FR2585209B1 - WIRE TRACK CIRCUIT BOARDS AND THEIR MANUFACTURING METHOD - Google Patents
WIRE TRACK CIRCUIT BOARDS AND THEIR MANUFACTURING METHODInfo
- Publication number
- FR2585209B1 FR2585209B1 FR8609789A FR8609789A FR2585209B1 FR 2585209 B1 FR2585209 B1 FR 2585209B1 FR 8609789 A FR8609789 A FR 8609789A FR 8609789 A FR8609789 A FR 8609789A FR 2585209 B1 FR2585209 B1 FR 2585209B1
- Authority
- FR
- France
- Prior art keywords
- manufacturing
- circuit boards
- track circuit
- wire track
- tacky
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/222—Completing of printed circuits by adding non-printed jumper connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10287—Metal wires as connectors or conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0736—Methods for applying liquids, e.g. spraying
- H05K2203/0746—Local treatment using a fluid jet, e.g. for removing or cleaning material; Providing mechanical pressure using a fluid jet
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0776—Uses of liquids not otherwise provided for in H05K2203/0759 - H05K2203/0773
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49162—Manufacturing circuit on or in base by using wire as conductive path
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Emergency Protection Circuit Devices (AREA)
- Reinforced Plastic Materials (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Laser Beam Processing (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
In a process for scribing conductors in a predetermined pattern onto a surface of a substrate being adhesive coated, the adhesive coating being non-tacky and solid before activation and activatable by application of energy which may be applied by means of a pulsed radiation or heated fluid beam, and revert to the non-tacky, solid state after activation.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/756,722 US4711026A (en) | 1985-07-19 | 1985-07-19 | Method of making wires scribed circuit boards |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2585209A1 FR2585209A1 (en) | 1987-01-23 |
FR2585209B1 true FR2585209B1 (en) | 1994-03-11 |
Family
ID=25044766
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR8609789A Expired - Fee Related FR2585209B1 (en) | 1985-07-19 | 1986-07-04 | WIRE TRACK CIRCUIT BOARDS AND THEIR MANUFACTURING METHOD |
Country Status (9)
Country | Link |
---|---|
US (1) | US4711026A (en) |
EP (1) | EP0212227B1 (en) |
JP (1) | JPS6284596A (en) |
AT (1) | ATE59129T1 (en) |
AU (1) | AU594352B2 (en) |
CA (1) | CA1251576A (en) |
DE (2) | DE3676128D1 (en) |
FR (1) | FR2585209B1 (en) |
GB (1) | GB2180696B (en) |
Families Citing this family (60)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4859807A (en) * | 1985-07-19 | 1989-08-22 | Kollmorgen Technologies Corporation | Wire scribed circuit boards and method of manufacture |
US4711026A (en) * | 1985-07-19 | 1987-12-08 | Kollmorgen Technologies Corporation | Method of making wires scribed circuit boards |
FR2585210B1 (en) * | 1985-07-19 | 1994-05-06 | Kollmorgen Technologies Corp | METHOD FOR MANUFACTURING WAFERS WITH INTERCONNECTION CIRCUITS |
US4642321A (en) * | 1985-07-19 | 1987-02-10 | Kollmorgen Technologies Corporation | Heat activatable adhesive for wire scribed circuits |
US4918260A (en) * | 1985-07-26 | 1990-04-17 | Preleg, Inc. | Adhesive-coated wire and method and printed circuit board using same |
US4864723A (en) * | 1986-07-01 | 1989-09-12 | Preleg, Inc. | Electrical circuit modification method |
US4908939A (en) * | 1985-10-18 | 1990-03-20 | Kollmorgen Corporation | Method of making coaxial interconnection boards |
