GB9302508D0 - Process for developing and etching compound layers of photo-resist and polyimide simultancously - Google Patents

Process for developing and etching compound layers of photo-resist and polyimide simultancously

Info

Publication number
GB9302508D0
GB9302508D0 GB939302508A GB9302508A GB9302508D0 GB 9302508 D0 GB9302508 D0 GB 9302508D0 GB 939302508 A GB939302508 A GB 939302508A GB 9302508 A GB9302508 A GB 9302508A GB 9302508 D0 GB9302508 D0 GB 9302508D0
Authority
GB
United Kingdom
Prior art keywords
simultancously
polyimide
resist
photo
developing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB939302508A
Other versions
GB2263981A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of GB9302508D0 publication Critical patent/GB9302508D0/en
Publication of GB2263981A publication Critical patent/GB2263981A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/32—Liquid compositions therefor, e.g. developers
    • G03F7/325—Non-aqueous compositions
GB9302508A 1992-02-10 1993-02-09 Process for developing and etching compound layers of photoresist and polyimidesimultaneously Withdrawn GB2263981A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19924203781 DE4203781C1 (en) 1992-02-10 1992-02-10

Publications (2)

Publication Number Publication Date
GB9302508D0 true GB9302508D0 (en) 1993-03-24
GB2263981A GB2263981A (en) 1993-08-11

Family

ID=6451305

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9302508A Withdrawn GB2263981A (en) 1992-02-10 1993-02-09 Process for developing and etching compound layers of photoresist and polyimidesimultaneously

Country Status (3)

Country Link
DE (1) DE4203781C1 (en)
FR (1) FR2687232B1 (en)
GB (1) GB2263981A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2265021B (en) * 1992-03-10 1996-02-14 Nippon Steel Chemical Co Photosensitive materials and their use in forming protective layers for printed circuit and process for preparation of printed circuit
JPH09306901A (en) * 1996-05-17 1997-11-28 Nec Corp Manufacture of semiconductor device

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55120032A (en) * 1979-03-09 1980-09-16 Daicel Chem Ind Ltd Treating solution for photosensitive laminate having alcohol-soluble polyamide layer
JPS57124349A (en) * 1981-01-24 1982-08-03 Kimoto & Co Ltd Image formation method
US4426253A (en) * 1981-12-03 1984-01-17 E. I. Du Pont De Nemours & Co. High speed etching of polyimide film
DE3580827D1 (en) * 1984-10-09 1991-01-17 Hoechst Japan K K METHOD FOR DEVELOPING AND DE-COATING PHOTORESIS LAYERS WITH QUATERIAL AMMOMIUM COMPOUNDS.
DE3705896A1 (en) * 1986-02-24 1987-08-27 Tokyo Ohka Kogyo Co Ltd METHOD FOR PRODUCING A PHOTORESIST PATTERN ON A SUBSTRATE SURFACE AND A FOAM REMOVER SUITABLE FOR THIS
JPS6362322A (en) * 1986-09-03 1988-03-18 Matsushita Electronics Corp Manufacture of semiconductor element
US4782009A (en) * 1987-04-03 1988-11-01 General Electric Company Method of coating and imaging photopatternable silicone polyamic acid
JPH01281730A (en) * 1988-05-07 1989-11-13 Seiko Epson Corp Pattern forming method
GB8917191D0 (en) * 1989-07-27 1989-09-13 Gec Avery Technology Strain gauge encapsulation process
DE3941394A1 (en) * 1989-12-15 1991-06-20 Basf Ag WAITER DEVELOPER SOLUTION AND METHOD FOR DEVELOPING PHOTORE LISTS

Also Published As

Publication number Publication date
FR2687232B1 (en) 1994-09-16
GB2263981A (en) 1993-08-11
DE4203781C1 (en) 1993-09-09
FR2687232A1 (en) 1993-08-13

Similar Documents

Publication Publication Date Title
EP0556914A3 (en) Method of manufacturing a magnetic device
EP0189752A3 (en) Agent and process for stripping photoresist and stripping rests from semiconductor surfaces
EP0560617A3 (en) Method of manufacturing insulating film on semiconductor device and apparatus for carrying out the same
GB9303864D0 (en) A semiconductor device and a method of manufacturing thereof
IT8922268A0 (en) EQUIPMENT FOR PREVENTING FOGGING OF A SEMI-CONDUCTOR WAFER
AU7367891A (en) A method of operating a semiconductor device
EP0566838A3 (en) Manufacturing method of thin film transistor
KR960012624B1 (en) Fabricating method of semiconductor device
EP0536869A3 (en) Method of fabricating p-buried layers for pnp devices
EP0584583A3 (en) Method and apparatus for manufacturing photographic film and photographic film cassette
KR960016318B1 (en) Method of manufacturing semiconductor device
GB8910954D0 (en) A semiconductor waveguide arrangement and method of fabrication thereof
EP0585125A3 (en) A thin film semiconductor device and method of manufacture
EP0637064A3 (en) Method and apparatus for high-flatness etching of wafer.
DE69208810D1 (en) Photoresist and etching process
EP0561532A3 (en) Method of manufacturing an integrated circuit including planarizing a wafer
GB2205087B (en) Method of manufacturing a single crystal of compound semiconductor and apparatus for the same
DE3471549D1 (en) A method of etching refractory metal film on semiconductor structures
GB2308010B (en) Method of lapping a wafer
EP0361603A3 (en) A method of manufacturing a semiconductor device having a waveguide structure
AU2494092A (en) Cleaning-agent mixture for cleaning printed circuits and a method of cleaning such circuits
GB9302508D0 (en) Process for developing and etching compound layers of photo-resist and polyimide simultancously
AU1847592A (en) A method of fixing a tab and/or apparatus therefor
KR970009859B1 (en) Etching method of polycide film
FR2639085B1 (en) INTEGRATED ELECTROSTATIC MICRO VALVE AND METHOD FOR MANUFACTURING SUCH A MICRO VALVE

Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)