FR2861483B1 - Procede de fabrication d'une cle electronique a connecteur usb et cle electronique obtenue - Google Patents
Procede de fabrication d'une cle electronique a connecteur usb et cle electronique obtenueInfo
- Publication number
- FR2861483B1 FR2861483B1 FR0312584A FR0312584A FR2861483B1 FR 2861483 B1 FR2861483 B1 FR 2861483B1 FR 0312584 A FR0312584 A FR 0312584A FR 0312584 A FR0312584 A FR 0312584A FR 2861483 B1 FR2861483 B1 FR 2861483B1
- Authority
- FR
- France
- Prior art keywords
- electronic key
- manufacturing
- usb connector
- key obtained
- electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/04—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the shape
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07733—Physical layout of the record carrier the record carrier containing at least one further contact interface not conform ISO-7816
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
- Y10T29/4921—Contact or terminal manufacturing by assembling plural parts with bonding
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0312584A FR2861483B1 (fr) | 2003-10-28 | 2003-10-28 | Procede de fabrication d'une cle electronique a connecteur usb et cle electronique obtenue |
CN2004800392125A CN1902642B (zh) | 2003-10-28 | 2004-10-04 | Usb电子钥匙 |
JP2006537275A JP2007538298A (ja) | 2003-10-28 | 2004-10-04 | Usbコネクタを備えた電子キーの製造方法と得られる電子キー |
US10/577,554 US8555496B2 (en) | 2003-10-28 | 2004-10-04 | Method for manufacturing an electronic key with USB connector |
PCT/EP2004/052423 WO2005041120A1 (fr) | 2003-10-28 | 2004-10-04 | Procede de fabrication d'une cle electronique a connecteur usb et cle electronique obtenue |
EP04791135A EP1709574A1 (fr) | 2003-10-28 | 2004-10-04 | Procede de fabrication d' une cle electronique a connecteur usb et cle electronique obtenue |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0312584A FR2861483B1 (fr) | 2003-10-28 | 2003-10-28 | Procede de fabrication d'une cle electronique a connecteur usb et cle electronique obtenue |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2861483A1 FR2861483A1 (fr) | 2005-04-29 |
FR2861483B1 true FR2861483B1 (fr) | 2006-01-27 |
Family
ID=34400843
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0312584A Expired - Fee Related FR2861483B1 (fr) | 2003-10-28 | 2003-10-28 | Procede de fabrication d'une cle electronique a connecteur usb et cle electronique obtenue |
Country Status (6)
Country | Link |
---|---|
US (1) | US8555496B2 (fr) |
EP (1) | EP1709574A1 (fr) |
JP (1) | JP2007538298A (fr) |
CN (1) | CN1902642B (fr) |
FR (1) | FR2861483B1 (fr) |
WO (1) | WO2005041120A1 (fr) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2887357A1 (fr) * | 2005-06-20 | 2006-12-22 | Gemplus Sa | Procede de fabrication d'un objet electronique comportant une etape de transfert de donnees et objet obtenu |
KR100828956B1 (ko) * | 2006-06-27 | 2008-05-13 | 하나 마이크론(주) | Usb 메모리 패키지 및 그 제조 방법 |
US9769944B2 (en) * | 2015-07-15 | 2017-09-19 | Toshiba Memory Corporation | Semiconductor memory device |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2021256A1 (de) * | 1970-04-30 | 1971-11-11 | Agfa Gevaert Ag | Photographisches Verarbeitungsgeraet |
JPH022095A (ja) * | 1988-06-10 | 1990-01-08 | Ricoh Co Ltd | Icモジュールの製造方法及びicモジュール用基材 |
JPH02261696A (ja) * | 1989-03-31 | 1990-10-24 | Toppan Printing Co Ltd | Icモジュール |
JPH0731136Y2 (ja) * | 1990-01-05 | 1995-07-19 | 矢崎総業株式会社 | 膜式ガスメータののう膜アッセンブリ構造 |
JPH04319497A (ja) * | 1991-04-18 | 1992-11-10 | Toshiba Corp | Icカード用モジュール |
US6159770A (en) * | 1995-11-08 | 2000-12-12 | Fujitsu Limited | Method and apparatus for fabricating semiconductor device |
DE10014620A1 (de) * | 2000-03-24 | 2001-09-27 | Andreas Plettner | Verfahren zur Herstellung eines Trägerbandes mit einer Vielzahl von elektrischen Einheiten, jeweils aufweisend einen Chip und Kontaktelemente |
CN2449275Y (zh) * | 2000-10-27 | 2001-09-19 | 富士康(昆山)电脑接插件有限公司 | 读卡连接器 |
