FR2851406B1 - Dispositif electronique a circuits imprimes tridimensionnels - Google Patents
Dispositif electronique a circuits imprimes tridimensionnelsInfo
- Publication number
- FR2851406B1 FR2851406B1 FR0301733A FR0301733A FR2851406B1 FR 2851406 B1 FR2851406 B1 FR 2851406B1 FR 0301733 A FR0301733 A FR 0301733A FR 0301733 A FR0301733 A FR 0301733A FR 2851406 B1 FR2851406 B1 FR 2851406B1
- Authority
- FR
- France
- Prior art keywords
- electronic device
- printed circuits
- dimensional printed
- dimensional
- circuits
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0301733A FR2851406B1 (fr) | 2003-02-13 | 2003-02-13 | Dispositif electronique a circuits imprimes tridimensionnels |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0301733A FR2851406B1 (fr) | 2003-02-13 | 2003-02-13 | Dispositif electronique a circuits imprimes tridimensionnels |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2851406A1 FR2851406A1 (fr) | 2004-08-20 |
FR2851406B1 true FR2851406B1 (fr) | 2005-06-24 |
Family
ID=32749547
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0301733A Expired - Fee Related FR2851406B1 (fr) | 2003-02-13 | 2003-02-13 | Dispositif electronique a circuits imprimes tridimensionnels |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2851406B1 (fr) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102005041640A1 (de) * | 2005-08-29 | 2007-03-15 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Modulares mikroelektronisches Bauteil |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3614541A (en) * | 1969-04-08 | 1971-10-19 | North American Rockwell | Package for an electronic assembly |
US4502098A (en) * | 1981-02-10 | 1985-02-26 | Brown David F | Circuit assembly |
US4758459A (en) * | 1987-01-28 | 1988-07-19 | Northern Telecom Limited | Molded circuit board |
JP2936833B2 (ja) * | 1991-10-02 | 1999-08-23 | 株式会社村田製作所 | 表面実装型電子部品 |
-
2003
- 2003-02-13 FR FR0301733A patent/FR2851406B1/fr not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
FR2851406A1 (fr) | 2004-08-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
TP | Transmission of property | ||
ST | Notification of lapse |
Effective date: 20121031 |