FR2858167B1 - Procede d'assemblage par montage en surface d'au moins un composant englobant un substrat, support et composant englobant correspondants - Google Patents

Procede d'assemblage par montage en surface d'au moins un composant englobant un substrat, support et composant englobant correspondants

Info

Publication number
FR2858167B1
FR2858167B1 FR0309186A FR0309186A FR2858167B1 FR 2858167 B1 FR2858167 B1 FR 2858167B1 FR 0309186 A FR0309186 A FR 0309186A FR 0309186 A FR0309186 A FR 0309186A FR 2858167 B1 FR2858167 B1 FR 2858167B1
Authority
FR
France
Prior art keywords
component
support
mounting assembly
surface mounting
assembly method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0309186A
Other languages
English (en)
Other versions
FR2858167A1 (fr
Inventor
Audrey Scherpereel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sierra Wireless SA
Original Assignee
Wavecom SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wavecom SA filed Critical Wavecom SA
Priority to FR0309186A priority Critical patent/FR2858167B1/fr
Priority to PCT/FR2004/001938 priority patent/WO2005020647A2/fr
Publication of FR2858167A1 publication Critical patent/FR2858167A1/fr
Application granted granted Critical
Publication of FR2858167B1 publication Critical patent/FR2858167B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0165—Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
FR0309186A 2003-07-25 2003-07-25 Procede d'assemblage par montage en surface d'au moins un composant englobant un substrat, support et composant englobant correspondants Expired - Fee Related FR2858167B1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR0309186A FR2858167B1 (fr) 2003-07-25 2003-07-25 Procede d'assemblage par montage en surface d'au moins un composant englobant un substrat, support et composant englobant correspondants
PCT/FR2004/001938 WO2005020647A2 (fr) 2003-07-25 2004-07-21 Procede d’assemblage par montage en surface d’au moins un composant englobant un substrat, support et composant englobant correspondants

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0309186A FR2858167B1 (fr) 2003-07-25 2003-07-25 Procede d'assemblage par montage en surface d'au moins un composant englobant un substrat, support et composant englobant correspondants

Publications (2)

Publication Number Publication Date
FR2858167A1 FR2858167A1 (fr) 2005-01-28
FR2858167B1 true FR2858167B1 (fr) 2005-11-04

Family

ID=33561146

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0309186A Expired - Fee Related FR2858167B1 (fr) 2003-07-25 2003-07-25 Procede d'assemblage par montage en surface d'au moins un composant englobant un substrat, support et composant englobant correspondants

Country Status (2)

Country Link
FR (1) FR2858167B1 (fr)
WO (1) WO2005020647A2 (fr)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62247535A (ja) * 1986-04-18 1987-10-28 Fujitsu Ltd ハイブリツドｉｃの製造方法
US5133118A (en) * 1991-08-06 1992-07-28 Sheldahl, Inc. Surface mounted components on flex circuits
DE19600928A1 (de) * 1996-01-12 1997-07-24 Ibm Vorrichtung zur Handhabung von Leiterplatten und deren Herstellung
JPH1131893A (ja) * 1997-05-12 1999-02-02 Murata Mfg Co Ltd 電子部品の製造方法およびそれを用いた電子部品
JP3740804B2 (ja) * 1997-09-12 2006-02-01 松下電器産業株式会社 高周波ユニットの製造方法
JP3888263B2 (ja) * 2001-10-05 2007-02-28 株式会社村田製作所 積層セラミック電子部品の製造方法

Also Published As

Publication number Publication date
WO2005020647A2 (fr) 2005-03-03
FR2858167A1 (fr) 2005-01-28
WO2005020647A3 (fr) 2005-11-17

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20100331