FR2854759A1 - Module de radiocommunication realise sur un substrat de superficie superieure a celle de son boitier d'encapsulation, plateforme et dispositif de radiocommunication correspondants - Google Patents

Module de radiocommunication realise sur un substrat de superficie superieure a celle de son boitier d'encapsulation, plateforme et dispositif de radiocommunication correspondants

Info

Publication number
FR2854759A1
FR2854759A1 FR0305535A FR0305535A FR2854759A1 FR 2854759 A1 FR2854759 A1 FR 2854759A1 FR 0305535 A FR0305535 A FR 0305535A FR 0305535 A FR0305535 A FR 0305535A FR 2854759 A1 FR2854759 A1 FR 2854759A1
Authority
FR
France
Prior art keywords
substrate
radiocommunication
circuit board
platform
encapsulation box
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR0305535A
Other languages
English (en)
Other versions
FR2854759B1 (fr
Inventor
Bachir Kordjani
Charles Mevaa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sierra Wireless SA
Original Assignee
Wavecom SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wavecom SA filed Critical Wavecom SA
Priority to FR0305535A priority Critical patent/FR2854759B1/fr
Priority to PCT/FR2004/001105 priority patent/WO2004100626A2/fr
Publication of FR2854759A1 publication Critical patent/FR2854759A1/fr
Application granted granted Critical
Publication of FR2854759B1 publication Critical patent/FR2854759B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0652—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next and on each other, i.e. mixed assemblies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Transceivers (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Tests Of Electronic Circuits (AREA)

Abstract

L'invention concerne un module de radiocommunication regroupant dans un boîtier d'encapsulation (12) un ensemble de composants (121, 122) rapportés sur un substrat (11), ledit substrat (11) étant équipé de moyens (14) pour le rapporter sur une carte de circuit imprimé, ledit substrat présentant une superficie supérieure à celle définie par ledit boîtier (12) et portant un ensemble de pistes et/ou de points d'accès, de façon à définir une plage d'accueil pour recevoir au moins un autre composant (31, 32, 33) et/ou permettre le test dudit boîtier, ledit substrat portant des moyens de report (14) sur une carte de circuit imprimé, de façon que ledit substrat permette également l'interconnexion avec ladite carte de circuit imprimé.
FR0305535A 2003-05-06 2003-05-06 Module de radiocommunication realise sur un substrat de superficie superieure a celle de son boitier d'encapsulation, plateforme et dispositif de radiocommunication correspondants Expired - Fee Related FR2854759B1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR0305535A FR2854759B1 (fr) 2003-05-06 2003-05-06 Module de radiocommunication realise sur un substrat de superficie superieure a celle de son boitier d'encapsulation, plateforme et dispositif de radiocommunication correspondants
PCT/FR2004/001105 WO2004100626A2 (fr) 2003-05-06 2004-05-06 Module de radiocommunication realise sur un substrat de superficie superieure a celle de son boitier d'encapsulation, plateforme et dispositif de radiocommunication correspondants

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0305535A FR2854759B1 (fr) 2003-05-06 2003-05-06 Module de radiocommunication realise sur un substrat de superficie superieure a celle de son boitier d'encapsulation, plateforme et dispositif de radiocommunication correspondants

Publications (2)

Publication Number Publication Date
FR2854759A1 true FR2854759A1 (fr) 2004-11-12
FR2854759B1 FR2854759B1 (fr) 2005-07-08

Family

ID=33306199

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0305535A Expired - Fee Related FR2854759B1 (fr) 2003-05-06 2003-05-06 Module de radiocommunication realise sur un substrat de superficie superieure a celle de son boitier d'encapsulation, plateforme et dispositif de radiocommunication correspondants

Country Status (2)

Country Link
FR (1) FR2854759B1 (fr)
WO (1) WO2004100626A2 (fr)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0281900A2 (fr) * 1987-03-11 1988-09-14 International Business Machines Corporation Système de fixage amovible et procédé pour le montage d'un support à film flexible pour puce semi-conductrice sur un substrat de circuit
US5729433A (en) * 1996-01-30 1998-03-17 Micromodule Systems, Inc. Multiple chip module assembly for top of mother board
EP1111676A2 (fr) * 1999-12-22 2001-06-27 Shinko Electric Industries Co. Ltd. Substrat à interconnexion pour unité d'un dispositif electronique
WO2001056347A1 (fr) * 2000-01-31 2001-08-02 Wavecom Module de radiocommunication se presentant sous la forme d'un macro composant electronique, structure d'interposition et procede de report sur une carte-mere correspondants
US6410983B1 (en) * 1999-05-26 2002-06-25 Fujitsu Limited Semiconductor device having a plurality of multi-chip modules interconnected by a wiring board having an interface LSI chip
US6618267B1 (en) * 1998-09-22 2003-09-09 International Business Machines Corporation Multi-level electronic package and method for making same

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5014160A (en) * 1989-07-05 1991-05-07 Digital Equipment Corporation EMI/RFI shielding method and apparatus
US5160807A (en) * 1991-08-08 1992-11-03 Elsag International B.V. Method for RFI/EMI protection of electronic circuitry
US5252782A (en) * 1992-06-29 1993-10-12 E-Systems, Inc. Apparatus for providing RFI/EMI isolation between adjacent circuit areas on a single circuit board
US5621363A (en) * 1994-10-03 1997-04-15 Motorola, Inc. Modem having an electromagnetic shield for a controller
US6137689A (en) * 1998-05-28 2000-10-24 3Com Corporation Protective enclosure apparatus and method

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0281900A2 (fr) * 1987-03-11 1988-09-14 International Business Machines Corporation Système de fixage amovible et procédé pour le montage d'un support à film flexible pour puce semi-conductrice sur un substrat de circuit
US5729433A (en) * 1996-01-30 1998-03-17 Micromodule Systems, Inc. Multiple chip module assembly for top of mother board
US6618267B1 (en) * 1998-09-22 2003-09-09 International Business Machines Corporation Multi-level electronic package and method for making same
US6410983B1 (en) * 1999-05-26 2002-06-25 Fujitsu Limited Semiconductor device having a plurality of multi-chip modules interconnected by a wiring board having an interface LSI chip
EP1111676A2 (fr) * 1999-12-22 2001-06-27 Shinko Electric Industries Co. Ltd. Substrat à interconnexion pour unité d'un dispositif electronique
WO2001056347A1 (fr) * 2000-01-31 2001-08-02 Wavecom Module de radiocommunication se presentant sous la forme d'un macro composant electronique, structure d'interposition et procede de report sur une carte-mere correspondants

Also Published As

Publication number Publication date
FR2854759B1 (fr) 2005-07-08
WO2004100626A2 (fr) 2004-11-18
WO2004100626A3 (fr) 2005-02-17

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Effective date: 20100129