Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/67005—Apparatus not specifically provided for elsewhere
  • H01L21/67011—Apparatus for manufacture or treatment
  • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape

Definitions

• the invention relates to the field of transfer of elements from an emitting substrate to a receiving substrate. It relates to a transfer handle, to a transfer method using the handle according to the invention and to a method of manufacturing multifunction chips using handles according to the invention.
• the subject of the invention is a device and a method for the collective transfer of elements from an emitting substrate on which they are spaced apart. a first step in a first direction and a second step in a second direction, towards a receiving substrate, the elements being distributed on the receiving substrate with a second step in the first direction and a second step in the second direction.
• element By element is meant both a wafer, a chip or even a sub-chip, depending on the intended applications.
• wafer includes any monolayer or multilayer structure capable of comprising functional entities.
• a wafer may be subdivided into identical or different chips, each chip comprising one or more functional entities which can be grouped into identical or different sub-chips; the sub-chips can be separated.
• subchips are generally called studs.
• the invention allows, in particular, the production of chips comprising pads of different functions from chips comprising only single-function pads.
• the invention allows the transfer of both platelets from an emitting support to a receiving support, the transfer of chips from a wafer onto one or more wafers which may themselves include chips, or even the transfer of sub- chips, a chip on one or more chips.
• the invention applies in particular to collective hybridization, for example chip on chip.
• the elements of a substrate known as an emitting substrate, on which the chips or pads are organized in a network of steps di in a first axial direction X, and d 2 in a second axial direction Y are transferred collectively from the substrate emitter towards an intermediate substrate or handle comprising means of bringing together and / or of moving away.
• the approximation and / or distance means are actuated in the direction X and / or in the direction Y, until the new steps Di in the direction X and D 2 are obtained in the direction Y .
• the terminal transfer is made to the receiving substrate according to known methods.
• step Di is carried out for example by a first transfer from the emitting substrate to a first intermediate substrate comprising approximation and / or distance means, then when the approximation or the distance has been carried out for setting step Di, a new transfer is made to the second step D 2 , to a second intermediate substrate comprising means for bringing together and / or moving away.
• the invention relates to a handle for the transfer of elements arranged in line at a spacing di, or in a matrix network along the spacing di in a first direction X and a spacing d 2 in a second direction Y, the handle being provided with at least as many receiving surfaces as elements to be transferred arranged at a pitch di in the first direction and optionally a step d 2 in the second direction, handle characterized in that it comprises:
• the handle comprises an extensible membrane and the simple act of tensioning the membrane causes uniform spacing of the elements with respect to each other in the direction or directions of traction of the membrane.
• the handle includes an elastic membrane so that traction on the membrane allows the deposited elements to be separated. It is also possible using this membrane to bring the elements together uniformly. For that, it is enough to pretend the membrane before depositing the elements then to release the tension to obtain the approach.
• the receiving surfaces of the elements comprise supports each having an upper surface.
• the means of removal and / or reconciliation include elastic means connecting at least, in the first direction, two consecutive supports and means for applying traction on external supports, at least in the first direction.
• the traction means may comprise traction rods integral with each first and last support of a line of supports, movable in translation parallel to the columns.
• the receiving surfaces are capable of receiving a liquid. They are for example hollow or porous.
• Such handles can be used in particular to make multifunctional chips from single-function chips. It is assumed, for example, that the pads of a multifunction chip are distributed according to the same step di in a direction along an axis X and according to the same step d 2 along an axis Y.
• N multifunction chips for example arranged in a matrix according to n 3 columns and n 4 lines, each chip having n x columns and n 2 lines.
• the two steps of approaching or moving away in the directions X and Y respectively can be carried out successively or simultaneously.