JPS63271996A (en) * | 1987-04-28 | 1988-11-09 | Fanuc Ltd | Printed board for large current |
NL8802249A (en) * | 1988-09-13 | 1990-04-02 | Du Pont Nederland | FASTENING FRAME AND FILTER UNIT FOR CONNECTORS. |
DE3831394A1 (en) * | 1988-09-15 | 1990-03-22 | Prithwis Basu | Method and device for making contact between an electrical lead wire and contact points on a printed circuit board |
US4972050A (en) * | 1989-06-30 | 1990-11-20 | Kollmorgen Corporation | Wire scribed circuit boards and methods of their manufacture |
US5575932A (en) * | 1994-05-13 | 1996-11-19 | Performance Controls, Inc. | Method of making densely-packed electrical conductors |
US20030062889A1 (en) * | 1996-12-12 | 2003-04-03 | Synaptics (Uk) Limited | Position detector |
US6249234B1 (en) | 1994-05-14 | 2001-06-19 | Absolute Sensors Limited | Position detector |
DE19512725C1 (en) * | 1995-04-05 | 1996-09-12 | Orga Kartensysteme Gmbh | ID card or the like in the form of a chip card |
JPH0955464A (en) * | 1995-06-09 | 1997-02-25 | Mitsubishi Electric Corp | Surface-mount semiconductor device semiconductor mounted part, and their manufacture |
ES2146989T3 (en) * | 1996-02-12 | 2000-08-16 | David Finn | PROCEDURE AND DEVICE FOR THE CONTACT OF A WIRE CONDUCTOR. |
DE19618917C1 (en) * | 1996-05-12 | 1997-10-02 | Markus Woelfel | Resin-sealed wired circuit board manufacturing method |
US6788221B1 (en) | 1996-06-28 | 2004-09-07 | Synaptics (Uk) Limited | Signal processing apparatus and method |
DE19705934C2 (en) * | 1997-02-15 | 2001-05-17 | Cubit Electronics Gmbh | Method and device for introducing wire-shaped conductor wires into a substrate |
US6705511B1 (en) | 1997-05-28 | 2004-03-16 | Synaptics (Uk) Limited | Transducer and method of manufacture |
GB9720954D0 (en) | 1997-10-02 | 1997-12-03 | Scient Generics Ltd | Commutators for motors |
GB9721891D0 (en) | 1997-10-15 | 1997-12-17 | Scient Generics Ltd | Symmetrically connected spiral transducer |
US6005991A (en) * | 1997-11-26 | 1999-12-21 | Us Conec Ltd | Printed circuit board assembly having a flexible optical circuit and associated fabrication method |
US6245822B1 (en) * | 1998-04-27 | 2001-06-12 | Matsushita Electric Industrial Co. Ltd. | Method and apparatus for decomposition treating article having cured thermosetting resin |
GB9811151D0 (en) | 1998-05-22 | 1998-07-22 | Scient Generics Ltd | Rotary encoder |
ATE250784T1 (en) | 1998-11-27 | 2003-10-15 | Synaptics Uk Ltd | POSITION SENSOR |
US7019672B2 (en) * | 1998-12-24 | 2006-03-28 | Synaptics (Uk) Limited | Position sensor |
US6073344A (en) * | 1999-01-28 | 2000-06-13 | International Business Machines Corporation | Laser segmentation of plated through-hole sidewalls to form multiple conductors |
US6535535B1 (en) * | 1999-02-12 | 2003-03-18 | Semiconductor Energy Laboratory Co., Ltd. | Laser irradiation method, laser irradiation apparatus, and semiconductor device |
US6640434B1 (en) * | 2000-04-11 | 2003-11-04 | Lear Corporation | Method of forming an electrical circuit on a substrate |
US6486408B1 (en) * | 2000-10-31 | 2002-11-26 | Hewlett-Packard Company | Flexible circuit using discrete wiring |
US7511705B2 (en) | 2001-05-21 | 2009-03-31 | Synaptics (Uk) Limited | Position sensor |
TW548816B (en) * | 2002-01-23 | 2003-08-21 | Via Tech Inc | Formation method of conductor pillar |
GB2403017A (en) | 2002-03-05 | 2004-12-22 | Synaptics | Position sensor |
US7907130B2 (en) | 2002-06-05 | 2011-03-15 | Synaptics (Uk) Limited | Signal transfer method and apparatus |
