FR2653367A1 - Procede et appareil de brasage au laser. - Google Patents

Procede et appareil de brasage au laser. Download PDF

Info

Publication number
FR2653367A1
FR2653367A1 FR8913937A FR8913937A FR2653367A1 FR 2653367 A1 FR2653367 A1 FR 2653367A1 FR 8913937 A FR8913937 A FR 8913937A FR 8913937 A FR8913937 A FR 8913937A FR 2653367 A1 FR2653367 A1 FR 2653367A1
Authority
FR
France
Prior art keywords
laser
substrate
temperature
region
pyrometer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR8913937A
Other languages
English (en)
French (fr)
Other versions
FR2653367B1 (enrdf_load_stackoverflow
Inventor
Cottin Patrice
Guivy Patrick
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Quantel SA
Original Assignee
Quantel SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Quantel SA filed Critical Quantel SA
Priority to FR8913937A priority Critical patent/FR2653367A1/fr
Priority to PCT/FR1990/000731 priority patent/WO1991006389A1/fr
Publication of FR2653367A1 publication Critical patent/FR2653367A1/fr
Application granted granted Critical
Publication of FR2653367B1 publication Critical patent/FR2653367B1/fr
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/034—Observing the temperature of the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
FR8913937A 1989-10-24 1989-10-24 Procede et appareil de brasage au laser. Granted FR2653367A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR8913937A FR2653367A1 (fr) 1989-10-24 1989-10-24 Procede et appareil de brasage au laser.
PCT/FR1990/000731 WO1991006389A1 (fr) 1989-10-24 1990-10-12 Procede et appareil de brasage au laser

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8913937A FR2653367A1 (fr) 1989-10-24 1989-10-24 Procede et appareil de brasage au laser.

Publications (2)

Publication Number Publication Date
FR2653367A1 true FR2653367A1 (fr) 1991-04-26
FR2653367B1 FR2653367B1 (enrdf_load_stackoverflow) 1995-02-17

Family

ID=9386731

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8913937A Granted FR2653367A1 (fr) 1989-10-24 1989-10-24 Procede et appareil de brasage au laser.

Country Status (2)

Country Link
FR (1) FR2653367A1 (enrdf_load_stackoverflow)
WO (1) WO1991006389A1 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003080282A1 (de) * 2002-03-26 2003-10-02 Siemens Aktiengesellschaft Verfahren zum simultanen laserstrahllöten

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19751487A1 (de) * 1997-11-20 1999-06-02 Pac Tech Gmbh Verfahren und Vorrichtung zur thermischen Verbindung von Anschlußflächen zweier Substrate
EP1110654A1 (de) * 1999-10-21 2001-06-27 Leister Process Technologies Verfahren un Vorrichtung zum selektiven Erwärmen von Bauelementen
DE102017104097A1 (de) * 2017-02-28 2018-08-30 Pac Tech-Packaging Technologies Gmbh Verfahren und Laseranordnung zum Aufschmelzen eines Lotmaterialdepots mittels Laserenergie

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0223066A1 (de) * 1985-11-11 1987-05-27 Siemens Nixdorf Informationssysteme Aktiengesellschaft Vorrichtung zum Auflöten elektronischer Bauelemente auf eine Schaltungsplatine
DE3701013A1 (de) * 1987-01-15 1988-07-28 Messerschmitt Boelkow Blohm Verfahren zum mikroloeten

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0223066A1 (de) * 1985-11-11 1987-05-27 Siemens Nixdorf Informationssysteme Aktiengesellschaft Vorrichtung zum Auflöten elektronischer Bauelemente auf eine Schaltungsplatine
DE3701013A1 (de) * 1987-01-15 1988-07-28 Messerschmitt Boelkow Blohm Verfahren zum mikroloeten

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
DESIGN ENGINEERING *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003080282A1 (de) * 2002-03-26 2003-10-02 Siemens Aktiengesellschaft Verfahren zum simultanen laserstrahllöten

Also Published As

Publication number Publication date
WO1991006389A1 (fr) 1991-05-16
FR2653367B1 (enrdf_load_stackoverflow) 1995-02-17

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ST Notification of lapse
ST Notification of lapse