FR2738672B1 - Procede pour amenager des chemins conducteurs a la surface d'un element semi-conducteur - Google Patents

Procede pour amenager des chemins conducteurs a la surface d'un element semi-conducteur

Info

Publication number
FR2738672B1
FR2738672B1 FR9610215A FR9610215A FR2738672B1 FR 2738672 B1 FR2738672 B1 FR 2738672B1 FR 9610215 A FR9610215 A FR 9610215A FR 9610215 A FR9610215 A FR 9610215A FR 2738672 B1 FR2738672 B1 FR 2738672B1
Authority
FR
France
Prior art keywords
semiconductor element
conductive paths
providing conductive
providing
paths
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9610215A
Other languages
English (en)
Other versions
FR2738672A1 (fr
Inventor
Carsten Roedel
Juergen Scheible
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of FR2738672A1 publication Critical patent/FR2738672A1/fr
Application granted granted Critical
Publication of FR2738672B1 publication Critical patent/FR2738672B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/528—Geometry or layout of the interconnection structure
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/30—Circuit design
    • G06F30/39—Circuit design at the physical level
    • G06F30/394—Routing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/926—Dummy metallization

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Geometry (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Evolutionary Computation (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Wire Bonding (AREA)
FR9610215A 1995-08-29 1996-08-14 Procede pour amenager des chemins conducteurs a la surface d'un element semi-conducteur Expired - Fee Related FR2738672B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19531651A DE19531651C2 (de) 1995-08-29 1995-08-29 Verfahren zur Anordnung von Leiterbahnen auf der Oberfläche eines Halbleiterbauelements

Publications (2)

Publication Number Publication Date
FR2738672A1 FR2738672A1 (fr) 1997-03-14
FR2738672B1 true FR2738672B1 (fr) 1998-08-07

Family

ID=7770610

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9610215A Expired - Fee Related FR2738672B1 (fr) 1995-08-29 1996-08-14 Procede pour amenager des chemins conducteurs a la surface d'un element semi-conducteur

Country Status (4)

Country Link
US (1) US5888893A (fr)
DE (1) DE19531651C2 (fr)
FR (1) FR2738672B1 (fr)
IT (1) IT1283846B1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19936862C1 (de) * 1999-08-05 2001-01-25 Siemens Ag Kontaktierung von Metalleiterbahnen eines integrierten Halbleiterchips
US6621721B2 (en) * 2002-01-31 2003-09-16 The Boeing Company Direct conversion programmable power source controller: three-phase input with programmable single-phase output

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55163859A (en) * 1979-06-07 1980-12-20 Fujitsu Ltd Manufacture of semiconductor device
JPH01154531A (ja) * 1987-12-11 1989-06-16 Hitachi Ltd 自動束配線方式
JPH06105710B2 (ja) * 1990-02-14 1994-12-21 株式会社東芝 半導体装置
FR2668300B1 (fr) * 1990-10-18 1993-01-29 Sagem Procede de realisation de circuits integres a double connectique.
US5494853A (en) * 1994-07-25 1996-02-27 United Microelectronics Corporation Method to solve holes in passivation by metal layout
US5521434A (en) * 1994-10-17 1996-05-28 International Business Machines Corporation Semiconductor chip and electronic module with integrated surface interconnects/components

Also Published As

Publication number Publication date
ITMI961797A0 (fr) 1996-08-28
US5888893A (en) 1999-03-30
FR2738672A1 (fr) 1997-03-14
IT1283846B1 (it) 1998-04-30
ITMI961797A1 (it) 1998-02-28
DE19531651A1 (de) 1997-03-06
DE19531651C2 (de) 2001-09-27

Similar Documents

Publication Publication Date Title
FR2740371B1 (fr) Procede de fabrication d'une pale
FR2651452B1 (fr) Procede de fabrication d'une soupape.
FR2670693B1 (fr) Procede pour nettoyer la surface d'un substrat par plasma.
FR2664294B1 (fr) Procede de metallisation d'une surface.
FR2741191B1 (fr) Procede de fabrication d'un micromodule, notamment pour cartes a puces
FR2741875B1 (fr) Procede pour l'hydroformylation des composes olefiniques
FR2643193B1 (fr) Procede pour fabriquer des circuits integres a semi-conducteurs
FR2733526B1 (fr) Procede de fabrication d'une cunette
MA23134A1 (fr) Procede pour la preparation d'aryl-piperidine carbinols .
FR2693596B1 (fr) Procede de preparation d'une electrode frittee pour un element galvanique.
FR2779008B1 (fr) Procede de fabrication d'un dispositif a semiconducteur
MA24534A1 (fr) Procede pour la production d'irones
FR2689501B1 (fr) Procede de fabrication d'ethylbenzene.
FR2738672B1 (fr) Procede pour amenager des chemins conducteurs a la surface d'un element semi-conducteur
FR2738670B1 (fr) Procede et appareil de formation d'un motif sur un substrat de circuit integre
FR2781603B1 (fr) Procede de formation d'une capacite sur un circuit integre
FR2735998B1 (fr) Procede de fabrication d'elements de construction composites -metal-matrice (mmc)
FR2729387B1 (fr) Procede pour la fabrication d'hydroxy-alcoxy-benzophenones
FR2768791B1 (fr) Procede de fabrication d'une matiere de friction
FR2662962B1 (fr) Procede pour la fabrication d'un arbre a cames.
FR2779007B1 (fr) Procede de formation d'une structure conductrice
FR2739308B1 (fr) Dispositif d'essuyage-aspiration d'une surface
FR2697353B1 (fr) Procede de formation d'image polychrome.
FR2756099B1 (fr) Procede de fabrication d'un transistor npn de surface minimale
FR2763005B1 (fr) Procede de fabrication d'emulsions e/h/e multiples

Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20110502