GB0317370D0 (en) | 2003-07-24 | 2003-08-27 | Synaptics Uk Ltd | Magnetic calibration array |
GB0319945D0 (en) | 2003-08-26 | 2003-09-24 | Synaptics Uk Ltd | Inductive sensing system |
EP2039460A3 (en) * | 2004-11-02 | 2014-07-02 | HID Global GmbH | Relocation device, contacting device, delivery system, relocation and contacting unit production facility, production method and a transponder unit |
US8286332B2 (en) | 2006-09-26 | 2012-10-16 | Hid Global Gmbh | Method and apparatus for making a radio frequency inlay |
US7971339B2 (en) * | 2006-09-26 | 2011-07-05 | Hid Global Gmbh | Method and apparatus for making a radio frequency inlay |
DE102006050785A1 (en) * | 2006-10-27 | 2008-05-08 | Robert Bosch Gmbh | Printed circuit board for processing control current and output current in drive controller, has conductor partially extending above paths, such that guidance of supply current to path from board terminal to another terminal is enabled |
DE102006053697A1 (en) * | 2006-11-13 | 2008-05-29 | Häusermann GmbH | Circuit board with additive and integrated and ultrasonically contacted copper elements and method of manufacture and application |
WO2008139216A2 (en) | 2007-05-10 | 2008-11-20 | Cambridge Integrated Circuits Limited | Transducer |
KR100882261B1 (en) * | 2007-07-25 | 2009-02-06 | 삼성전기주식회사 | Manufacturing method and system of printed circuit board |
ATE488816T1 (en) * | 2007-09-18 | 2010-12-15 | Hid Global Ireland Teoranta | METHOD FOR CONTACTING A WIRE CONDUCTOR PLACED ON A SUBSTRATE |
US20100320179A1 (en) * | 2007-10-16 | 2010-12-23 | Hideki Morita | Method for Creating Trench in U Shape in Brittle Material Substrate, Method for Removing Process, Method for Hollowing Process and Chamfering Method Using Same |
US7708607B2 (en) * | 2008-08-28 | 2010-05-04 | Unitech Printed Circuit Board Corp. | Precision printed circuit board testing tool |
GB2488389C (en) | 2010-12-24 | 2018-08-22 | Cambridge Integrated Circuits Ltd | Position sensing transducer |
US9414501B2 (en) | 2012-01-04 | 2016-08-09 | Board Of Regents, The University Of Texas System | Method for connecting inter-layer conductors and components in 3D structures |
GB2503006B (en) | 2012-06-13 | 2017-08-09 | Cambridge Integrated Circuits Ltd | Position sensing transducer |
CN103144378B (en) * | 2013-01-28 | 2015-03-25 | 广东生益科技股份有限公司 | Copper-clad plate (CCL) and printed circuit board (PCB) of phenol novolac (PN) curing system and manufacturing method thereof |
JP2013219404A (en) * | 2013-08-02 | 2013-10-24 | Sumida Corporation | Method for manufacturing antenna component |
US10099315B2 (en) * | 2014-06-27 | 2018-10-16 | Jabil Inc. | System, apparatus and method for hybrid function micro welding |
US9736932B1 (en) * | 2015-01-20 | 2017-08-15 | Flextronics Ap, Llc. | Magnet wire for 3D electronic circuitry |
US10321560B2 (en) | 2015-11-12 | 2019-06-11 | Multek Technologies Limited | Dummy core plus plating resist restrict resin process and structure |
US9999134B2 (en) | 2016-03-14 | 2018-06-12 | Multek Technologies Limited | Self-decap cavity fabrication process and structure |
US10064292B2 (en) * | 2016-03-21 | 2018-08-28 | Multek Technologies Limited | Recessed cavity in printed circuit board protected by LPI |
US11224117B1 (en) | 2018-07-05 | 2022-01-11 | Flex Ltd. | Heat transfer in the printed circuit board of an SMPS by an integrated heat exchanger |
CN114379260B (en) * | 2021-09-02 | 2023-09-26 | 苏州清听声学科技有限公司 | Directional sound production screen insulation bump silk-screen printing method |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3353263A (en) * | 1964-08-17 | 1967-11-21 | Texas Instruments Inc | Successively stacking, and welding circuit conductors through insulation by using electrodes engaging one conductor |
