FR2684836B3 - METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARDS WITH VIA HOLES. - Google Patents

METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARDS WITH VIA HOLES.

Info

Publication number
FR2684836B3
FR2684836B3 FR9115007A FR9115007A FR2684836B3 FR 2684836 B3 FR2684836 B3 FR 2684836B3 FR 9115007 A FR9115007 A FR 9115007A FR 9115007 A FR9115007 A FR 9115007A FR 2684836 B3 FR2684836 B3 FR 2684836B3
Authority
FR
France
Prior art keywords
printed circuit
circuit boards
via holes
manufacturing printed
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
FR9115007A
Other languages
French (fr)
Other versions
FR2684836A1 (en
Inventor
Mauleon Christine
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASSISTANCE PROD ENVI LAB
Original Assignee
ASSISTANCE PROD ENVI LAB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASSISTANCE PROD ENVI LAB filed Critical ASSISTANCE PROD ENVI LAB
Priority to FR9115007A priority Critical patent/FR2684836B3/en
Publication of FR2684836A1 publication Critical patent/FR2684836A1/en
Application granted granted Critical
Publication of FR2684836B3 publication Critical patent/FR2684836B3/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0763—Treating individual holes or single row of holes, e.g. by nozzle
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
FR9115007A 1991-12-04 1991-12-04 METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARDS WITH VIA HOLES. Expired - Lifetime FR2684836B3 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR9115007A FR2684836B3 (en) 1991-12-04 1991-12-04 METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARDS WITH VIA HOLES.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9115007A FR2684836B3 (en) 1991-12-04 1991-12-04 METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARDS WITH VIA HOLES.

Publications (2)

Publication Number Publication Date
FR2684836A1 FR2684836A1 (en) 1993-06-11
FR2684836B3 true FR2684836B3 (en) 1994-03-18

Family

ID=9419651

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9115007A Expired - Lifetime FR2684836B3 (en) 1991-12-04 1991-12-04 METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARDS WITH VIA HOLES.

Country Status (1)

Country Link
FR (1) FR2684836B3 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6276055B1 (en) * 1998-09-02 2001-08-21 Hadco Santa Clara, Inc. Method and apparatus for forming plugs in vias of a circuit board layer
US6454154B1 (en) 2000-05-31 2002-09-24 Honeywell Advanced Circuits, Inc. Filling device
DE10196259T1 (en) 2000-05-31 2003-05-15 Honeywell Int Inc filling
JP2004501513A (en) 2000-05-31 2004-01-15 ハネウエル・インターナシヨナル・インコーポレーテツド Filling method
US6855385B2 (en) 2000-05-31 2005-02-15 Ttm Advanced Circuits, Inc. PCB support plate for PCB via fill
US6800232B2 (en) 2000-05-31 2004-10-05 Ttm Advanced Circuits, Inc. PCB support plate method for PCB via fill
US6506332B2 (en) 2000-05-31 2003-01-14 Honeywell International Inc. Filling method
DE102008056299A1 (en) * 2008-11-07 2010-05-12 Novo-Tech Gmbh & Co. Kg Structural element, particularly for separating wall or box, has pole made of extruded material containing mixture of lignocellulose-containing fiber and plastic
EP2844044A1 (en) * 2013-09-03 2015-03-04 Mass GmbH System and method for filling cavities in a printed circuit board

Also Published As

Publication number Publication date
FR2684836A1 (en) 1993-06-11

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