FR2637764B1 - Appareil ameliore pour l'enlevement et l'installation de composants electriques par rapport a un support de circuits electriques et ensemble chauffant pour cet appareil - Google Patents

Appareil ameliore pour l'enlevement et l'installation de composants electriques par rapport a un support de circuits electriques et ensemble chauffant pour cet appareil

Info

Publication number
FR2637764B1
FR2637764B1 FR8902237A FR8902237A FR2637764B1 FR 2637764 B1 FR2637764 B1 FR 2637764B1 FR 8902237 A FR8902237 A FR 8902237A FR 8902237 A FR8902237 A FR 8902237A FR 2637764 B1 FR2637764 B1 FR 2637764B1
Authority
FR
France
Prior art keywords
relation
removal
installation
heating assembly
circuit holder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR8902237A
Other languages
English (en)
Other versions
FR2637764A1 (fr
Inventor
Louis A Abbagnaro
Robert G Brown
William J Siegel
William J Kautter
Robert S Quasney Sr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pace Inc
Original Assignee
Pace Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pace Inc filed Critical Pace Inc
Publication of FR2637764A1 publication Critical patent/FR2637764A1/fr
Application granted granted Critical
Publication of FR2637764B1 publication Critical patent/FR2637764B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0486—Replacement and removal of components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Automatic Assembly (AREA)
  • Supply And Installment Of Electrical Components (AREA)
FR8902237A 1988-02-22 1989-02-21 Appareil ameliore pour l'enlevement et l'installation de composants electriques par rapport a un support de circuits electriques et ensemble chauffant pour cet appareil Expired - Fee Related FR2637764B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/158,724 US4972990A (en) 1988-02-22 1988-02-22 Apparatus for removal and installing electronic components with respect to a substrate

Publications (2)

Publication Number Publication Date
FR2637764A1 FR2637764A1 (fr) 1990-04-13
FR2637764B1 true FR2637764B1 (fr) 1995-12-01

Family

ID=22569415

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8902237A Expired - Fee Related FR2637764B1 (fr) 1988-02-22 1989-02-21 Appareil ameliore pour l'enlevement et l'installation de composants electriques par rapport a un support de circuits electriques et ensemble chauffant pour cet appareil

Country Status (5)

Country Link
US (1) US4972990A (fr)
JP (1) JPH02140000A (fr)
DE (1) DE3905291A1 (fr)
FR (1) FR2637764B1 (fr)
GB (1) GB2217238B (fr)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4127696A1 (de) * 1991-08-21 1993-02-25 Adalbert Fritsch Vorrichtung zum positionieren von smd-bauelementen, insbesondere smd-chips
US5380982A (en) * 1993-07-23 1995-01-10 Fortune; William S. Metallic conduction - hot gas soldering-desoldering system
US5423938A (en) * 1993-08-16 1995-06-13 Hofius, Sr.; David V. Hot air cold form staking device
US5593083A (en) * 1995-02-14 1997-01-14 International Business Machines Corporation Castellated nozzle and method of use therof
DE19619523A1 (de) * 1996-05-15 1997-11-20 Bosch Gmbh Robert Kraftstoffeinspritzventil für Hochdruckeinspritzung
US6474530B1 (en) 1997-02-19 2002-11-05 Pace, Incorporated Adaptor assembly for interchangeably mounting hot air solder reflow nozzles to soldering/desoldering apparatus
US5890646A (en) * 1997-02-19 1999-04-06 Pace, Incorporated Soldering/desoldering apparatus with spring-loaded floating vacuum pickup device
KR100283744B1 (ko) * 1997-08-01 2001-04-02 윤종용 집적회로실장방법
WO1999027564A1 (fr) * 1997-11-20 1999-06-03 Matsushita Electric Industrial Co., Ltd. Dispositif de rechauffement et de pression servant au montage de composants electroniques, dispositif et procede servant a monter des composants electroniques
US6196439B1 (en) * 1998-05-29 2001-03-06 International Business Machines Corporation Method and apparatus for μBGA removal and reattach
US6182884B1 (en) * 1998-12-10 2001-02-06 International Business Machines Corporation Method and apparatus for reworking ceramic ball grid array or ceramic column grid array on circuit cards
US6220503B1 (en) 1999-02-02 2001-04-24 International Business Machines Corporation Rework and underfill nozzle for electronic components
JP2001036232A (ja) * 1999-07-23 2001-02-09 Hitachi Ltd ハンダ除去装置
US6216938B1 (en) * 1999-09-30 2001-04-17 International Business Machines Corporation Machine and process for reworking circuit boards
US6761304B2 (en) * 2000-11-13 2004-07-13 Czeslaw A. Ruszowski Heating head for soldering and de-soldering of SMD components
JP4126996B2 (ja) * 2002-03-13 2008-07-30 セイコーエプソン株式会社 デバイスの製造方法及びデバイス製造装置
US6745932B2 (en) * 2002-09-03 2004-06-08 International Business Machines Corp. Low strain chip removal apparatus
US7270735B2 (en) * 2003-01-21 2007-09-18 Seagate Technology Llc System and method for holding and releasing a workpiece for electrochemical machining
WO2008006239A1 (fr) * 2006-06-14 2008-01-17 Yu-Ju Hsiao Unité de dessoudage photothermique
US7681776B2 (en) * 2006-08-01 2010-03-23 Raytheon Company Methods and apparatus for efficiently generating profiles for circuit board work/rework
US20090155958A1 (en) * 2007-12-13 2009-06-18 Boris Kolodin Robust die bonding process for led dies
US8870051B2 (en) 2012-05-03 2014-10-28 International Business Machines Corporation Flip chip assembly apparatus employing a warpage-suppressor assembly
US9036354B2 (en) * 2013-01-15 2015-05-19 Flextronics, Ap, Llc Heat sink thermal press for phase change heat sink material
US9180539B1 (en) * 2014-03-18 2015-11-10 Flextronics Ap, Llc Method of and system for dressing RF shield pads
US10046409B2 (en) * 2016-09-08 2018-08-14 Raytheon Company Methods of making an electrical connection, and of making a receptacle for receiving an electrical device
CN106735684B (zh) * 2017-01-11 2024-04-26 东莞市崴泰电子有限公司 一种pcba通孔直插器件自动返修机
CN109676211A (zh) * 2019-01-30 2019-04-26 西安中科麦特电子技术设备有限公司 一种全自动拆焊返修系统

