FR2670074B1 - Connexion entre des composants smd et une carte de circuits imprimes. - Google Patents
Connexion entre des composants smd et une carte de circuits imprimes.Info
- Publication number
- FR2670074B1 FR2670074B1 FR9114473A FR9114473A FR2670074B1 FR 2670074 B1 FR2670074 B1 FR 2670074B1 FR 9114473 A FR9114473 A FR 9114473A FR 9114473 A FR9114473 A FR 9114473A FR 2670074 B1 FR2670074 B1 FR 2670074B1
- Authority
- FR
- France
- Prior art keywords
- connection
- circuit board
- printed circuit
- smd components
- smd
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
- H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/049—PCB for one component, e.g. for mounting onto mother PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/091—Locally and permanently deformed areas including dielectric material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/1059—Connections made by press-fit insertion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Metallurgy (AREA)
- Combinations Of Printed Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4038460A DE4038460C2 (de) | 1990-12-03 | 1990-12-03 | SMD-Bauteilverbindung zu einer Leiterplatte |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2670074A1 FR2670074A1 (fr) | 1992-06-05 |
FR2670074B1 true FR2670074B1 (fr) | 1996-12-20 |
Family
ID=6419446
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9114473A Expired - Fee Related FR2670074B1 (fr) | 1990-12-03 | 1991-11-25 | Connexion entre des composants smd et une carte de circuits imprimes. |
Country Status (3)
Country | Link |
---|---|
DE (1) | DE4038460C2 (fr) |
FR (1) | FR2670074B1 (fr) |
GB (1) | GB2251344B (fr) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4204391A1 (de) | 1992-02-14 | 1993-08-19 | Rheinmetall Gmbh | Leiterkarte fuer eine leistungshalbleiter aufweisende leistungselektronikschaltung |
DE59300824D1 (de) * | 1992-12-23 | 1995-11-30 | Rheinmetall Ind Gmbh | Spannungsfeste Elektronik-Baugruppe. |
GB9814317D0 (en) * | 1997-07-23 | 1998-09-02 | Murata Manufacturing Co | Ceramic electronic part and method for producing the same |
DE19836278C2 (de) | 1998-08-11 | 2000-07-20 | Dynamit Nobel Ag | Extern ansteuerbare Anzündeinheit mit integrierter Elektronik zum Auslösen eines Rückhaltesystems |
DE19847521C2 (de) * | 1998-10-15 | 2001-05-17 | Diehl Stiftung & Co | Geschoß mit schockgedämpft eingebauter Schaltungsplatine |
CN103633530B (zh) * | 2013-12-02 | 2015-10-28 | 中国电子科技集团公司第四十一研究所 | 一种用于同轴转接器与印制板传输线的互连方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2640613C2 (de) * | 1976-09-09 | 1985-03-07 | Siemens AG, 1000 Berlin und 8000 München | Verfahren und Vorrichtung zum Kontaktieren von Schaltungsbausteinen in eine Schichtschaltung |
US4334732A (en) * | 1979-04-12 | 1982-06-15 | Nixdorf Computer Ag | Electrical connector unit |
EP0022934A1 (fr) * | 1979-07-18 | 1981-01-28 | Siemens Aktiengesellschaft | Dispositif d'affichage électrooptique, en particulier affichage à cristal liquide |
JPS6021535A (ja) * | 1983-06-30 | 1985-02-02 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | 半導体装置を相互接続する方法 |
US4631820A (en) * | 1984-08-23 | 1986-12-30 | Canon Kabushiki Kaisha | Mounting assembly and mounting method for an electronic component |
JPS6273650A (ja) * | 1985-09-27 | 1987-04-04 | Hitachi Ltd | 電気部品 |
GB8727926D0 (en) * | 1987-11-28 | 1987-12-31 | British Aerospace | Surface mounting leadless components on conductor pattern supporting substrates |
FR2634616B1 (fr) * | 1988-07-20 | 1995-08-25 | Matra | Procede de montage de micro-composants electroniques sur un support et produit realisable par le procede |
US4907975A (en) * | 1988-12-19 | 1990-03-13 | International Business Machine Corporation | Electrical connector utilizing flexible electrical circuitry |
-
1990
- 1990-12-03 DE DE4038460A patent/DE4038460C2/de not_active Expired - Fee Related
-
1991
- 1991-11-25 FR FR9114473A patent/FR2670074B1/fr not_active Expired - Fee Related
- 1991-11-29 GB GB9125507A patent/GB2251344B/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
FR2670074A1 (fr) | 1992-06-05 |
DE4038460C2 (de) | 1995-02-09 |
GB9125507D0 (en) | 1992-01-29 |
GB2251344B (en) | 1994-11-16 |
GB2251344A (en) | 1992-07-01 |
DE4038460A1 (de) | 1992-06-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |