FR2646583B1 - METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARDS - Google Patents

METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARDS

Info

Publication number
FR2646583B1
FR2646583B1 FR909005136A FR9005136A FR2646583B1 FR 2646583 B1 FR2646583 B1 FR 2646583B1 FR 909005136 A FR909005136 A FR 909005136A FR 9005136 A FR9005136 A FR 9005136A FR 2646583 B1 FR2646583 B1 FR 2646583B1
Authority
FR
France
Prior art keywords
printed circuit
circuit boards
manufacturing printed
manufacturing
boards
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR909005136A
Other languages
French (fr)
Other versions
FR2646583A1 (en
Inventor
Martin Bayes
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MacDermid Enthone Inc
Original Assignee
Enthone Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Enthone Inc filed Critical Enthone Inc
Publication of FR2646583A1 publication Critical patent/FR2646583A1/en
Application granted granted Critical
Publication of FR2646583B1 publication Critical patent/FR2646583B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Laminated Bodies (AREA)
FR909005136A 1989-05-01 1990-04-23 METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARDS Expired - Fee Related FR2646583B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US34580489A 1989-05-01 1989-05-01

Publications (2)

Publication Number Publication Date
FR2646583A1 FR2646583A1 (en) 1990-11-02
FR2646583B1 true FR2646583B1 (en) 1992-01-24

Family

ID=23356553

Family Applications (1)

Application Number Title Priority Date Filing Date
FR909005136A Expired - Fee Related FR2646583B1 (en) 1989-05-01 1990-04-23 METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARDS

Country Status (6)

Country Link
JP (1) JPH0734501B2 (en)
DE (1) DE4013094A1 (en)
FR (1) FR2646583B1 (en)
GB (1) GB2232168B (en)
HK (1) HK13395A (en)
IT (1) IT1241204B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5358602A (en) * 1993-12-06 1994-10-25 Enthone-Omi Inc. Method for manufacture of printed circuit boards
JP3393190B2 (en) * 1999-02-22 2003-04-07 有限会社関東学院大学表面工学研究所 Method for selectively activating copper pattern and activator used therefor

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3011920A (en) * 1959-06-08 1961-12-05 Shipley Co Method of electroless deposition on a substrate and catalyst solution therefor
US3698944A (en) * 1970-06-15 1972-10-17 Texas Instruments Inc Method of obtaining phased growth of epitaxial layers
US4748056A (en) * 1972-07-11 1988-05-31 Kollmorgen Corporation Process and composition for sensitizing articles for metallization
US4662944A (en) * 1972-07-11 1987-05-05 Kollmorgen Technologies Corporation Process and composition for sensitizing articles for metallization
US3976816A (en) * 1973-10-29 1976-08-24 Enthone, Incorporated Activation of surfaces intended for electroless plating
AR218223A1 (en) * 1975-05-05 1980-05-30 Borg Warner CATALYTICALLY ACTIVE COMPOSITION
DE2538571A1 (en) * 1975-08-29 1977-03-03 Siemens Ag METALIZATION METHOD OF THERMAL PLASTICS, IN PARTICULAR PHENOLIC RESINS
US4150171A (en) * 1976-03-30 1979-04-17 Surface Technology, Inc. Electroless plating
ZA77897B (en) * 1976-04-13 1977-12-28 Kollmorgen Corp Liquid seeders and catalyzation processes for electroless metal deposition
US4167596A (en) * 1977-08-01 1979-09-11 Nathan Feldstein Method of preparation and use of electroless plating catalysts
GB2013722A (en) * 1978-01-19 1979-08-15 Canning W Materials Ltd Plating process
US4233344A (en) * 1978-07-20 1980-11-11 Learonal, Inc. Method of improving the adhesion of electroless metal deposits employing colloidal copper activator
US4234628A (en) * 1978-11-28 1980-11-18 The Harshaw Chemical Company Two-step preplate system for polymeric surfaces
US4448811A (en) * 1981-12-30 1984-05-15 Omi International Corporation Oxidizing agent for acidic accelerator in electroless metal plating process
ZA843704B (en) * 1983-07-01 1985-09-25 Macdermid Inc Oxidizing accelerator
JPS6036674A (en) * 1983-08-08 1985-02-25 Hitachi Chem Co Ltd Activating method for electroless copper plating
DE3504455A1 (en) * 1984-02-17 1985-08-22 Omi International Corp. (eine Gesellschaft n.d.Ges.d. Staates Delaware), Warren, Mich. METHOD FOR TREATING AN ELECTRICALLY NON-CONDUCTIVE SUBSTRATE BEFORE ELECTRICIZING METALIZATION
US4592852A (en) * 1984-06-07 1986-06-03 Enthone, Incorporated Composition and process for treating plastics with alkaline permanganate solutions
US4684550A (en) * 1986-04-25 1987-08-04 Mine Safety Appliances Company Electroless copper plating and bath therefor
CN87100440B (en) * 1987-01-27 1988-05-11 中国人民解放军装甲兵工程学院 Process of metal brush-plating on non-conductive material
US4873136A (en) * 1988-06-16 1989-10-10 General Electric Company Method for preparing polymer surfaces for subsequent plating thereon, and improved metal-plated plastic articles made therefrom

Also Published As

Publication number Publication date
GB9009796D0 (en) 1990-06-20
IT1241204B (en) 1993-12-29
JPH0734501B2 (en) 1995-04-12
IT9067307A0 (en) 1990-04-24
FR2646583A1 (en) 1990-11-02
GB2232168A (en) 1990-12-05
DE4013094C2 (en) 1993-07-22
HK13395A (en) 1995-02-10
GB2232168B (en) 1993-06-16
DE4013094A1 (en) 1990-11-15
IT9067307A1 (en) 1991-10-24
JPH02303181A (en) 1990-12-17

Similar Documents

Publication Publication Date Title
FR2549677B1 (en) ELECTRONIC CIRCUIT BOARD INSPECTION PROCESS
FR2575627B1 (en) METHOD FOR MANUFACTURING A MULTI-LAYER PRINTED CIRCUIT BOARD
EP0545328A3 (en) Printed circuit board manufacturing process
EP0431501A3 (en) Multilayer printed circuit board formation
FR2595899B1 (en) METHOD FOR MOUNTING ELECTRONIC COMPONENTS IN SPECIFIED LOCATIONS ON A PRINTED CIRCUIT BOARD
FR2529718B1 (en) METHOD FOR THE CONNECTION OF TWO PRINTED CIRCUIT BOARDS OF DIFFERENT TYPES
EP0424106A3 (en) A method for connecting circuit boards
FR2616615B1 (en) NUMERICALLY CONTROLLED MACHINE FOR MACHINING PRINTED CIRCUIT BOARDS
KR910009129A (en) Photosensitive resin composition for forming conductor pattern, multi-layer printed circuit board, and manufacturing method thereof
EP0478320A3 (en) Method for manufacturing printed circuit board
FR2593016B1 (en) METHOD FOR FORMING ELECTRICAL CIRCUITS ON A BASE BOARD
FR2536945B1 (en) METHOD FOR MANUFACTURING A PRINTED CIRCUIT BOARD
DE59009928D1 (en) Process for soldering printed circuit boards.
FR2480553B1 (en) PRINTED CIRCUIT BOARD AND METHOD FOR THE PRODUCTION THEREOF
EP0231795A3 (en) Method for making printed circuit boards
IL98380A0 (en) Stripping method for removing resist from a printed circuit board
FR2647971B1 (en) CONNECTION ASSEMBLY FOR PRINTED CIRCUIT BOARDS
GB2246480B (en) A method of manufacturing a printed circuit board
FR2678130B1 (en) ASSEMBLY HOLDER FOR PRINTED CIRCUIT BOARDS TO SLIP IN PLACE.
EP0473911A3 (en) Method for mounting electronic parts on a printed circuit board
FR2684836B3 (en) METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARDS WITH VIA HOLES.
GB2241833B (en) A mounting for electronic circuit boards
FR2646583B1 (en) METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARDS
GB9202602D0 (en) Selective process for printed circuit board manufacturing
FR2709634B1 (en) Structure for connecting printed circuit boards.

Legal Events

Date Code Title Description
ST Notification of lapse