FR2827079B1 - Procede pour la realisation d'un substrat diamant et substrat diamant obtenu par un tel procede - Google Patents
Procede pour la realisation d'un substrat diamant et substrat diamant obtenu par un tel procedeInfo
- Publication number
- FR2827079B1 FR2827079B1 FR0108860A FR0108860A FR2827079B1 FR 2827079 B1 FR2827079 B1 FR 2827079B1 FR 0108860 A FR0108860 A FR 0108860A FR 0108860 A FR0108860 A FR 0108860A FR 2827079 B1 FR2827079 B1 FR 2827079B1
- Authority
- FR
- France
- Prior art keywords
- diamond substrate
- producing
- substrate obtained
- diamond
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/26—Deposition of carbon only
- C23C16/27—Diamond only
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/01—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes on temporary substrates, e.g. substrates subsequently removed by etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3732—Diamonds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0108860A FR2827079B1 (fr) | 2001-07-04 | 2001-07-04 | Procede pour la realisation d'un substrat diamant et substrat diamant obtenu par un tel procede |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0108860A FR2827079B1 (fr) | 2001-07-04 | 2001-07-04 | Procede pour la realisation d'un substrat diamant et substrat diamant obtenu par un tel procede |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2827079A1 FR2827079A1 (fr) | 2003-01-10 |
FR2827079B1 true FR2827079B1 (fr) | 2004-05-28 |
Family
ID=8865110
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0108860A Expired - Fee Related FR2827079B1 (fr) | 2001-07-04 | 2001-07-04 | Procede pour la realisation d'un substrat diamant et substrat diamant obtenu par un tel procede |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2827079B1 (fr) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2056345A1 (fr) * | 2007-11-02 | 2009-05-06 | Plansee Se | Module d'abaissement de la chaleur pour composants électroniques ou circuits, ainsi que son procédé de fabrication |
GB201621690D0 (en) * | 2016-12-20 | 2017-02-01 | Element Six Tech Ltd | A heat sink comprising synthetic diamond material |
CN113725075B (zh) * | 2021-07-13 | 2024-01-09 | 西安电子科技大学芜湖研究院 | 一种金刚石混合终端表面电导的制备方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5130111A (en) * | 1989-08-25 | 1992-07-14 | Wayne State University, Board Of Governors | Synthetic diamond articles and their method of manufacture |
CA2034440A1 (fr) * | 1990-02-13 | 1991-08-14 | Thomas R. Anthony | Pieces diamantees par dcpv et methode de fabrication |
US5146314A (en) * | 1990-03-09 | 1992-09-08 | The University Of Colorado Foundation, Inc. | Apparatus for semiconductor circuit chip cooling using a diamond layer |
US5785754A (en) * | 1994-11-30 | 1998-07-28 | Sumitomo Electric Industries, Ltd. | Substrate, semiconductor device, element-mounted device and preparation of substrate |
DE19514548C1 (de) * | 1995-04-20 | 1996-10-02 | Daimler Benz Ag | Verfahren zur Herstellung einer Mikrokühleinrichtung |
JP4048579B2 (ja) * | 1997-08-28 | 2008-02-20 | 住友電気工業株式会社 | 冷媒流路を含む熱消散体とその製造方法 |
-
2001
- 2001-07-04 FR FR0108860A patent/FR2827079B1/fr not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
FR2827079A1 (fr) | 2003-01-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
CA | Change of address | ||
TP | Transmission of property |
Owner name: ALSTOM TRANSPORT TECHNOLOGIES SAS, FR Effective date: 20150818 |
|
PLFP | Fee payment |
Year of fee payment: 16 |
|
PLFP | Fee payment |
Year of fee payment: 17 |
|
CA | Change of address |
Effective date: 20180103 |
|
PLFP | Fee payment |
Year of fee payment: 18 |
|
PLFP | Fee payment |
Year of fee payment: 19 |
|
ST | Notification of lapse |
Effective date: 20210305 |