FR2830107B1 (fr) * | 2001-09-24 | 2004-09-24 | Gemplus Card Int | Cle electronique destinee a etre connectee a un port d'un dispositif de telecommunication et procede de fabrication de la cle |
US6744634B2 (en) * | 2001-11-23 | 2004-06-01 | Power Quotient International Co., Ltd. | Low height USB interface connecting device and a memory storage apparatus thereof |
TW520098U (en) * | 2001-12-26 | 2003-02-01 | Hon Hai Prec Ind Co Ltd | Plug connector and its matching socket connector |
CN2533502Y (zh) * | 2002-02-21 | 2003-01-29 | 万国电脑股份有限公司 | 具usb插头的矽碟卡 |
KR20030087894A (ko) * | 2002-05-09 | 2003-11-15 | 캐리 컴퓨터 이엔지. 컴퍼니 리미티드 | 메모리 카드 구조 |
US6676419B1 (en) * | 2003-02-13 | 2004-01-13 | Asia Vital Components Co., Ltd. | Portable storing device with universal serial bus |
-
2003
- 2003-10-28 FR FR0312584A patent/FR2861483B1/fr not_active Expired - Fee Related
-
2004
- 2004-10-04 US US10/577,554 patent/US8555496B2/en not_active Expired - Fee Related
- 2004-10-04 CN CN2004800392125A patent/CN1902642B/zh not_active Expired - Fee Related
- 2004-10-04 EP EP04791135A patent/EP1709574A1/fr not_active Withdrawn
- 2004-10-04 WO PCT/EP2004/052423 patent/WO2005041120A1/fr active Application Filing
- 2004-10-04 JP JP2006537275A patent/JP2007538298A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
WO2005041120A1 (fr) | 2005-05-06 |
EP1709574A1 (fr) | 2006-10-11 |
FR2861483A1 (fr) | 2005-04-29 |
JP2007538298A (ja) | 2007-12-27 |
CN1902642B (zh) | 2012-05-30 |
CN1902642A (zh) | 2007-01-24 |
US20080092381A1 (en) | 2008-04-24 |
US8555496B2 (en) | 2013-10-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
FR2851373B1 (fr) | Procede de fabrication d'un circuit electronique integre incorporant des cavites | |
FI20031341A (fi) | Menetelmä elektroniikkamoduulin valmistamiseksi | |
FI20031201A0 (fi) | Menetelmä elektroniikkamoduulin valmistamiseksi ja elektroniikkamoduuli | |
DE60234088D1 (de) | Verfahren zur recherche in einer elektronischer programmführung | |
FI20041524A0 (fi) | Menetelmä elektroniikkamoduulin valmistamiseksi | |
FI20040827A0 (fi) | Menetelmä elektroniikkamoduulin valmistamiseksi | |
FR2830107B1 (fr) | Cle electronique destinee a etre connectee a un port d'un dispositif de telecommunication et procede de fabrication de la cle | |
FI20030293A0 (fi) | Menetelmä elektroniikkamoduulin valmistamiseksi ja elektroniikkamoduuli | |
AU2003221149A1 (en) | Method for manufacturing electronic component-mounted board | |
DE60318776D1 (de) | Kartenverbinder mit Kartenauswerfschieber | |
DE60128446D1 (de) | Markierungseinspritzung in einem produktionsbohrloch | |
DE60319586D1 (de) | Elektronisches wörterbuch mit beispielsätzen | |
FI20031796A0 (fi) | Menetelmä EMI-suojan rakentamiseksi piirilevylle upotettavan komponentin ympärille | |
ATE302449T1 (de) | Herstellungsverfahren für ein modul mit mindestens einem elektronischen element | |
GB2395724B (en) | Method of manufacturing a fibrous substrate incorporating an electronic chip | |
FR2861483B1 (fr) | Procede de fabrication d'une cle electronique a connecteur usb et cle electronique obtenue | |
BR0315486B1 (pt) | processo para a fabricação de um dispositivo eletrÈnico e dispositivo eletrÈnico. | |
FR2921740B1 (fr) | Procede de fabrication d'une cle electronique a connecteur usb | |
FR2806350B1 (fr) | Piece en matiere plastique renforcee et procede de fabrication | |
FR2903236B1 (fr) | Carte electronique pourvue d'un connecteur en deux parties et procede de fabrication d'une telle carte | |
FR2832852B1 (fr) | Procede de fabrication d'un composant electronique incorporant un micro-composant inductif | |
PT1338618E (pt) | Processo de producao de poliois de polieter | |
GB2417496B (en) | A method of manufacturing a fibrous substrate incorporating an elongate element | |
DE60317235D1 (de) | Elektronisches wörterbuch mit beispielsätze | |
FR2875927B1 (fr) | Procede de protection d'une puce electronique, puce electronique autoprotegee et procede de fabrication de la puce |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |
Effective date: 20100630 |