• FIGS. 2, 3, 4, 5 and 6 illustrate a handle according to the invention and stages of its use for carrying out a transfer elements arranged on a first substrate in a first step towards a second substrate in a second step;
• FIG. 8 and 9 illustrate a second embodiment of a handle according to the invention
• FIG. 11 illustrates a second use of the handle and the method according to the invention. It includes parts A and B.
• Figure 1 illustrates the object of the invention. It is a question of ordering elements such as chips, sub-chips or pads 1 of a wafer which are ordered according to a first network in which a first step between two consecutive chips, (or if it is of pads of a chip, two consecutive pads) is di in a first direction and d 2 in a second direction, as shown in part A of the figure, according to a second pitch D x in the first direction and D 2 in the second direction as shown in part B.
• the elements to be transferred are materialized by squares which bear the reference 1.
• the first steps di and d 2 are smaller than the second steps Di and D 2 but the first steps could be larger than the second or one larger and the other smaller.
• the handle 20 comprises on a support plate 6 an extensible or elastic membrane 4 whose ends are equipped with traction means 5.
• the support plate 6 can be circular or rectangular. The edges of the plate have a shape without sharp edges, for example rounded, so as not to injure the membrane 4.
• the traction means 5 may have an annular shape allowing simultaneous traction in all directions or be made up of four parts, two parts arranged symmetrically to provide traction in the X direction and two parts arranged symmetrically to provide traction in the Y direction.
• FIG. 3 is shown the emitter substrate 2 and the chips 10 of the emitter substrate 2, in the position ready for transfer from the substrate 2 to the extensible or elastic membrane 4 of the handle 20.
• the chips 10 are transferred from the emitting substrate 2 to the receiving membrane 4, where they are received on the receiving surfaces 7 of the membrane 4, providing between them intermediate surfaces 8.
• the membrane 4 is then towed, so that it is agra ndie in the direction or directions of traction.
• the membrane 4 Due to the homogeneity of the membrane 4, it increases uniformly so that the chips 10 are distributed uniformly according to a new pitch D. If the membrane 4 is simply extensible without being elastic the dimension D is necessarily greater than the dimension d, on the other hand if the membrane 4 is elastic, it suffices to pretend it and then to let it contract after the transfer of the chips 10 onto the handle 20 to obtain a pitch D smaller than the initial pitch d. Obviously if the membrane 4 is elastic, it is also possible to obtain a greater pitch than the initial pitch by stretching the membrane 4 as in the case of the simply extensible membrane. When the chips 10 have been set to the desired pitch, they are transferred from the handle 20 to the receiving substrate 3, as shown in FIG. 5.
• FIG. 7 represents an enlarged view of the traction means 5 shown diagrammatically in FIGS. 3 to 5.
• This means is constituted for example by jaws 11, 12 between which the membrane 4 is inserted.
• a clamping means 13 jaws 11, 12, for example a screw collar allows the jaws 11, 12 to be brought together and tightened on the membrane 4 over the entire width of the membrane. Tightening over the entire width in a direction perpendicular to the direction of traction allows a uniform extension in the direction of traction. For a bidirectional extension another jaw is provided perpendicular to the second direction of traction.
• FIG. 8 schematically illustrates a second embodiment of a handle 30 according to the invention.
• the receiving surfaces 7 are individualized and of predetermined size.
• the receiving surfaces 7 are constituted by the upper surfaces of supports 15.
• the upper surface 7 of the support is able to contain a liquid, it is for example concave or comprises a porous medium.
• the supports 15 are formed in a matrix network in lines in the first direction and in columns in the second direction. Each line of supports comprises a first support, a last support and intermediate supports. In the first direction a support is separated from the support immediately following by an intermediate space 19.
• All the intermediate supports have in the first direction a face which is opposite the face of another support.
• the first and last supports of each line have a face perpendicular to the first direction which is not opposite another face of a support.
• each support column comprises a first support, a last support and intermediate supports. In the second direction a support is separated from the support immediately following by an intermediate space 21.
• All the intermediate supports have, in the second direction, a face which is opposite the face of another support.
• the first and last supports of each column has a face perpendicular to the second direction which is not opposite another face of a support.
