FR2687232B1 - Procede de developpement et attaque simultanes de couches stratifiees a base de resine photosensible et de polyimide. - Google Patents
Procede de developpement et attaque simultanes de couches stratifiees a base de resine photosensible et de polyimide.Info
- Publication number
- FR2687232B1 FR2687232B1 FR9301397A FR9301397A FR2687232B1 FR 2687232 B1 FR2687232 B1 FR 2687232B1 FR 9301397 A FR9301397 A FR 9301397A FR 9301397 A FR9301397 A FR 9301397A FR 2687232 B1 FR2687232 B1 FR 2687232B1
- Authority
- FR
- France
- Prior art keywords
- attack
- polyimide
- photosensitive resin
- laminated layers
- layers based
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004642 Polyimide Substances 0.000 title 1
- 229920001721 polyimide Polymers 0.000 title 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/32—Liquid compositions therefor, e.g. developers
- G03F7/325—Non-aqueous compositions
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19924203781 DE4203781C1 (enExample) | 1992-02-10 | 1992-02-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2687232A1 FR2687232A1 (fr) | 1993-08-13 |
| FR2687232B1 true FR2687232B1 (fr) | 1994-09-16 |
Family
ID=6451305
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR9301397A Expired - Fee Related FR2687232B1 (fr) | 1992-02-10 | 1993-02-09 | Procede de developpement et attaque simultanes de couches stratifiees a base de resine photosensible et de polyimide. |
Country Status (3)
| Country | Link |
|---|---|
| DE (1) | DE4203781C1 (enExample) |
| FR (1) | FR2687232B1 (enExample) |
| GB (1) | GB2263981A (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2265021B (en) * | 1992-03-10 | 1996-02-14 | Nippon Steel Chemical Co | Photosensitive materials and their use in forming protective layers for printed circuit and process for preparation of printed circuit |
| JPH09306901A (ja) * | 1996-05-17 | 1997-11-28 | Nec Corp | 半導体装置の製造方法 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55120032A (en) * | 1979-03-09 | 1980-09-16 | Daicel Chem Ind Ltd | Treating solution for photosensitive laminate having alcohol-soluble polyamide layer |
| JPS57124349A (en) * | 1981-01-24 | 1982-08-03 | Kimoto & Co Ltd | Image formation method |
| US4426253A (en) * | 1981-12-03 | 1984-01-17 | E. I. Du Pont De Nemours & Co. | High speed etching of polyimide film |
| DE3580827D1 (de) * | 1984-10-09 | 1991-01-17 | Hoechst Japan K K | Verfahren zum entwickeln und zum entschichten von photoresistschichten mit quaternaeren ammomiumverbindungen. |
| DE3705896A1 (de) * | 1986-02-24 | 1987-08-27 | Tokyo Ohka Kogyo Co Ltd | Verfahren zur herstellung eines fotoresistmusters auf einer substratflaeche und ein dafuer geeignetes schaumentfernungsmittel |
| JPS6362322A (ja) * | 1986-09-03 | 1988-03-18 | Matsushita Electronics Corp | 半導体素子の製造方法 |
| US4782009A (en) * | 1987-04-03 | 1988-11-01 | General Electric Company | Method of coating and imaging photopatternable silicone polyamic acid |
| JPH01281730A (ja) * | 1988-05-07 | 1989-11-13 | Seiko Epson Corp | パターン形成方法 |
| GB8917191D0 (en) * | 1989-07-27 | 1989-09-13 | Gec Avery Technology | Strain gauge encapsulation process |
| DE3941394A1 (de) * | 1989-12-15 | 1991-06-20 | Basf Ag | Waessrige entwicklerloesung und verfahren zum entwickeln von photoresisten |
-
1992
- 1992-02-10 DE DE19924203781 patent/DE4203781C1/de not_active Expired - Fee Related
-
1993
- 1993-02-09 GB GB9302508A patent/GB2263981A/en not_active Withdrawn
- 1993-02-09 FR FR9301397A patent/FR2687232B1/fr not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| FR2687232A1 (fr) | 1993-08-13 |
| GB9302508D0 (en) | 1993-03-24 |
| GB2263981A (en) | 1993-08-11 |
| DE4203781C1 (enExample) | 1993-09-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse | ||
| RN | Application for restoration |