FR2803702B1 - Ensemble de conversion de puissance electrique - Google Patents

Ensemble de conversion de puissance electrique

Info

Publication number
FR2803702B1
FR2803702B1 FR0102641A FR0102641A FR2803702B1 FR 2803702 B1 FR2803702 B1 FR 2803702B1 FR 0102641 A FR0102641 A FR 0102641A FR 0102641 A FR0102641 A FR 0102641A FR 2803702 B1 FR2803702 B1 FR 2803702B1
Authority
FR
France
Prior art keywords
electric power
power conversion
conversion assembly
assembly
electric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
FR0102641A
Other languages
English (en)
Other versions
FR2803702A1 (fr
Inventor
Toshinori Yamane
Hirotoshi Maekawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of FR2803702A1 publication Critical patent/FR2803702A1/fr
Application granted granted Critical
Publication of FR2803702B1 publication Critical patent/FR2803702B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00—Details of apparatus for conversion
    • H02M1/14—Arrangements for reducing ripples from dc input or output
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H01L2924/13055—Insulated gate bipolar transistor [IGBT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Inverter Devices (AREA)
FR0102641A 1999-05-18 2001-02-27 Ensemble de conversion de puissance electrique Expired - Lifetime FR2803702B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13732699A JP3502566B2 (ja) 1999-05-18 1999-05-18 電力変換装置

Publications (2)

Publication Number Publication Date
FR2803702A1 FR2803702A1 (fr) 2001-07-13
FR2803702B1 true FR2803702B1 (fr) 2005-04-22

Family

ID=15196068

Family Applications (2)

Application Number Title Priority Date Filing Date
FR9914715A Expired - Lifetime FR2793967B1 (fr) 1999-05-18 1999-11-23 Ensemble de conversion de puissance electrique
FR0102641A Expired - Lifetime FR2803702B1 (fr) 1999-05-18 2001-02-27 Ensemble de conversion de puissance electrique

Family Applications Before (1)

Application Number Title Priority Date Filing Date
FR9914715A Expired - Lifetime FR2793967B1 (fr) 1999-05-18 1999-11-23 Ensemble de conversion de puissance electrique

Country Status (4)

Country Link
US (1) US6115270A (fr)
JP (1) JP3502566B2 (fr)
DE (1) DE19955570B4 (fr)
FR (2) FR2793967B1 (fr)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3484122B2 (ja) * 2000-01-13 2004-01-06 三菱電機株式会社 電力変換装置
US6650559B1 (en) * 2000-10-31 2003-11-18 Fuji Electric Co., Ltd. Power converting device
JP3997730B2 (ja) * 2001-06-20 2007-10-24 株式会社日立製作所 電力変換装置及びそれを備えた移動体
US6735968B2 (en) * 2002-03-29 2004-05-18 Hitachi, Ltd. Refrigerating apparatus and an inverter device used therein
US6967416B2 (en) * 2002-07-11 2005-11-22 International Business Machines Corporation Shared on-chip decoupling capacitor and heat-sink devices
US6885553B2 (en) * 2002-09-27 2005-04-26 Rockwell Automation Technologies, Inc. Bus bar assembly for use with a compact power conversion assembly
US6804127B2 (en) * 2002-11-19 2004-10-12 Wilcon Inc. Reduced capacitance AC/DC/AC power converter
US20040227476A1 (en) * 2002-12-19 2004-11-18 International Rectifier Corp. Flexible inverter power module for motor drives
US7180726B2 (en) * 2003-11-07 2007-02-20 Maxwell Technologies, Inc. Self-supporting capacitor structure
US7203056B2 (en) * 2003-11-07 2007-04-10 Maxwell Technologies, Inc. Thermal interconnection for capacitor systems
DE102004018469B3 (de) * 2004-04-16 2005-10-06 eupec Europäische Gesellschaft für Leistungshalbleiter mbH Leistungshalbleiterschaltung
US7440258B2 (en) 2005-03-14 2008-10-21 Maxwell Technologies, Inc. Thermal interconnects for coupling energy storage devices
US7643319B2 (en) * 2007-06-22 2010-01-05 General Electric Company 7-level wye-connected H-bridge converter topology for powering a high-speed electric motor
JP2009127523A (ja) * 2007-11-22 2009-06-11 Mitsubishi Heavy Ind Ltd インバータ一体型電動圧縮機
JP2010178494A (ja) * 2009-01-29 2010-08-12 Toshiba Corp スイッチング素子モジュールおよびこれを用いたインバータ装置
JP5839769B2 (ja) 2009-03-06 2016-01-06 三菱重工業株式会社 インバータモジュールおよびインバータ一体型電動圧縮機
GB0906020D0 (en) * 2009-04-07 2009-05-20 Trw Ltd Motor drive circuitry
JP5099243B2 (ja) 2010-04-14 2012-12-19 株式会社デンソー 半導体モジュール
US8415910B2 (en) * 2010-09-20 2013-04-09 Remy Technologies, L.L.C. Switch module for an electric machine having switchable stator windings
JP2014128045A (ja) * 2012-12-25 2014-07-07 Panasonic Corp モータ駆動装置およびそれを備えた電気機器
JP6152723B2 (ja) * 2013-07-09 2017-06-28 日産自動車株式会社 電力変換装置
JP6187197B2 (ja) * 2013-11-29 2017-08-30 ダイキン工業株式会社 電力変換装置
JP6217369B2 (ja) * 2013-12-10 2017-10-25 株式会社デンソー モータ制御装置及びモータ制御方法
US20160172997A1 (en) * 2014-12-11 2016-06-16 Caterpillar Inc. Modular power conversion platform
JP7303087B2 (ja) * 2019-10-15 2023-07-04 ファナック株式会社 平滑コンデンサ部及びスナバコンデンサを有するモータ駆動装置
JP7410544B2 (ja) 2019-10-17 2024-01-10 サカセ・アドテック株式会社 折り畳みブーム
JP7424125B2 (ja) * 2020-03-12 2024-01-30 ニデック株式会社 インバータ装置

