FR2766654B1 - METHOD FOR MANUFACTURING A CIRCUIT BOARD - Google Patents

METHOD FOR MANUFACTURING A CIRCUIT BOARD

Info

Publication number
FR2766654B1
FR2766654B1 FR9806715A FR9806715A FR2766654B1 FR 2766654 B1 FR2766654 B1 FR 2766654B1 FR 9806715 A FR9806715 A FR 9806715A FR 9806715 A FR9806715 A FR 9806715A FR 2766654 B1 FR2766654 B1 FR 2766654B1
Authority
FR
France
Prior art keywords
manufacturing
circuit board
board
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9806715A
Other languages
French (fr)
Other versions
FR2766654A1 (en
Inventor
Hirokazu Yoshidka
Norio Yoshida
Kenichiro Tanaka
Jun Tatsuta
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Publication of FR2766654A1 publication Critical patent/FR2766654A1/en
Application granted granted Critical
Publication of FR2766654B1 publication Critical patent/FR2766654B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/486—Via connections through the substrate with or without pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B23K2103/166—Multilayered materials
    • B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
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    • H01L2224/4805—Shape
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    • H01L2224/48091—Arched
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    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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    • H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
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    • H01L2924/151—Die mounting substrate
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
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    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
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    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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    • H05K2203/1121—Cooling, e.g. specific areas of a PCB being cooled during reflow soldering
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    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Manufacturing Of Printed Wiring (AREA)
FR9806715A 1997-07-28 1998-05-28 METHOD FOR MANUFACTURING A CIRCUIT BOARD Expired - Fee Related FR2766654B1 (en)

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ATE242589T1 (en) * 1999-09-30 2003-06-15 Siemens Ag METHOD AND DEVICE FOR LASER DRILLING ORGANIC MATERIALS
TW483790B (en) * 1999-09-30 2002-04-21 Siemens Ag Method and equipment to drill laminates by means of laser
CN100366132C (en) * 2000-02-28 2008-01-30 Stsatl公司 A method of forming an opening or cavity in a substrate for receiving an electronic component
US6956182B2 (en) * 2000-05-26 2005-10-18 Sts Atl Corporation Method of forming an opening or cavity in a substrate for receiving an electronic component
DE10048424A1 (en) * 2000-09-29 2002-04-18 Bsh Bosch Siemens Hausgeraete Heating element for domestic appliances e.g. toaster, blower heater or hair dryer, includes sections not passing current supplied
US20050146025A1 (en) 2001-02-26 2005-07-07 John Gregory Method of forming an opening or cavity in a substrate for receiving an electronic component
JP4367623B2 (en) * 2004-01-14 2009-11-18 住友電気工業株式会社 Method for producing electrical circuit component made of porous stretched polytetrafluoroethylene sheet or porous stretched polytetrafluoroethylene film, and electrical circuit component
DE102007015415A1 (en) * 2007-03-30 2008-10-02 Daimler Ag Sun visor for motor vehicle for variable light shading of spatial areas in vehicle interior, has glare cover area with two coupled liquid crystal display-modules, whose translucence is alterable
CN112312659B (en) * 2019-07-29 2021-09-21 庆鼎精密电子（淮安）有限公司 Glue removing method for circuit board

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EP0164564A1 (en) * 1984-05-18 1985-12-18 Siemens Aktiengesellschaft Arrangement for the production of blind holes in a laminated construction
US4839497A (en) * 1987-09-03 1989-06-13 Digital Equipment Corporation Drilling apparatus and method
US5126532A (en) * 1989-01-10 1992-06-30 Canon Kabushiki Kaisha Apparatus and method of boring using laser
US5194713A (en) * 1991-10-17 1993-03-16 International Business Machines Corporation Removal of excimer laser debris using carbon dioxide laser
US5302547A (en) * 1993-02-08 1994-04-12 General Electric Company Systems for patterning dielectrics by laser ablation
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JP3080579B2 (en) * 1996-03-06 2000-08-28 富士機工電子株式会社 Manufacturing method of air rear grid array package
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DE19824225B4 (en) 2008-08-21
DE19824225A1 (en) 1999-02-04

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