FR2618020B1 - Procede de montage de dispositifs semi-conducteurs et dispositif pour la realisation de ce procede - Google Patents

Procede de montage de dispositifs semi-conducteurs et dispositif pour la realisation de ce procede

Info

Publication number
FR2618020B1
FR2618020B1 FR878707595A FR8707595A FR2618020B1 FR 2618020 B1 FR2618020 B1 FR 2618020B1 FR 878707595 A FR878707595 A FR 878707595A FR 8707595 A FR8707595 A FR 8707595A FR 2618020 B1 FR2618020 B1 FR 2618020B1
Authority
FR
France
Prior art keywords
carrying
semiconductor devices
mounting semiconductor
mounting
devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR878707595A
Other languages
English (en)
French (fr)
Other versions
FR2618020A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GULYAEV ALEXANDR
KALACHEV VALERY
MELNIK VITALY
SIZOV VYACHESLAV
SLAVINSKY ZINOVY
Original Assignee
GULYAEV ALEXANDR
KALACHEV VALERY
MELNIK VITALY
SIZOV VYACHESLAV
SLAVINSKY ZINOVY
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GULYAEV ALEXANDR, KALACHEV VALERY, MELNIK VITALY, SIZOV VYACHESLAV, SLAVINSKY ZINOVY filed Critical GULYAEV ALEXANDR
Publication of FR2618020A1 publication Critical patent/FR2618020A1/fr
Application granted granted Critical
Publication of FR2618020B1 publication Critical patent/FR2618020B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
    • B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to investigating the properties, e.g. the weldability, of materials
    • B23K31/125—Weld quality monitoring
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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • Wire Bonding (AREA)
  • Wire Processing (AREA)
FR878707595A 1987-05-26 1987-05-29 Procede de montage de dispositifs semi-conducteurs et dispositif pour la realisation de ce procede Expired - Fee Related FR2618020B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB08712311A GB2205053A (en) 1987-05-26 1987-05-26 Method and arrangement for interconnection of semiconductor devices

Publications (2)

Publication Number Publication Date
FR2618020A1 FR2618020A1 (fr) 1989-01-13
FR2618020B1 true FR2618020B1 (fr) 1991-04-19

Family

ID=10617902

Family Applications (1)

Application Number Title Priority Date Filing Date
FR878707595A Expired - Fee Related FR2618020B1 (fr) 1987-05-26 1987-05-29 Procede de montage de dispositifs semi-conducteurs et dispositif pour la realisation de ce procede

Country Status (4)

Country Link
CH (1) CH673908A5 (enrdf_load_stackoverflow)
DE (1) DE3717856A1 (enrdf_load_stackoverflow)
FR (1) FR2618020B1 (enrdf_load_stackoverflow)
GB (1) GB2205053A (enrdf_load_stackoverflow)

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Publication number Priority date Publication date Assignee Title
DE10315639A1 (de) * 2003-04-04 2004-11-04 Hesse & Knipps Gmbh Verfahren und Vorrichtung zur Prüfung einer Drahtbondverbindung
CN1956816A (zh) * 2004-06-01 2007-05-02 赫西和奈普斯有限责任公司 用于检验引线焊接连接的方法及装置
CN114473280B (zh) * 2022-02-23 2023-11-24 广西桂芯半导体科技有限公司 一种芯片封装焊线装置

Family Cites Families (4)

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Publication number Priority date Publication date Assignee Title
NL7406783A (nl) * 1974-05-21 1975-11-25 Philips Nv Werkwijze voor het aanbrengen van een draad- verbinding aan een halfgeleiderinrichting.
SU740448A1 (ru) * 1978-04-03 1980-06-15 Предприятие П/Я Р-6495 Автоматическа установка дл присоединени проволочных выводов внахлестку
SU821100A1 (ru) * 1979-02-23 1981-04-15 Предприятие П/Я Р-6495 Установка дл присоединени про-ВОлОчНыХ ВыВОдОВ
JPS58192688A (ja) * 1982-04-30 1983-11-10 Chiyouonpa Kogyo Kk ワイヤボンデイング装置におけるワイヤル−プ整形方法

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GB8712311D0 (en) 1987-07-01
GB2205053A (en) 1988-11-30
FR2618020A1 (fr) 1989-01-13
CH673908A5 (enrdf_load_stackoverflow) 1990-04-12
DE3717856A1 (de) 1988-12-08

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