FR2818443B1 - Procede de fabrication de detecteur matriciel infrarouge a eclairage par la face arriere - Google Patents

Procede de fabrication de detecteur matriciel infrarouge a eclairage par la face arriere

Info

Publication number
FR2818443B1
FR2818443B1 FR0016684A FR0016684A FR2818443B1 FR 2818443 B1 FR2818443 B1 FR 2818443B1 FR 0016684 A FR0016684 A FR 0016684A FR 0016684 A FR0016684 A FR 0016684A FR 2818443 B1 FR2818443 B1 FR 2818443B1
Authority
FR
France
Prior art keywords
lighting
rear panel
matrix detector
infrared matrix
manufacturing infrared
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0016684A
Other languages
English (en)
Other versions
FR2818443A1 (fr
Inventor
Angari Bernard Ruocco
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Societe Francaise de Detecteurs Infrarouges SOFRADIR SAS
Original Assignee
Sagem SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sagem SA filed Critical Sagem SA
Priority to FR0016684A priority Critical patent/FR2818443B1/fr
Publication of FR2818443A1 publication Critical patent/FR2818443A1/fr
Application granted granted Critical
Publication of FR2818443B1 publication Critical patent/FR2818443B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/1464—Back illuminated imager structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14643—Photodiode arrays; MOS imagers
    • H01L27/14649—Infrared imagers
    • H01L27/1465—Infrared imagers of the hybrid type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/1469—Assemblies, i.e. hybrid integration

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Light Receiving Elements (AREA)
FR0016684A 2000-12-20 2000-12-20 Procede de fabrication de detecteur matriciel infrarouge a eclairage par la face arriere Expired - Fee Related FR2818443B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR0016684A FR2818443B1 (fr) 2000-12-20 2000-12-20 Procede de fabrication de detecteur matriciel infrarouge a eclairage par la face arriere

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0016684A FR2818443B1 (fr) 2000-12-20 2000-12-20 Procede de fabrication de detecteur matriciel infrarouge a eclairage par la face arriere

Publications (2)

Publication Number Publication Date
FR2818443A1 FR2818443A1 (fr) 2002-06-21
FR2818443B1 true FR2818443B1 (fr) 2003-10-31

Family

ID=8857940

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0016684A Expired - Fee Related FR2818443B1 (fr) 2000-12-20 2000-12-20 Procede de fabrication de detecteur matriciel infrarouge a eclairage par la face arriere

Country Status (1)

Country Link
FR (1) FR2818443B1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114559369B (zh) * 2022-02-10 2023-06-23 中国电子科技集团公司第十一研究所 一种红外探测器背减薄的限位粘接模具

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4037311A (en) * 1976-07-14 1977-07-26 U.S. Philips Corporation Methods of manufacturing infra-red detector elements
JPS5773984A (en) * 1980-10-27 1982-05-08 Fujitsu Ltd Manufacture of photodetector
JPS58164261A (ja) * 1982-03-25 1983-09-29 Toshiba Corp 赤外線撮像装置の製造方法
JP2513055B2 (ja) * 1990-02-14 1996-07-03 日本電装株式会社 半導体装置の製造方法
US5227656A (en) * 1990-11-06 1993-07-13 Cincinnati Electronics Corporation Electro-optical detector array
JPH0947947A (ja) * 1994-08-30 1997-02-18 Seiko Seiki Co Ltd 研削装置、並びに研削方法、並びに半導体装置及び半導体基板の製造方法
JP3352896B2 (ja) * 1997-01-17 2002-12-03 信越半導体株式会社 貼り合わせ基板の作製方法

Also Published As

Publication number Publication date
FR2818443A1 (fr) 2002-06-21

Similar Documents

Publication Publication Date Title
DE69937509D1 (de) Mehrschichtige, dekorative Beleuchtung
NO20002722D0 (no) Elektronisk konfigurerbart tauet attrapp for utsendelse av infrarødtstrÕlende lysbluss
ID24790A (id) Proses untuk memfraksionasi dibutena
AU2003277541A1 (en) Process for fabricating light emitting device
ITTO20010341A0 (it) Sorgente di luce a matrice di microfilamenti.
AU4593899A (en) Continuous process for manufacturing thermoset decorative panels
AU2003284739A1 (en) A high shrinkage side by side type composite filament and a method for manufacturing the same
FR2799003B1 (fr) Detecteur de rayonnement utilisant un materiau composite et procede de fabrication de ce detecteur
FR2766616B1 (fr) Procede de fabrication de microstructures metalliques
FR2834922B1 (fr) Procede de fabrication d'un element structurel et element prevu par ledit procede
FR2536908B1 (fr) Procede de fabrication d'un detecteur infrarouge matriciel a eclairage par la face avant
FR2801650B1 (fr) Ensemble a boulon et agrafe de retenue, et son procede de fabrication
FR2792454B1 (fr) Procede de fabrication d'un panneau a plasma
DE60319735D1 (de) Beleuchtungssytem mit einer effizienteren kollektoroptik
FR2818443B1 (fr) Procede de fabrication de detecteur matriciel infrarouge a eclairage par la face arriere
FR2747895B1 (fr) Procede de fabrication de casque personnalise
FR2852146B1 (fr) Imageur x a conversion directe et son procede de fabrication
FR2845399B1 (fr) Zone d'affichage et procede permettant sa fabrication.
FR2847113B1 (fr) Procede de fabrication d'une structure de chauffage par rayonnement
NL193491B (nl) Fietsverlichtingssysteem met draadloos achterlicht.
ID23460A (id) Kaca berlapis pengendali sinar matahari
FR2748276B1 (fr) Procede de fabrication de stratifies faconnables a chaud
AU2003258657A1 (en) Lighting system comprising a device for adjusting the light intensity
FR2764169B1 (fr) Procede de fabrication de confiseries a motifs et confiseries a motifs obtenues par le procede
FR2818502B1 (fr) Procede de fabrication de dragees

Legal Events

Date Code Title Description
TP Transmission of property
TP Transmission of property

Owner name: SOFRADIR, FR

Effective date: 20131129

PLFP Fee payment

Year of fee payment: 16

PLFP Fee payment

Year of fee payment: 17

PLFP Fee payment

Year of fee payment: 18

ST Notification of lapse

Effective date: 20190906