US3674914A (en) * | 1968-02-09 | 1972-07-04 | Photocircuits Corp | Wire scribed circuit boards and method of manufacture |
US3674602A (en) * | 1969-10-09 | 1972-07-04 | Photocircuits Corp | Apparatus for making wire scribed circuit boards |
JPS5550399B1 (en) * | 1970-03-05 | 1980-12-17 | ||
JPS5025054B1 (en) * | 1970-10-30 | 1975-08-20 | ||
JPS50100574A (en) * | 1974-01-09 | 1975-08-09 | ||
US3981076A (en) * | 1974-11-27 | 1976-09-21 | Commissariat A L'energie Atomique | Method of connecting electronic microcomponents |
FR2304247A1 (en) * | 1975-03-12 | 1976-10-08 | Commissariat Energie Atomique | METHOD AND DEVICE FOR INTERCONNECTING ELECTRONIC COMPONENTS |
US4031612A (en) * | 1976-03-02 | 1977-06-28 | Commissariat A L'energie Atomique | Method and a device for the interconnection of electronic components |
ZA775455B (en) * | 1977-08-09 | 1978-07-26 | Kollmorgen Tech Corp | Improved methods and apparatus for making scribed circuit boards |
JPS5439633A (en) * | 1977-09-02 | 1979-03-27 | Hitachi Chemical Co Ltd | Multiistylus head and method of making same |
JPS5466464A (en) * | 1977-11-04 | 1979-05-29 | Oki Electric Ind Co Ltd | Simple preparation of circuit substrate |
US4327124A (en) * | 1978-07-28 | 1982-04-27 | Desmarais Jr Raymond C | Method for manufacturing printed circuits comprising printing conductive ink on dielectric surface |
JPS5536938A (en) * | 1978-09-04 | 1980-03-14 | Nippon Electric Co | Circuit board |
FR2458978A2 (en) * | 1979-06-07 | 1981-01-02 | Commissariat Energie Atomique | METHOD AND DEVICE FOR INTERCONNECTING ELECTRONIC COMPONENTS |
JPS5613013A (en) * | 1979-07-14 | 1981-02-07 | Kurita Water Ind Ltd | Removing method of scale |
DE3035090C2 (en) * | 1979-09-28 | 1995-01-26 | Cii Honeywell Bull | Device for wiring substrate surfaces |
JPS57136391A (en) * | 1981-02-17 | 1982-08-23 | Nippon Electric Co | Method and device for wiring circuit board |
US4500389A (en) * | 1981-04-14 | 1985-02-19 | Kollmorgen Technologies Corporation | Process for the manufacture of substrates to interconnect electronic components |
US4414741A (en) * | 1981-05-22 | 1983-11-15 | Augat Inc. | Process for interconnecting components on a PCB |
US4450623A (en) * | 1981-12-18 | 1984-05-29 | Kollmorgen Technologies Corporation | Process for the manufacture of circuit boards |
US4427478A (en) * | 1982-06-28 | 1984-01-24 | International Business Machines Corporation | Process for making an encapsulated circuit board and products made thereby |
EP0113820B1 (en) * | 1982-12-22 | 1987-09-09 | International Business Machines Corporation | Method and apparatus for embedding wire in a photocurable adhesive |
DE3408338A1 (en) * | 1984-03-07 | 1985-09-12 | Siemens AG, 1000 Berlin und 8000 München | METHOD AND DEVICE FOR LAYING A SWITCHING WIRE ON A CARRIER PLATE |
FR2585210B1 (en) * | 1985-07-19 | 1994-05-06 | Kollmorgen Technologies Corp | METHOD FOR MANUFACTURING WAFERS WITH INTERCONNECTION CIRCUITS |
US4693778A (en) * | 1985-07-19 | 1987-09-15 | Kollmorgen Technologies Corporation | Apparatus for making scribed circuit boards and circuit board modifications |
US4711026A (en) * | 1985-07-19 | 1987-12-08 | Kollmorgen Technologies Corporation | Method of making wires scribed circuit boards |
-
1985
- 1985-07-19 US US06/756,722 patent/US4711026A/en not_active Expired - Lifetime
-
1986
- 1986-07-04 FR FR8609789A patent/FR2585209B1/en not_active Expired - Fee Related
