JPS6036674A - Activating method for electroless copper plating - Google Patents

Abstract

PURPOSE:To improve the characteristics of electroless copper plating by immersing an article to be plated in an aqueous soln. contg. a complex compound prepd. by reacting a bivalent Pd compound or a uni- or bivalent Cu compound with glucose, pulling up the article, and heating it to produce metallic Pd or Cu. CONSTITUTION:An article to be plated is immersed in an aqueous soln. of a complex compound prepd. by reacting a bivalent Pd compound or a uni- or bivalent Cu compound with glucose. The concn. of the complex compound in the aqueous soln. is <=1wt% when the compound is expressed in terms of Pd or Cu. The article is pulled up from the soln., and it is heated to 30-200 deg.C to form metallic Pd or Cu particles on the surface of the article. The article is then subjected to electroless copper plating by a conventional method.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention (G, Electroless Copper 4) relates to a method for activating screws.

Non-glare steel plating is widely used in the field of printing and spinning boards to form circuit boards on insulating substrates of 5 laminated boards.
0 In this case, when electroless copper plating is applied to an insulating substrate, it becomes viscous, that is, catalyst nuclei for electroless copper plating are formed δ
nru. This catalytic nucleus? At the center, steel ions in the non-dLWf steel plating solution precipitate and grow to a distance of 7 m with the copper film, forming a sweetfish.

In order to improve the cleanliness of a busy U-substrate, metal palladium, which acts as a catalyst for electroless copper plating, is formed on the surface of an insulating substrate.

Conventionally, this metal palladium is CJ P d CTo +5nCJn-, -P d + 5n
It is equal to the anti-corrosion 6 of Cd4, and carrier V such as silica
C-state attached! 11. I'm going to work on the catalyst rμ.'' - Husband,
Tina.

Therefore, there are many impurities such as Sn and C8.

State salary r used / l), so 11 is mixed in, and the additive printing board is used for additive printing] (contains catalyst) with a sign board? ]
In the case of L-made shields, warping and screws occur, there are problems with insulation, and it is difficult to get the wires mixed into the insulation layer of the insulated wire.

Metallic palladium by heating the complex compound that corresponds to it? Generation 1
! 7. The special features and the activation method for electroless copper plating.

As a palladium compound of 2 Lun, agglomerated palladium (■
), baradium fluoride (11), -) palladium tetrachloride * palladium iodide (b), palladium nitrate (kawa, &tH palladium (111% palladium oxide (■) s 411i baradium (H) ) & Biko 71 etc. are used for 1 length.

A halokenide, especially VC baladium chloride (11), is preferred. 1 stroke, 21 pieces of copper compound, which is lumped copper (1)
, Tanhua copper (■), Feiqin lead + (+T) and this 11. A mixture of et al.

irJ, D-glucose, L-glucose or n is used as talcose.

2 What is the relationship between fjh's Baladicum compound tglucose and the complex compound? Add 2 g of water to 1 g of glucose and add 0.0 g of agglomerated palladium to 1 g of glucose.
By adding 25 g and heating and shaking at 50° C. for 20 minutes, this complex compound was heated to a temperature of 80° C. or higher [j to form metal palladium with heat].

Samurai etc.) 1. In the complex compound, palladium chloride (U) is coordinated to the hydroxyl group of glucose! The palladium of 211111 is reduced by the aqueous VC bonded to the carbon atom VC adjacent to the carbon atom to which the l1%7Jli Ding and the water rg group are bonded, and to the gold bullion palladium? Generate.

Use of uninvented complex compounds by Kerila Ming Tshin. Use (1
) All the F-grade plated items in the wetted compound were collected and removed, and a metal palladium layer was formed on the surface of the plated items using VC, also known as heating.

(2) Candy compounds, rubber, phenolic, etc. are dispersed during drilling, applied to the surface of a laminating machine, etc., where the gasis cloth is impregnated with epoxy, and heated and dried. Create palladium (6) Special compound, varnish dispersed in an acetone bath solution of epoxy resin, impregnated into a material such as dekara cloth! :
, a laminating machine is assembled using a conventional method. When the prepreg is dried, metallic palladium is generated by the heat applied by heating and pressurizing the prepreg. Make a harp. 〇 (5) Complex compound γ, which produces metallic palladium by heating during heat removal of organic torture, is dispersed in VC in a tetrahydrone lanthane bath of polyimide, and is oxidized to copper. Burning is the heat of timev
c x g Metallic palladium is produced and the catalytic ligation is completed.

As stated above, the method of the present invention provides the following advantages.

(1) Because the particles of Sosu palladium that are generated are thin and hard,
Samurai et al. 71.7 (The characteristics of electroless plating are excellent nΦ, -1 (2
) Because it is ground without using the grapes from Shihodoji Temple, it can be used in bathing ceremonies.

(3) Because the impurity of Sn, C4 temple does not serve as a shrine, dog et al.
The characteristics of electroless plating are outstanding.