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3831252A (en) * 1973-04-16 1974-08-27 C Miller Assembling and securing machine
FR2365209A1 (fr) * 1976-09-20 1978-04-14 Cii Honeywell Bull Procede pour le montage de micro-plaquettes de circuits integres sur un substrat et installation pour sa mise en oeuvre
US4166562A (en) * 1977-09-01 1979-09-04 The Jade Corporation Assembly system for microcomponent devices such as semiconductor devices
US4135630A (en) * 1977-12-08 1979-01-23 Universal Instruments Corporation Centering device for automatic placement of chip components in hybrid circuits
US4274576A (en) * 1979-11-13 1981-06-23 International Business Machines Corporation Cryogenic chip removal technique
US4295596A (en) * 1979-12-19 1981-10-20 Western Electric Company, Inc. Methods and apparatus for bonding an article to a metallized substrate
US4426571A (en) * 1980-06-19 1984-01-17 Sperry Corporation Portable electric hot air rework tool for soldering and desoldering printed circuit assemblies
JPS58155793A (ja) * 1982-03-11 1983-09-16 株式会社東芝 フラツトパツケ−ジ形電子部品の実装方法およびその装置
US4659004A (en) * 1984-02-24 1987-04-21 Pace, Incorporated Device for attaching modular electronic components to or removing them from an insulative device
GB2154921B (en) * 1984-02-24 1988-06-08 Pace Inc Device for attaching modular electronic components to or removing them from an insulative substrate
US4610388A (en) * 1984-02-24 1986-09-09 Eldon Industries, Inc. Circuit board and component manipulation device
US4605152A (en) * 1984-02-24 1986-08-12 Pace, Incorporated Device for attaching modular electronic components to or removing them from an insulative substrate
JPS60231391A (ja) * 1984-04-29 1985-11-16 横田機械株式会社 電子部品の半田溶解装置
US4634043A (en) * 1984-09-20 1987-01-06 At&T Technologies, Inc. Engaging second articles to engaged first articles
US4606492A (en) * 1984-10-03 1986-08-19 Eastman Kodak Company Method and apparatus for soldering
EP0233018B1 (fr) * 1986-02-01 1991-08-07 THE GENERAL ELECTRIC COMPANY, p.l.c. Dispositif de soudage
US4696096A (en) * 1986-02-21 1987-09-29 Micro Electronic Systems, Inc. Reworking methods and apparatus for surface mounted technology circuit boards
US4752025A (en) * 1987-05-22 1988-06-21 Austin American Technology Surface mount assembly repair terminal
US4787548A (en) * 1987-07-27 1988-11-29 Pace Incorporated Nozzle structure for soldering and desoldering

Also Published As

Publication number Publication date
GB2217238A (en) 1989-10-25
JPH02140000A (ja) 1990-05-29
DE3905291A1 (de) 1989-08-31
US4972990A (en) 1990-11-27
GB8903805D0 (en) 1989-04-05
FR2637764A1 (fr) 1990-04-13
GB2217238B (en) 1992-08-26

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Legal Events

Date Code Title Description
ST Notification of lapse