FR2786117A1 - Forme de micropoint forme par faisceau laser et procede de marquage de micropoints - Google Patents

Forme de micropoint forme par faisceau laser et procede de marquage de micropoints Download PDF

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Publication number
FR2786117A1
FR2786117A1 FR9914856A FR9914856A FR2786117A1 FR 2786117 A1 FR2786117 A1 FR 2786117A1 FR 9914856 A FR9914856 A FR 9914856A FR 9914856 A FR9914856 A FR 9914856A FR 2786117 A1 FR2786117 A1 FR 2786117A1
Authority
FR
France
Prior art keywords
point
laser beam
marking
laser
shape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR9914856A
Other languages
English (en)
French (fr)
Inventor
Tciichirou Chiba
Ryuusuke Komura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Komatsu Ltd
Original Assignee
Komatsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Komatsu Ltd filed Critical Komatsu Ltd
Publication of FR2786117A1 publication Critical patent/FR2786117A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • B41M5/24—Ablative recording, e.g. by burning marks; Spark recording
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B44—DECORATIVE ARTS
    • B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
    • B44C1/00—Processes, not specifically provided for elsewhere, for producing decorative surface effects
    • B44C1/22—Removing surface-material, e.g. by engraving, by etching
    • B44C1/228—Removing surface-material, e.g. by engraving, by etching by laser radiation
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F3/00—Labels, tag tickets, or similar identification or indication means; Seals; Postage or like stamps
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F7/00—Signs, name or number plates, letters, numerals, or symbols; Panels or boards
    • G09F7/16—Letters, numerals, or other symbols adapted for permanent fixing to a support
    • G09F7/165—Letters, numerals, or other symbols adapted for permanent fixing to a support obtained by a treatment of the support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54406—Marks applied to semiconductor devices or parts comprising alphanumeric information
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54493—Peripheral marks on wafers, e.g. orientation flats, notches, lot number
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Laser Beam Processing (AREA)
  • Thermal Transfer Or Thermal Recording In General (AREA)
FR9914856A 1998-11-25 1999-11-25 Forme de micropoint forme par faisceau laser et procede de marquage de micropoints Withdrawn FR2786117A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33400998 1998-11-25

Publications (1)

Publication Number Publication Date
FR2786117A1 true FR2786117A1 (fr) 2000-05-26

Family

ID=18272483

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9914856A Withdrawn FR2786117A1 (fr) 1998-11-25 1999-11-25 Forme de micropoint forme par faisceau laser et procede de marquage de micropoints

Country Status (3)

Country Link
DE (1) DE19956107B4 (de)
FR (1) FR2786117A1 (de)
TW (1) TW430873B (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001101337A (ja) * 1999-07-26 2001-04-13 Komatsu Ltd ドットマークの読取り装置と読取り方法
DE10025835B4 (de) * 1999-11-22 2008-07-31 Komatsu Ltd. Mikropunktmarkierungsverfahren
JP2001223145A (ja) * 2000-02-07 2001-08-17 Komatsu Ltd 特異な形態のドットマークを有する半導体ウェハとそのドットマークの形成方法
DE10117210A1 (de) * 2001-04-06 2002-10-24 Lmb Automation Gmbh Verfahren zum Kennzeichnen von Metallgegenständen sowie Einrichtung
US6876377B2 (en) * 2001-11-07 2005-04-05 Fuji Photo Film Co., Ltd. Photosensitive material and laser marking method
DE10362099B4 (de) * 2003-06-30 2009-07-09 Paperlux Gmbh Sicherheitsmerkmal in Form eines dreidimensional wirkenden Bildes auf einem dünnen Substrat sowie Verfahren zu seinem Erzeugen
WO2019044148A1 (ja) * 2017-08-31 2019-03-07 日本電気硝子株式会社 支持ガラス基板及びこれを用いた積層基板
JP7276644B2 (ja) * 2017-08-31 2023-05-18 日本電気硝子株式会社 支持ガラス基板及びこれを用いた積層基板
EP3712717A1 (de) * 2019-03-19 2020-09-23 Comadur S.A. Methode zum markieren eines armbanduhrenglases mit einem saphir

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5984515A (ja) * 1982-11-08 1984-05-16 Toshiba Corp レ−ザ光による半導体基板へのマ−キング方法
DE3324551A1 (de) * 1983-07-07 1985-01-17 Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH, 8263 Burghausen Verfahren zur kennzeichnung von halbleiteroberflaechen durch laserstrahlung
JP2658351B2 (ja) * 1989-02-03 1997-09-30 日本電気株式会社 レーザマーキング装置
JPH02299216A (ja) * 1989-05-15 1990-12-11 Toshiba Corp 半導体装置
US5463200A (en) * 1993-02-11 1995-10-31 Lumonics Inc. Marking of a workpiece by light energy
US5768076A (en) * 1993-11-10 1998-06-16 International Business Machines Corporation Magnetic recording disk having a laser-textured surface
JP3189687B2 (ja) * 1996-06-17 2001-07-16 株式会社日立製作所 半導体材料表面への刻印方法及び同方法により刻印された物品
JPH11156563A (ja) * 1997-11-25 1999-06-15 Komatsu Ltd レーザ光による微小マーキング装置とそのマーキング方法

Also Published As

Publication number Publication date
TW430873B (en) 2001-04-21
DE19956107B4 (de) 2008-01-24
DE19956107A1 (de) 2000-05-31

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