 B1 FR 2867589B1
Authority
FR
France
Prior art keywords
chip card
manufacturing contactless
contact chip
contact
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0502293A
Other languages
English (en)
Other versions
FR2867589A1 (fr
Inventor
Frank Puschner
Reinhard Proske
Peter Stampka
Hipper Andreas Muller
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies AG
Circle Smart Card AG
Original Assignee
Infineon Technologies AG
Circle Smart Card AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies AG, Circle Smart Card AG filed Critical Infineon Technologies AG
Publication of FR2867589A1 publication Critical patent/FR2867589A1/fr
Application granted granted Critical
Publication of FR2867589B1 publication Critical patent/FR2867589B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07724—Physical layout of the record carrier the record carrier being at least partially made by a molding process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14647—Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14836—Preventing damage of inserts during injection, e.g. collapse of hollow inserts, breakage
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/0773—Physical layout of the record carrier the record carrier comprising means to protect itself against external heat sources
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14836—Preventing damage of inserts during injection, e.g. collapse of hollow inserts, breakage
    • B29C2045/14844—Layers protecting the insert from injected material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3456—Antennas, e.g. radomes

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Credit Cards Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
FR0502293A 2004-03-10 2005-03-08 Procede de fabrication de carte a puce sans contact et carte a puce sans contact Expired - Fee Related FR2867589B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102004011702A DE102004011702B4 (de) 2004-03-10 2004-03-10 Verfahren zur Herstellung eines Kartenkörpers für eine kontaktlose Chipkarte

Publications (2)

Publication Number Publication Date
FR2867589A1 FR2867589A1 (fr) 2005-09-16
FR2867589B1 true FR2867589B1 (fr) 2007-02-16

Family

ID=34895152

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0502293A Expired - Fee Related FR2867589B1 (fr) 2004-03-10 2005-03-08 Procede de fabrication de carte a puce sans contact et carte a puce sans contact

Country Status (6)

Country Link
US (1) US7240847B2 (fr)
JP (1) JP2005259147A (fr)
CN (1) CN100356401C (fr)
DE (1) DE102004011702B4 (fr)
FR (1) FR2867589B1 (fr)
RU (1) RU2291484C2 (fr)

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WO2009093248A1 (fr) 2008-01-23 2009-07-30 On Track Innovations Ltd. Procédés de fabrication d'une carte à puce
US20050125011A1 (en) * 2001-04-24 2005-06-09 Spence Paul A. Tissue fastening systems and methods utilizing magnetic guidance
JP4718192B2 (ja) * 2005-01-17 2011-07-06 新光電気工業株式会社 リーダ／ライタ
WO2007116790A1 (fr) * 2006-04-03 2007-10-18 Panasonic Corporation Module de memoire a semi-conducteur incorporant une antenne
BRPI0710244B1 (pt) * 2006-04-10 2022-02-08 Innovatier, Inc Inlay eletrônico e cartão eletrônico e métodos para fabricar os mesmos
US20080012687A1 (en) * 2006-06-29 2008-01-17 Rubinstein Walter M Container with embedded rfid tag
HK1109708A2 (en) 2007-04-24 2008-06-13 On Track Innovations Ltd Interface card and apparatus and process for the formation thereof
US8212155B1 (en) * 2007-06-26 2012-07-03 Wright Peter V Integrated passive device
IL184260A0 (en) * 2007-06-27 2008-03-20 On Track Innovations Ltd Mobile telecommunications device having sim/antenna coil interface
JP5155616B2 (ja) * 2007-07-25 2013-03-06 沖プリンテッドサーキット株式会社 Ｒｆｉｄタグ、ｒｆｉｄシステムおよびｒｆｉｄタグの製造方法
US8028923B2 (en) * 2007-11-14 2011-10-04 Smartrac Ip B.V. Electronic inlay structure and method of manufacture thereof
US20090123743A1 (en) * 2007-11-14 2009-05-14 Guy Shafran Method of manufacture of wire imbedded inlay
US10579920B2 (en) * 2007-12-24 2020-03-03 Dynamics Inc. Systems and methods for programmable payment cards and devices with loyalty-based payment applications
US20100090008A1 (en) * 2008-10-13 2010-04-15 Oded Bashan Authentication seal
GB2466255B (en) 2008-12-17 2013-05-22 Antenova Ltd Antennas conducive to semiconductor packaging technology and a process for their manufacture
US8195236B2 (en) 2010-06-16 2012-06-05 On Track Innovations Ltd. Retrofit contactless smart SIM functionality in mobile communicators
US8424757B2 (en) 2010-12-06 2013-04-23 On Track Innovations Ltd. Contactless smart SIM functionality retrofit for mobile communication device
DE102013105575A1 (de) * 2013-05-30 2014-12-04 Infineon Technologies Ag Chipkartenmodul, Chipkarte, und Verfahren zum Herstellen eines Chipkartenmoduls
US10513081B1 (en) 2013-12-10 2019-12-24 Wells Fargo Bank, N.A. Method of making a transaction instrument
US10354175B1 (en) 2013-12-10 2019-07-16 Wells Fargo Bank, N.A. Method of making a transaction instrument
US10380476B1 (en) 2013-12-10 2019-08-13 Wells Fargo Bank, N.A. Transaction instrument
US10479126B1 (en) 2013-12-10 2019-11-19 Wells Fargo Bank, N.A. Transaction instrument
JP6477019B2 (ja) * 2015-02-27 2019-03-06 株式会社村田製作所 Ｒｆｉｃデバイスを含む樹脂成型体の製造方法
GB2542361B (en) * 2015-09-16 2021-03-03 Spa Track Medical Ltd Method of manufacturing an RFID tag assembly and RFID tag assembly
US10482365B1 (en) 2017-11-21 2019-11-19 Wells Fargo Bank, N.A. Transaction instrument containing metal inclusions
DE102019126232A1 (de) * 2019-09-30 2021-04-01 Lisa Dräxlmaier GmbH Herstellen eines stromführenden fahrzeugbauteils