5- Ding Merchant Nell O22 Store: Show 11158 9JJ I G l-1″l!'+i
'l'J'i'k'1f'tlQ1, thing 1'l, (,
Elementary school 11L phase +5 tu [Subpetition No. 144640', -J2,
Name of the invention: Mugen 11 Mind Ukki Niri J Zuro Activation Method 3, Amendment U Matters (! 1 Seki 1 System! IS Permit Application Applicant Address: Tokyo Jill Ji-ku, Nishi-Shinjuku 2, - No. 1) No. 1 name (, +45) Rotachi PJ Oriental Co., Ltd.?l-
Representative: Ryoji Yokoyama 4.1 Shiwa ■ 160 Address: 2-1-1 Nishi-Shinjuku, Shinjuku-ku, Tokyo Hitachi Chemical Co., Ltd. hi-rzi ('i-senshu Tokyo 346-3111 (main representative) 6
, The content of the correction is as per y5 river.

Meiwa 1 arrival 1, name of invention ＼ electric hf steel metal @ j6 Sumikaho 2, knowledge 1a ice morning t/1 1, 2 i + 111 (/J bafudiumification 9 course, 11 songs Th2111D When the lead compound is heated, it reacts with the steel-formed vJ foot curcose, and when heated, the metallurgical base is heated and the vJ gun end electricity is generated. Heavy weighting method.

6. The invention's r 1st "πul view 1 town" In this invention, the activation method V (4 O force 1% 41.jIl + # @ Kawametsusa rJl application [
- Board number - C, the circuit board is extremely heavy in the detective layer and the temple, and VC Hiro (used).

In this case, the electroless copper adhesion to the insulation 2 is glazed,
When activated, the catalytic nucleus for disintegration is formed. Centering around this catalyst bale meeting, the ions and ions in the electroless copper electrolytic plating are deposited.

It grows to become a copper film with 5 circuits and 7+:ゐ.

Insulation A - In order to make the insulation conductive, gold-plated palladium or gold maple, copper-purple, and gold-metal palladium, which serve as catalysts for the plating without a plating, are formed on the surface of the insulated substrate.

Shunmai? λ is this ordinary palladium H(4 PdC1s +5n(4*-→Pd −+-5nC1t
It is supported on a carrier such as silica frozen soil, and
τKayonoko Ur1c for catalyst f¥ has been devised.

-1 for Sn, C17i:
K.

In order to use it for 14 days, it is mixed in with the wholesaler J, and is used as a substitute for the active printing board (contains catalyst).
Manufacturer D.J., -t has occurred and operation problem f(
There is separation point, and there is no possibility of mixing into the insulation layer of insulation 1.
I had a hard time.

Ki Akiaki was created with an island view of points like cL and l).
21 bends palladized 8'4'a or 11 bends, 2i 11
↑The formation of a crystalline compound by reacting with glycose using heat Agglomerated palladium (
1υ, palladium fluoride (11), palladium bromide (
II) s Palladium iodide (■), palladium nitrate (River.

Palladium(II) sulfate, palladium(1) oxide, linearized palladium(II) and a mixture of Copper chloride +1
j(1).

Copper(II) chloride, *acid chloride (1) and mixtures thereof ρ)
used.

/l/ ) -, For example, D-glucose 1g VC
Add 2gk of water and add 25g of palladium chloride A]]
The complexing compound is heated to 50°C for 20 minutes and heated to 9°C, and this complexing compound is added to the pRSt at 80°C or higher.

In the Samurai complex compound, the chloride badge (111) is coordinated to the hydroxyl group of curcose, and when heated, the hydrogen bonded to the carbon atom adjacent to the carbon atom bonded to Mizushusaba. From rC, divalent υ 6-um t11 is reduced.
I would like to express my gratitude for the use of the 8 items in this book. Autumn soda is Pd
, Cu stones preferably have a content of hiI% or less.

(1) The sword that enshrines the enemy Hhidai 9 (the proboscis of law on the bathing armor)
When the anti-tau tribute is removed, 71 [] heat treatment is treated as 9, and on the surface it generates metal palladium and metal paulownia copper.

(2) Complexation 8mτ, Comunoenol Hetari M yM
After dispersing in the water, it is applied to the surface of the laminate plate which is coated with epoxy on a glass cloth, and then dried in a step Vk to form Kanahashi Palladium or Kanahashi Steel T#E.

(5) The complex compound τ is dispersed in an acetone bath containing epoxy resin and impregnated into a material such as varnished watercolor cloth, and a VCj layer is produced by applying an electric current. Brigreg υ
During drying, metal palladium or gold metal is generated by the heat generated when the laminate is heated and pressed.

(4) The complexing agent is dispersed in a polyester resin (/J organic bath solution) and then wrapped in a film using the IA method. A striped palladium overlay gold PA rectangle is produced.

(5) During the reconnaissance of tetravidron run on the complex compound t1 polyimide, it is heated for a minute V\y and treated with a steel wire (M). It is persuaded that due to the heat of time, Kinmen palladium father is generated by Kanatou@A. The catalytic properties of one line from the temple insulation are exposed by the samurai.

Jzutoah, '9J L 7C from vc, $, 1.
J (ZJ way ari next 4u point reach -1!-ra γL.

(1) The produced gold pail palladium or gold square sheet is the key.
Because of the sharpness, the axiality of the obtained B-section S-metal is 1 or 'rL.

(Since there is no need to use 214rJ gland soil etc. for the state body 1 history,
It is possible to use it for one time in a bath, and it is easy to mix evenly. (3) It is better to use electroless plating as it does not contain impurities across Sn and CJ.

5- AAI'

Claims (1)

[Claims] 1, 21! Complex compound Kenono 1 reacted with u palladium compound or monovalent % divalent copper compound r glucose
1 heat to generate metallic palladium T? Features: Electroless copper plating with activated Ti:.