WO2005020647A3 - Procede d’assemblage par montage en surface d’au moins un composant englobant un substrat, support et composant englobant correspondants - Google Patents

Procede d’assemblage par montage en surface d’au moins un composant englobant un substrat, support et composant englobant correspondants Download PDF

Info

Publication number
WO2005020647A3
WO2005020647A3 PCT/FR2004/001938 FR2004001938W WO2005020647A3 WO 2005020647 A3 WO2005020647 A3 WO 2005020647A3 FR 2004001938 W FR2004001938 W FR 2004001938W WO 2005020647 A3 WO2005020647 A3 WO 2005020647A3
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
component
integrating
assembling
placing
Prior art date
Application number
PCT/FR2004/001938
Other languages
English (en)
Other versions
WO2005020647A2 (fr
Inventor
Audrey Scherpereel
Original Assignee
Wavecom
Audrey Scherpereel
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wavecom, Audrey Scherpereel filed Critical Wavecom
Publication of WO2005020647A2 publication Critical patent/WO2005020647A2/fr
Publication of WO2005020647A3 publication Critical patent/WO2005020647A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0165—Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

L’invention concerne un procédé de montage d’un composant englobant sur un substrat d’un module de radiocommunication prévu pour recevoir au moins un composant monté en surface, le composant englobant présentant au moins une portion de surface parallèle à la surface du substrat (31, 32) et débordante par rapport à celle-ci et au moins une portion perpendiculaire (33) à la surface (31, 32) du substrat et venant au moins partiellement en appui (34) sur ledit substrat. Un tel procédé comprend les étapes suivantes : mise en place d’au moins un substrat sur un support prévu à cet effet ; dépôt de crème à braser sur chacun des substrats ; mise en place d’au moins un composant monté en surface sur chacun des substrats ; mise en place dudit composant englobant sur chacun des substrats ; refusion, de façon à solidariser simultanément, à chacun des substrats, le ou les composants en surface et le composant englobant.
PCT/FR2004/001938 2003-07-25 2004-07-21 Procede d’assemblage par montage en surface d’au moins un composant englobant un substrat, support et composant englobant correspondants WO2005020647A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR03/09186 2003-07-25
FR0309186A FR2858167B1 (fr) 2003-07-25 2003-07-25 Procede d'assemblage par montage en surface d'au moins un composant englobant un substrat, support et composant englobant correspondants

Publications (2)

Publication Number Publication Date
WO2005020647A2 WO2005020647A2 (fr) 2005-03-03
WO2005020647A3 true WO2005020647A3 (fr) 2005-11-17

Family

ID=33561146

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/FR2004/001938 WO2005020647A2 (fr) 2003-07-25 2004-07-21 Procede d’assemblage par montage en surface d’au moins un composant englobant un substrat, support et composant englobant correspondants

Country Status (2)

Country Link
FR (1) FR2858167B1 (fr)
WO (1) WO2005020647A2 (fr)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62247535A (ja) * 1986-04-18 1987-10-28 Fujitsu Ltd ハイブリツドｉｃの製造方法
US5133118A (en) * 1991-08-06 1992-07-28 Sheldahl, Inc. Surface mounted components on flex circuits
JPH1187971A (ja) * 1997-09-12 1999-03-30 Matsushita Electric Ind Co Ltd 高周波ユニットの製造方法
US6025998A (en) * 1997-05-12 2000-02-15 Murata Manufacturing Co., Ltd. Method for manufacturing electronic parts and electronic parts using the method
US6338194B1 (en) * 1996-01-12 2002-01-15 International Business Machines Corporation Method of making a circuitized substrate assembly with carrier having substrates therein
DE10245688A1 (de) * 2001-10-05 2003-04-30 Murata Mfg Co Ltd Nagaokakyo Mehrschichtkeramikelektronikteil, Elektronikteilaggregat und Verfahren zum Herstellen eines Mehrschichtkeramikelektronikteils

