FR2653367B1 - - Google Patents

Info

Publication number
FR2653367B1
FR2653367B1 FR8913937A FR8913937A FR2653367B1 FR 2653367 B1 FR2653367 B1 FR 2653367B1 FR 8913937 A FR8913937 A FR 8913937A FR 8913937 A FR8913937 A FR 8913937A FR 2653367 B1 FR2653367 B1 FR 2653367B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR8913937A
Other languages
French (fr)
Other versions
FR2653367A1 (fr
Inventor
Patrice Cottin
Patrick Guivy
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Quantel SA
Original Assignee
Quantel SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Quantel SA filed Critical Quantel SA
Priority to FR8913937A priority Critical patent/FR2653367A1/fr
Priority to PCT/FR1990/000731 priority patent/WO1991006389A1/fr
Publication of FR2653367A1 publication Critical patent/FR2653367A1/fr
Application granted granted Critical
Publication of FR2653367B1 publication Critical patent/FR2653367B1/fr
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03Observing, e.g. monitoring, the workpiece
    • B23K26/034Observing the temperature of the workpiece
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/005Soldering by means of radiant energy
    • B23K1/0056Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3421Leaded components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494Heating methods for reflowing of solder

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
FR8913937A 1989-10-24 1989-10-24 Procede et appareil de brasage au laser. Granted FR2653367A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR8913937A FR2653367A1 (fr) 1989-10-24 1989-10-24 Procede et appareil de brasage au laser.
PCT/FR1990/000731 WO1991006389A1 (fr) 1989-10-24 1990-10-12 Procede et appareil de brasage au laser

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8913937A FR2653367A1 (fr) 1989-10-24 1989-10-24 Procede et appareil de brasage au laser.

Publications (2)

Publication Number Publication Date
FR2653367A1 FR2653367A1 (fr) 1991-04-26
FR2653367B1 true FR2653367B1 (enrdf_load_stackoverflow) 1995-02-17

Family

ID=9386731

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8913937A Granted FR2653367A1 (fr) 1989-10-24 1989-10-24 Procede et appareil de brasage au laser.

Country Status (2)

Country Link
FR (1) FR2653367A1 (enrdf_load_stackoverflow)
WO (1) WO1991006389A1 (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19751487A1 (de) * 1997-11-20 1999-06-02 Pac Tech Gmbh Verfahren und Vorrichtung zur thermischen Verbindung von Anschlußflächen zweier Substrate
EP1110654A1 (de) * 1999-10-21 2001-06-27 Leister Process Technologies Verfahren un Vorrichtung zum selektiven Erwärmen von Bauelementen
DE10213577B3 (de) * 2002-03-26 2004-02-19 Siemens Ag Verfahren zum simultanen Laserstrahllöten
DE102017104097A1 (de) * 2017-02-28 2018-08-30 Pac Tech-Packaging Technologies Gmbh Verfahren und Laseranordnung zum Aufschmelzen eines Lotmaterialdepots mittels Laserenergie

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3539933A1 (de) * 1985-11-11 1987-05-14 Nixdorf Computer Ag Vorrichtung zum aufloeten elektronischer bauelemente auf eine schaltungsplatine
DE3701013A1 (de) * 1987-01-15 1988-07-28 Messerschmitt Boelkow Blohm Verfahren zum mikroloeten

Also Published As

Publication number Publication date
WO1991006389A1 (fr) 1991-05-16
FR2653367A1 (fr) 1991-04-26

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Legal Events

Date Code Title Description
TP Transmission of property
ST Notification of lapse
ST Notification of lapse