- 1986-07-12 AT AT86109558T patent/ATE59129T1/en not_active IP Right Cessation
- 1986-07-12 EP EP86109558A patent/EP0212227B1/en not_active Expired - Lifetime
- 1986-07-12 DE DE8686109558T patent/DE3676128D1/en not_active Expired - Lifetime
- 1986-07-16 GB GB8617363A patent/GB2180696B/en not_active Expired
- 1986-07-18 CA CA000514114A patent/CA1251576A/en not_active Expired
- 1986-07-18 DE DE19863624627 patent/DE3624627A1/en not_active Withdrawn
- 1986-07-18 AU AU60353/86A patent/AU594352B2/en not_active Ceased
- 1986-07-19 JP JP61171467A patent/JPS6284596A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
EP0212227A2 (en) | 1987-03-04 |
JPS6284596A (en) | 1987-04-18 |
ATE59129T1 (en) | 1990-12-15 |
GB2180696B (en) | 1989-07-19 |
AU594352B2 (en) | 1990-03-08 |
GB2180696A (en) | 1987-04-01 |
GB8617363D0 (en) | 1986-08-20 |
EP0212227B1 (en) | 1990-12-12 |
US4711026A (en) | 1987-12-08 |
AU6035386A (en) | 1987-01-22 |
DE3624627A1 (en) | 1987-01-29 |
DE3676128D1 (en) | 1991-01-24 |
EP0212227A3 (en) | 1987-05-13 |
FR2585209A1 (en) | 1987-01-23 |
CA1251576A (en) | 1989-03-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
FR2585209B1 (en) | WIRE TRACK CIRCUIT BOARDS AND THEIR MANUFACTURING METHOD | |
ATE63191T1 (en) | PROCESSES AND COATING AGENTS FOR APPLYING ELECTRICALLY CONDUCTIVE PRINTED IMAGES TO INSULATING SUBSTRATES. | |
AU595519B2 (en) | Apparatus for making scribed circuit boards and circuit board modifications | |
DE3860511D1 (en) | METHOD FOR THE PRODUCTION OF CIRCUIT BOARDS. | |
FR2585210B1 (en) | METHOD FOR MANUFACTURING WAFERS WITH INTERCONNECTION CIRCUITS | |
NL191641C (en) | Method for manufacturing a base plate with a conductor pattern from many wires for use as a carrier of electronic components. | |
ATE17815T1 (en) | MANUFACTURING PROCESSES FOR AND CIRCUIT BOARDS MANUFACTURED ACCORDING TO THIS PROCESS. | |
DE3681222D1 (en) | METHOD FOR CHEMICALLY METALLIZING AN ELECTRICALLY POOR CONDUCTING BODY FROM AN INORGANIC MATERIAL. | |
SE8101360L (en) | PROCEDURE FOR MANUFACTURING PRINTED LEADER PLATES WITH PERFORTS, WHICH WALLS ARE METALLIZED | |
EP0259727A3 (en) | Process for obtaining heat-resistant structural layers based on epoxy resins | |
DE59004525D1 (en) | METHOD FOR COATING ELECTRICALLY CONDUCTIVE SUBSTRATES. | |
DE68917695T2 (en) | Method for producing conductor tracks within an insulating substrate. | |
KR910005445A (en) | Manufacturing Method of Thick Film Circuit Board | |
EP0206159A3 (en) | Process for the preparation of thermostable structured layers, and their use | |
EP0232983A3 (en) | Multilayer systems and their method of production | |
JPS56165333A (en) | Mounting method for electronic parts | |
DE102009017306B4 (en) | Device for selectively transferring a microstructured component | |
GB2004499A (en) | Transferring coatings of adhesives to laminates | |
DE68922949D1 (en) | Process for melt coating in an atmosphere with controlled oxidizability. | |
ATE65724T1 (en) | PROCESS FOR APPLYING A SOLDER COATING TO METALLIC OR METALLIZED SURFACES OF COMPONENTS. | |
JPH04303992A (en) | Manufacture of printed wiring board | |
ATA388581A (en) | METHOD AND DEVICE FOR ION-BASED COATING ELECTRICALLY INSULATING SUBSTRATES | |
JPH01201991A (en) | Mounting electronic parts | |
RU93043835A (en) | METHOD OF MANUFACTURING PRINTED SCHEMES | |
ATE101207T1 (en) | METHOD OF COATING ELECTRICALLY CONDUCTIVE SUBSTRATES. |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
TP | Transmission of property | ||
TP | Transmission of property | ||
ST | Notification of lapse | ||
ST | Notification of lapse | ||
ST | Notification of lapse |