Family Cites Families (23)

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Publication number Priority date Publication date Assignee Title
DE271401C (fr) *
DD271401A1 (de) * 1988-04-04 1989-08-30 Seghers A Mikroelektronik Veb Verfahren zur erhoehung der zuverlaessigkeit plastverkappter halbleiterbauelemente
FR2636755B1 (fr) * 1988-09-16 1992-05-22 Schlumberger Ind Sa Procede de realisation de cartes a memoire et cartes obtenues par ledit procede
JPH04282299A (ja) * 1991-03-12 1992-10-07 Hitachi Maxell Ltd 情報カードならびにその製造方法
DE9422424U1 (de) 1994-02-04 2002-02-21 Giesecke & Devrient Gmbh Chipkarte mit einem elektronischen Modul
DE4424396C2 (de) * 1994-07-11 1996-12-12 Ibm Trägerelement zum Einbau in Chipkarten oder anderen Datenträgerkarten
JP2001521649A (ja) 1995-12-22 2001-11-06 センパック ソシエテ アノニム 非接触技術を用いたチップカードの製造方法
FR2743649B1 (fr) 1996-01-17 1998-04-03 Gemplus Card Int Module electronique sans contact, carte etiquette electronique l'incorporant, et leurs procedes de fabrication
JPH09286187A (ja) * 1996-04-22 1997-11-04 Toppan Printing Co Ltd Ｉｃカード、ｉｃカード製造用中間体およびｉｃカードの製造方法
KR20000010876A (ko) * 1996-05-17 2000-02-25 칼 하인쯔 호르닝어 반도체칩용 기판 부재
DE19637306C1 (de) 1996-09-13 1998-05-20 Orga Kartensysteme Gmbh Verfahren zur Herstellung einer Chipkarte
DE19732353A1 (de) 1996-09-27 1999-02-04 Fraunhofer Ges Forschung Verfahren zur Herstellung kontaktloser Chipkarten und kontaktlose Chipkarte
US6651891B1 (en) * 1997-11-04 2003-11-25 Elke Zakel Method for producing contactless chip cards and corresponding contactless chip card
JP2000011121A (ja) * 1998-06-24 2000-01-14 Shinsei Kagaku Kogyo Co Ltd 情報記憶媒体
JP3717701B2 (ja) * 1999-04-19 2005-11-16 凸版印刷株式会社 ハイブリッド型ｉｃカードの製造方法
EP1052595B1 (fr) * 1999-05-14 2001-09-19 Sokymat Sa Transpondeur et objet moulé par injection et procédé pour leur fabrication
FR2797977B1 (fr) * 1999-08-25 2004-09-24 Gemplus Card Int Procede de fabrication d'un dispositif electronique portable comportant une etape de surmoulage directement sur le film support
US6147662A (en) * 1999-09-10 2000-11-14 Moore North America, Inc. Radio frequency identification tags and labels
FR2801709B1 (fr) 1999-11-29 2002-02-15 A S K Carte a puce sans contact ou hybride contact-sans contact permettant de limiter les risques de fraude
JP2003068775A (ja) * 2001-08-23 2003-03-07 Lintec Corp 回路基板樹脂封止成形品及びその製造方法
JP2003099745A (ja) * 2001-09-25 2003-04-04 Shinko Electric Ind Co Ltd Ｉｃカード及びその製造方法
DE10156803A1 (de) 2001-11-20 2003-05-28 Giesecke & Devrient Gmbh Verfahren, System und Werkzeug zur Herstellung eines elektronischen Datenträgers mit integrierter Spule
DE10220239A1 (de) * 2002-05-06 2003-12-04 Orga Kartensysteme Gmbh Chipkarte und Verfahren zu deren Herstellung

Also Published As

Publication number Publication date
RU2291484C2 (ru) 2007-01-10
DE102004011702B4 (de) 2006-02-16
US20050199734A1 (en) 2005-09-15
US7240847B2 (en) 2007-07-10
JP2005259147A (ja) 2005-09-22
CN1667649A (zh) 2005-09-14
CN100356401C (zh) 2007-12-19
RU2005106775A (ru) 2006-08-20
FR2867589A1 (fr) 2005-09-16
DE102004011702A1 (de) 2005-10-06

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Legal Events

Date Code Title Description
PLFP Fee payment

Year of fee payment: 12

PLFP Fee payment

Year of fee payment: 13

PLFP Fee payment

Year of fee payment: 14

ST Notification of lapse

Effective date: 20191106