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62247535A (ja) * 1986-04-18 1987-10-28 Fujitsu Ltd ハイブリツドｉｃの製造方法
US5133118A (en) * 1991-08-06 1992-07-28 Sheldahl, Inc. Surface mounted components on flex circuits
US6338194B1 (en) * 1996-01-12 2002-01-15 International Business Machines Corporation Method of making a circuitized substrate assembly with carrier having substrates therein
US6025998A (en) * 1997-05-12 2000-02-15 Murata Manufacturing Co., Ltd. Method for manufacturing electronic parts and electronic parts using the method
JPH1187971A (ja) * 1997-09-12 1999-03-30 Matsushita Electric Ind Co Ltd 高周波ユニットの製造方法
DE10245688A1 (de) * 2001-10-05 2003-04-30 Murata Mfg Co Ltd Nagaokakyo Mehrschichtkeramikelektronikteil, Elektronikteilaggregat und Verfahren zum Herstellen eines Mehrschichtkeramikelektronikteils

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 012, no. 118 (E - 600) 13 April 1988 (1988-04-13) *
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 08 30 June 1999 (1999-06-30) *

Also Published As

Publication number Publication date
WO2005020647A2 (fr) 2005-03-03
FR2858167A1 (fr) 2005-01-28
FR2858167B1 (fr) 2005-11-04

Similar Documents

Publication Publication Date Title
AU2003303968A1 (en) An interconnection device for a printed circuit board, a method of manufacturing the same, and an interconnection assembly having the same
TWI318854B (en) Method for mounting chip component and circuit board
MY153233A (en) Methods and devices for fabricating and assembling printable semiconductor elements
WO2002077918A3 (fr) Procede de production d'une carte a puce sans contact et carte a puce ainsi produite
WO2005069430A3 (fr) Plaquette de circuits imprimes et procede de fixation de microcircuits a un circuit imprime
JP2004063787A5 (fr)
WO2005115072A3 (fr) Support a elements spheriques a braser et procede pour equiper des substrats de contacts spheriques
EP1737286A3 (fr) Module électronique hermétique à plusieurs circuits sans moyen de fixation, méthode de fabrication
WO2005039254A3 (fr) Appareil a circuit electrique, et procede d'assemblage
FI98899B (fi) Menetelmä elektroniikan komponenttien liittämiseksi juottamalla
EP1367875A4 (fr) Pastille de carte de circuit imprime, procede de fabrication de la carte de circuit imprime et procede de montage de ladite carte
TW200727758A (en) Soldered package, manufacturing method of same, and utilization of same
EP1381151A4 (fr) Oscillateur piezoelectrique et procede de fabrication
WO2007054868A3 (fr) Assemblage d'elements d'eclairage sur un substrat
PT1559068E (pt) Módulo electrónico compreendendo um elemento visível numa das faces e método de fabrico do mesmo
EP1729554A3 (fr) Méthode de soudure, composant électronique, et méthode d'échange de composants
WO2005038986A3 (fr) Systeme de circuit electrique et procedes d'assemblage correspondants
WO2004073013A3 (fr) Composant electronique dote d'une puce a semi-conducteurs, notamment module de puissance haute frequence et procede de fabrication associe
AU2003261859A1 (en) Electronic component burning jig
TW200742512A (en) Soldered package, manufacturing method of the same, and utilization of the same
AU2002357592A1 (en) Flip-chip mounting electronic component and method for producing the same, circuit board and method for producing the same, method for producing package
WO2007119206A3 (fr) Procédé pour fabriquer un assemblage électronique; assemblage électronique, couvercle et substrat
WO2005020647A3 (fr) Procede d’assemblage par montage en surface d’au moins un composant englobant un substrat, support et composant englobant correspondants
AU4625399A (en) Method for brazing by solder reflow electronic components and brazing device therefor
WO2004047510A3 (fr) Procede de soutien de composants electroniques, et dispositif electronique a soutien elastique pour composant electronique

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): BW GH GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
122 Ep: pct application non-entry in european phase