• the external supports 15 of the handle 30 are mounted connected by traction rods 25, 24, oriented in the first direction, to first traction application means 27, 23 and 26, 22 respectively and by traction rods 35 , 34, oriented in the second direction to second traction application means 32, 36 and 33, 37 respectively.
• the first traction application means comprise traction bars 22, 23 perpendicular to the first direction placed on either side of all of the receiving surfaces.
• the pull rods 25, 24 link the external supports of each line to rings 27, 26 respectively slidably mounted on the pull bars 23, 22 respectively.
• the second traction application means comprise traction bars 32, 33 perpendicular to the second direction placed on either side of the set of receiving surfaces.
• Rods 35, 34 link the external supports of each column to rings 37, 36 respectively slidably mounted on the draw bars 33, 32 respectively.
• Figure 9 This figure shows the same handle 30 as that of Figure 8, in which the supports 15 have been spaced from each other. To simplify the representation, the supports have been shown smaller than in FIG. 8 and on a different scale than the other elements.
• FIG. 10 illustrates a first possible use of a handle 20, 30 according to the invention for hybridize chips 9 of a donor matrix 14 arranged in a step di, d 2 in the first and in the second direction respectively on chips 38 of a receiving matrix 39, arranged in a step Di, D 2 in the first and in the second direction respectively.
• the chips 9 are transferred to a handle 20 or 30 according to the invention.
• the handle is not shown in FIG. 10.
• the receiving surfaces are put in step Di, D 2 in the first and in the second direction respectively.
• the transfer onto the receiving matrix 39 is then carried out in order to obtain the hybridized matrix 40. It has thus been possible to hybridize AsGa chips of 1 mm * l mm ensuring radiofrequency functions (amplification, frequency change) on silicon chips of 8 mm * 10 mm providing all the logic and analog processing functions for the low and medium frequency radio signal.
• FIG. 11 Another use of the method and of handles 20, 30 according to the invention is illustrated in FIG. 11.
• Each biochip 41 is composed of studs 42 that are functionalized.
• each pad can carry one or a plurality of identical molecules (chemical or bio-chemical), called probes capable of selective hybridization reactions with target molecules brought into contact with the probes. These probes can for example be strands of DNA.
• part A shows a single-function chip 43 comprising 12 pads 42 distributed in matrix fashion in 3 columns and 4 lines.
• the studs 42 are assumed to be squares of dimension d. It will be explained below how with twelve of these single-function chips 43, each carrying pads 42 of different functionalities, it is possible to produce twelve multi-function chips 41 distributed matrically according to 3 columns and 4 lines, each chip comprising 6 columns and 2 lines.
• the pads 42 of the first of the single-function chips 43 are firstly transferred to a handle 20 or 30 according to the invention.
• the pads 42 are spaced from each other in the first direction by a distance equal to six times the distance d optionally increased by the width of a cutting path 44 provided on the terminal receiving substrate.
• the pads 42 are also spaced from each other in the second direction by a distance equal to twice the distance d optionally increased by the width of the cutting path 44 provided on the terminal receiving substrate.
• the pads 42 thus arranged are then transferred to a terminal receiving substrate 45 where they are in the configuration of the pads 42 shown in Figure 11B.
• the chips 41 can then be cut if necessary along the cutting path 44.
• each bio chip comprising 225 pads distributed in 15 rows and 15 columns, from 225 single-function matrices each comprising 900 identical pads of 200 * 200 ⁇ m distributed in 30 rows and 30 columns.
• the spacing to be made at the transfer handle is 3.1 mm in each direction, that is 15 * 200 ⁇ m + 100 ⁇ m for the cutting path.

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• Engineering & Computer Science (AREA)
• Physics & Mathematics (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• General Physics & Mathematics (AREA)
• Manufacturing & Machinery (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Power Engineering (AREA)
• Apparatus Associated With Microorganisms And Enzymes (AREA)

Applications Claiming Priority (3)

Publications (1)

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ID=9546278

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• 1999
  • 1999-06-02 FR FR9906951A patent/FR2794443B1/fr not_active Expired - Fee Related
• 2000
  • 2000-05-31 JP JP2001502148A patent/JP2003501827A/ja not_active Withdrawn
  • 2000-05-31 WO PCT/FR2000/001507 patent/WO2000075968A1/fr not_active Application Discontinuation
  • 2000-05-31 EP EP00938871A patent/EP1183714A1/de not_active Withdrawn

Non-Patent Citations (1)

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