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4725768A (en) * 1985-11-12 1988-02-16 Toko Kabushiki Kaisha Switching regulated power supply employing an elongated metallic conductive inductor having a magnetic thin film coating
US4673851A (en) * 1986-03-31 1987-06-16 General Motors Corporation PWM motor operating system with RFI suppression
US4829432A (en) * 1987-12-28 1989-05-09 Eastman Kodak Company Apparatus for shielding an electrical circuit from electromagnetic interference
EP0356991B1 (fr) * 1988-08-31 1995-01-11 Hitachi, Ltd. Dispositif onduleur
US4965710A (en) * 1989-11-16 1990-10-23 International Rectifier Corporation Insulated gate bipolar transistor power module
US5365424A (en) * 1991-07-10 1994-11-15 Kenetech Windpower, Inc. High power laminated bus assembly for an electrical switching converter
US5142439A (en) * 1991-08-28 1992-08-25 Allied-Signal Inc. Integrated bus bar/multilayer ceramic capacitor module
JP2809026B2 (ja) * 1992-09-30 1998-10-08 三菱電機株式会社 インバ−タ装置およびインバ−タ装置の使用方法
JP2781329B2 (ja) * 1992-10-21 1998-07-30 三菱電機株式会社 半導体パワーモジュールおよびその製造方法
JPH07322601A (ja) * 1994-05-23 1995-12-08 Hitachi Ltd スイッチング・レギュレータ
US5517397A (en) * 1994-12-06 1996-05-14 Astec International, Ltd. Flyback power converter with spike compensator circuit
US5661390A (en) * 1995-06-23 1997-08-26 Electric Power Research Institute, Inc. Inverter-fed motor drive with EMI suppression
AU3250397A (en) * 1996-07-22 1998-02-10 Hydro-Quebec Low stray interconnection inductance power converting module for converting a dc voltage into an ac voltage, and a method therefor
US5838551A (en) * 1996-08-01 1998-11-17 Northern Telecom Limited Electronic package carrying an electronic component and assembly of mother board and electronic package
JPH10304680A (ja) * 1997-04-25 1998-11-13 Toyota Motor Corp 電力変換装置
DE19717550A1 (de) * 1997-04-25 1998-10-29 Abb Daimler Benz Transp Flaches Stromschienenpaket für ein Stromrichtergerät

Also Published As

Publication number Publication date
DE19955570A1 (de) 2000-11-23
US6115270A (en) 2000-09-05
FR2803702A1 (fr) 2001-07-13
JP3502566B2 (ja) 2004-03-02
JP2000333476A (ja) 2000-11-30
FR2793967A1 (fr) 2000-11-24
FR2793967B1 (fr) 2001-11-23
DE19955570B4 (de) 2015-02-19

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