FR2819104B1 - Boitier semi-conducteur optique a support transparent - Google Patents

Boitier semi-conducteur optique a support transparent

Info

Publication number
FR2819104B1
FR2819104B1 FR0017266A FR0017266A FR2819104B1 FR 2819104 B1 FR2819104 B1 FR 2819104B1 FR 0017266 A FR0017266 A FR 0017266A FR 0017266 A FR0017266 A FR 0017266A FR 2819104 B1 FR2819104 B1 FR 2819104B1
Authority
FR
France
Prior art keywords
semiconductor package
optical semiconductor
transparent support
transparent
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0017266A
Other languages
English (en)
Other versions
FR2819104A1 (fr
Inventor
Patrick Daniel Perillat
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics SA
Original Assignee
STMicroelectronics SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics SA filed Critical STMicroelectronics SA
Priority to FR0017266A priority Critical patent/FR2819104B1/fr
Priority to EP01990609A priority patent/EP1346418A1/fr
Priority to PCT/FR2001/004144 priority patent/WO2002054498A1/fr
Priority to JP2002554886A priority patent/JP2004517487A/ja
Priority to US10/451,175 priority patent/US20040046169A1/en
Publication of FR2819104A1 publication Critical patent/FR2819104A1/fr
Application granted granted Critical
Publication of FR2819104B1 publication Critical patent/FR2819104B1/fr
Priority to US12/167,055 priority patent/US20080296572A1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Light Receiving Elements (AREA)
  • Wire Bonding (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
FR0017266A 2000-12-29 2000-12-29 Boitier semi-conducteur optique a support transparent Expired - Fee Related FR2819104B1 (fr)

Priority Applications (6)

Application Number Priority Date Filing Date Title
FR0017266A FR2819104B1 (fr) 2000-12-29 2000-12-29 Boitier semi-conducteur optique a support transparent
EP01990609A EP1346418A1 (fr) 2000-12-29 2001-12-21 Dispositif semi-conducteur optique a support transparent
PCT/FR2001/004144 WO2002054498A1 (fr) 2000-12-29 2001-12-21 Dispositif semi-conducteur optique a support transparent
JP2002554886A JP2004517487A (ja) 2000-12-29 2001-12-21 光半導体デバイス
US10/451,175 US20040046169A1 (en) 2000-12-29 2001-12-21 Optical semiconductor device with transparent support
US12/167,055 US20080296572A1 (en) 2000-12-29 2008-07-02 Optical semiconductor device with sealing spacer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0017266A FR2819104B1 (fr) 2000-12-29 2000-12-29 Boitier semi-conducteur optique a support transparent

Publications (2)

Publication Number Publication Date
FR2819104A1 FR2819104A1 (fr) 2002-07-05
FR2819104B1 true FR2819104B1 (fr) 2003-11-07

Family

ID=8858382

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0017266A Expired - Fee Related FR2819104B1 (fr) 2000-12-29 2000-12-29 Boitier semi-conducteur optique a support transparent

Country Status (5)

Country Link
US (1) US20040046169A1 (fr)
EP (1) EP1346418A1 (fr)
JP (1) JP2004517487A (fr)
FR (1) FR2819104B1 (fr)
WO (1) WO2002054498A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2465014C2 (ru) * 2007-05-01 2012-10-27 Блю Лагун Перлс Пти Лтд Композиция для обработки воды
JP2011091174A (ja) * 2009-10-21 2011-05-06 Tong Hsing Electronic Industries Ltd 薄型光電素子パッケージ

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3757127A (en) * 1970-08-10 1973-09-04 Cogar Corp Photodetector packing assembly
JPS5873153A (ja) * 1981-10-26 1983-05-02 Fujitsu Ltd 半導体集積回路装置
JPH06105791B2 (ja) * 1986-02-18 1994-12-21 セイコー電子工業株式会社 光電変換装置
DE68926448T2 (de) * 1988-10-14 1996-12-12 Matsushita Electric Ind Co Ltd Bildsensor und verfahren zu dessen herstellung
KR960001345B1 (ko) * 1992-08-28 1996-01-26 금성일렉트론주식회사 글래스 리드 탑재형 반도체 장치
DE19643911A1 (de) * 1996-10-30 1998-05-07 Sick Ag Schaltungsanordnung mit auf einem mit Leiterbahnen versehenen Substrat angebrachten optoelektronischen Bauelementen
US5969461A (en) * 1998-04-08 1999-10-19 Cts Corporation Surface acoustic wave device package and method
US6130448A (en) * 1998-08-21 2000-10-10 Gentex Corporation Optical sensor package and method of making same
US6566745B1 (en) * 1999-03-29 2003-05-20 Imec Vzw Image sensor ball grid array package and the fabrication thereof
US6627864B1 (en) * 1999-11-22 2003-09-30 Amkor Technology, Inc. Thin image sensor package
KR100343432B1 (ko) * 2000-07-24 2002-07-11 한신혁 반도체 패키지 및 그 패키지 방법
FR2851374B1 (fr) * 2003-02-18 2005-12-16 St Microelectronics Sa Boitier-semi-conducteur a puce de circuits integres portee par les pattes de connexion electrique
US7141782B2 (en) * 2004-05-24 2006-11-28 Exquisite Optical Technology, Ltd. Image sensor with protective package structure for sensing area

Also Published As

Publication number Publication date
FR2819104A1 (fr) 2002-07-05
JP2004517487A (ja) 2004-06-10
WO2002054498A1 (fr) 2002-07-11
EP1346418A1 (fr) 2003-09-24
US20040046169A1 (en) 2004-03-11

Similar Documents

Publication Publication Date Title
FR2835654B1 (fr) Boitier semi-conducteur optique a porte-lentille accouple
FR2824953B1 (fr) Boitier semi-conducteur optique a lentille incorporee et blindage
DE60101965D1 (de) Halbleiter-photodetektor mit horizontalem lichtzugang
NO20011464D0 (no) Optisk modul
DE60101418D1 (de) Halbleiterlaserdiodenmodul
DE60227586D1 (de) Integrierte optische Bauelemente
NO20021257D0 (no) Fiberoptisk sensorpakke
DE60227702D1 (de) Photochromischer optischer artikel
DE50013492D1 (de) Optische Anordnung
DE60143386D1 (de) Optischer abnehmer
DE60027949D1 (de) Optische Halbleitervorrichtung
DE60313777D1 (de) Optisches halbleiterbauelement
DE60216842D1 (de) Optisches Halbleitermodul
DE60307763D1 (de) Integrierter optischer Wellenleiter
DE60013039D1 (de) Lichtemittierende Halbleitervorrichtung
FR2814550B1 (fr) Traversee optique
FR2810416B1 (fr) Aiguilleur optique de grande capacite a base de modulateurs spatiaux de lumiere
FR2819893B1 (fr) Structure optique integree a birefringence reduite
DE60138359D1 (de) Optisches Modul
DE69933396D1 (de) Optische halbleitervorrichtung
FR2861852B1 (fr) Prouits optiques transparents polarisants ; fabrication
FR2808925B1 (fr) Detecteur optique bi-spectral
FR2819104B1 (fr) Boitier semi-conducteur optique a support transparent
FR2820593B1 (fr) Chemin optique
FR2792732B1 (fr) Cellule optique bichromatique

Legal Events

Date Code Title Description
ST Notification of lapse