FR2794443B1 - Procede de transfert d'elements et dispositif permettant ledit transfert - Google Patents
Procede de transfert d'elements et dispositif permettant ledit transfertInfo
- Publication number
- FR2794443B1 FR2794443B1 FR9906951A FR9906951A FR2794443B1 FR 2794443 B1 FR2794443 B1 FR 2794443B1 FR 9906951 A FR9906951 A FR 9906951A FR 9906951 A FR9906951 A FR 9906951A FR 2794443 B1 FR2794443 B1 FR 2794443B1
- Authority
- FR
- France
- Prior art keywords
- transferring elements
- providing same
- providing
- same
- transferring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Apparatus Associated With Microorganisms And Enzymes (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9906951A FR2794443B1 (fr) | 1999-06-02 | 1999-06-02 | Procede de transfert d'elements et dispositif permettant ledit transfert |
PCT/FR2000/001507 WO2000075968A1 (fr) | 1999-06-02 | 2000-05-31 | Procede de transfert d'elements et dispositif permettant ledit transfert |
EP00938871A EP1183714A1 (de) | 1999-06-02 | 2000-05-31 | Verfahren und vorrichtung zur übertragung von elementen |
JP2001502148A JP2003501827A (ja) | 1999-06-02 | 2000-05-31 | 要素を移送するための方法およびそのような移送を可能とするための装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9906951A FR2794443B1 (fr) | 1999-06-02 | 1999-06-02 | Procede de transfert d'elements et dispositif permettant ledit transfert |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2794443A1 FR2794443A1 (fr) | 2000-12-08 |
FR2794443B1 true FR2794443B1 (fr) | 2001-06-22 |
Family
ID=9546278
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9906951A Expired - Fee Related FR2794443B1 (fr) | 1999-06-02 | 1999-06-02 | Procede de transfert d'elements et dispositif permettant ledit transfert |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP1183714A1 (de) |
JP (1) | JP2003501827A (de) |
FR (1) | FR2794443B1 (de) |
WO (1) | WO2000075968A1 (de) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7045878B2 (en) | 2001-05-18 | 2006-05-16 | Reveo, Inc. | Selectively bonded thin film layer and substrate layer for processing of useful devices |
US7163826B2 (en) | 2001-09-12 | 2007-01-16 | Reveo, Inc | Method of fabricating multi layer devices on buried oxide layer substrates |
US6875671B2 (en) | 2001-09-12 | 2005-04-05 | Reveo, Inc. | Method of fabricating vertical integrated circuits |
DE102004027489B4 (de) * | 2004-06-04 | 2017-03-02 | Infineon Technologies Ag | Verfahren zum Anordnen von Chips eines ersten Substrats auf einem zweiten Substrat |
JP5740939B2 (ja) * | 2010-11-29 | 2015-07-01 | 住友電気工業株式会社 | 半導体装置の製造方法 |
US9308649B2 (en) | 2013-02-25 | 2016-04-12 | LuxVue Techonology Corporation | Mass transfer tool manipulator assembly |
CN105074899B (zh) | 2013-02-25 | 2017-06-09 | 苹果公司 | 质量转移工具操纵器组件和具有集成位移传感器的微型拾取阵列支座 |
CN109449102B (zh) * | 2018-11-09 | 2021-03-19 | 京东方科技集团股份有限公司 | 驱动基板的制作方法、驱动基板、显示面板及显示装置 |
KR102156263B1 (ko) * | 2019-02-27 | 2020-09-16 | 서울대학교산학협력단 | 전사장치 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5851530A (ja) * | 1981-09-22 | 1983-03-26 | Toshiba Corp | 半導体ペレツト配列装置および方法 |
JPS5984438A (ja) * | 1982-11-04 | 1984-05-16 | Nec Corp | シ−ト拡張装置 |
JPS6226833A (ja) * | 1985-07-26 | 1987-02-04 | Mitsubishi Electric Corp | ダイボンデング装置 |
JPS6323334A (ja) * | 1987-05-29 | 1988-01-30 | Sony Corp | 半導体素子処理方法 |
JPH03212940A (ja) * | 1990-01-17 | 1991-09-18 | Rohm Co Ltd | リードフレームに対する半導体チップの供給方法 |
-
1999
- 1999-06-02 FR FR9906951A patent/FR2794443B1/fr not_active Expired - Fee Related
-
2000
- 2000-05-31 JP JP2001502148A patent/JP2003501827A/ja not_active Withdrawn
- 2000-05-31 WO PCT/FR2000/001507 patent/WO2000075968A1/fr not_active Application Discontinuation
- 2000-05-31 EP EP00938871A patent/EP1183714A1/de not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
WO2000075968A1 (fr) | 2000-12-14 |
FR2794443A1 (fr) | 2000-12-08 |
JP2003501827A (ja) | 2003-01-14 |
EP1183714A1 (de) | 2002-03-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |
Effective date: 20060228 |