FR2668854B1 - Dispositif semiconducteur conditionne dans la resine. - Google Patents

Dispositif semiconducteur conditionne dans la resine.

Info

Publication number
FR2668854B1
FR2668854B1 FR9104257A FR9104257A FR2668854B1 FR 2668854 B1 FR2668854 B1 FR 2668854B1 FR 9104257 A FR9104257 A FR 9104257A FR 9104257 A FR9104257 A FR 9104257A FR 2668854 B1 FR2668854 B1 FR 2668854B1
Authority
FR
France
Prior art keywords
resin
semiconductor device
conditioned
conditioned semiconductor
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9104257A
Other languages
English (en)
Other versions
FR2668854A1 (fr
Inventor
Kazunari Michii
Masataka Takehara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of FR2668854A1 publication Critical patent/FR2668854A1/fr
Application granted granted Critical
Publication of FR2668854B1 publication Critical patent/FR2668854B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49883—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing organic materials or pastes, e.g. for thick films
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
FR9104257A 1990-11-06 1991-04-08 Dispositif semiconducteur conditionne dans la resine. Expired - Fee Related FR2668854B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2298826A JP2501950B2 (ja) 1990-11-06 1990-11-06 半導体装置

Publications (2)

Publication Number Publication Date
FR2668854A1 FR2668854A1 (fr) 1992-05-07
FR2668854B1 true FR2668854B1 (fr) 1996-08-30

Family

ID=17864721

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9104257A Expired - Fee Related FR2668854B1 (fr) 1990-11-06 1991-04-08 Dispositif semiconducteur conditionne dans la resine.

Country Status (3)

Country Link
JP (1) JP2501950B2 (fr)
DE (1) DE4129160C2 (fr)
FR (1) FR2668854B1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5255430A (en) * 1992-10-08 1993-10-26 Atmel Corporation Method of assembling a module for a smart card
JP2677242B2 (ja) * 1995-04-27 1997-11-17 日本電気株式会社 半導体装置及びその製造方法
US7741706B2 (en) * 2006-09-29 2010-06-22 Microsemi Corporation Plastic surface mount large area power device

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0740600B2 (ja) * 1987-04-30 1995-05-01 三菱電機株式会社 半導体装置
JP2641869B2 (ja) * 1987-07-24 1997-08-20 三菱電機株式会社 半導体装置の製造方法
JPH01132142A (ja) * 1987-08-05 1989-05-24 Mitsubishi Electric Corp 半導体装置のパツケージ構造
JPH01225328A (ja) * 1988-03-04 1989-09-08 Mitsubishi Electric Corp 半導体装置
JP2651427B2 (ja) * 1988-04-22 1997-09-10 株式会社日立製作所 半導体装置の製造方法
JPH0263131A (ja) * 1988-08-29 1990-03-02 Mitsubishi Electric Corp 半導体パツケージ
JPH07114215B2 (ja) * 1989-01-20 1995-12-06 富士通株式会社 樹脂モールド型半導体装置
JPH0810744B2 (ja) * 1989-08-28 1996-01-31 三菱電機株式会社 半導体装置

Also Published As

Publication number Publication date
DE4129160A1 (de) 1992-05-07
JPH04171848A (ja) 1992-06-19
JP2501950B2 (ja) 1996-05-29
FR2668854A1 (fr) 1992-05-07
DE4129160C2 (de) 1996-09-05

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Legal Events

Date Code Title Description
ST Notification of lapse