DE3831394A1 - Method and device for making contact between an electrical lead wire and contact points on a printed circuit board - Google Patents

Abstract

A method and a device for making contact between a corrective conductor (pink wire) and conductor runs on a printed circuit which is provided on a circuit board, in the case of which method and device the corrective conductor is fitted, in order to modify the printed circuit, between the completion of the printed circuit on the printed circuit board and the population of the circuit board with the components, a power supply in order to make electrical contact with the corrective conductor being selected which is greater than the power supply which is used for subsequently making contact with the components.

Description

The invention relates to a method according to the preamble of claim 1 and a device according to the preamble of claim 19.

Through printed circuits, the conductor tracks on one flat circuit board are arranged, the wiring gene or electrical connections from on the circuit board attached components reached. Usually are On closing elements of the components in holes in the circuit board inserted and with the cable lines by diving together solder or connected by soldering processes using SMD technology. Manufacturing is rationalized through printed circuits sized, the possible errors are avoided when interconnected wrestles, and you get a car with increased quality automation of the manufacturing process. In mass production of printed circuits on printed circuit boards do not avoid unwanted interruptions in the conductor trains through hairline cracks and the like Carry out a circuit. However, it is often also desirable to subsequently modify the printed circuit and change. So far, one has after the assembly of the circuit boards with the components by subsequently Correction manager, also known as "blue wires ", either the corresponding Errors corrected or subsequently corrected brought about changes in the circuit. One of the like subsequent attachment of the correction manager  extremely troublesome since it is desirable to do this correction ter on the component side, and the correction conduct through the components on the circuit board to cover the appearance as much as possible not to change the entire assembly on the circuit board. These correction managers had to be contacted by hand and between or below those on the circuit board Components are laid. This process is extremely difficult sam and completely unsuitable for automation.

Furthermore, the production of small series and Prototypes of circuits the requirement that these without great effort can be made and if necessary Modifications of the circuits, especially in the Erpro Practice prototypes that can be done quickly.

The object of the invention is therefore a method and To create device of the type mentioned, with which a simple attachment of electrical wire at contact points on the printed circuit board at the Ent Development and change of circuits, especially ge printed circuits.

This object is achieved according to the invention by the device in claim 1 and device by that in claim 19 specified features solved.

By the method specified in claim 2 is a professional attachment of a as correction manager (blue wires) Lead wire to change and modify the printed circuit reached.

By the method specified in claim 3 can be  Prototypes for the development of circuits and small series in a simple way. It becomes a additive process for line laying created at which the connection establishment of the circuit exclusively with Line wires are made on a raster hole printed circuit board. This can affect the galvanic application in the circuit manufacturing can be dispensed with. So far, for example required the printed circuit on the circuit board to produce galvanically and then by machining Machining to produce the desired circuit structure. By the method specified in claim 3, this is Avoided effort. In the subclaims 4 to 18 are Wei further developments of the procedural solution according to the invention specified.

In the device mentioned at the outset, it becomes the task solved according to the invention by a welding device with a wire holding device for the correction wire tet, the movement of which is driven by a drive device controls that the wire point to be contacted to a certain contact point of the printed circuit is created, and by means for supplying the welding energy to a point of contact between the one to be contacted Wire location and the contact point of the printed circuit.

This also allows automation of the subsequent Chen attaching correction managers to change existing ones printed circuit boards. This will be a significant one Rationalization of the manufacturing process achieved. Furthermore, this also means that the committee that was previously incurred is simple goods would subsequently be made functional again.

So that the contact between the lead wire or Correction manager and the corresponding contact points of the  Conductor tracks when subsequently fitting the construction elements and contacting the components, which is usually by joint dip soldering or also in SMD technology follows, is not separated again, it is advantageous that Contacting for the lead wire from a higher ener to make the supply more dependent than they are for dip soldering or the SMD technology is required. This can be achieved be that for contacting the lead wire NEN wire ends or at other points of the if necessary serving as a correction conductor line wire a higher temperature is to be applied than it is subsequently when contacting the components, especially when ge joint dip soldering or a soldering process according to the SMD Technology.

As the preferred technique for contacting the correction welding technology lends itself well, but here before is contacted with the help of a laser beam. The Laser beam can be easily through optics, e.g. B. through a focusing lens on a focal point focus so that contacting on certain wire represent precisely localizable in the focal area of the focused laser beam can be performed.

Resistance is another welding technique welding and electron beam welding with which also localized quickly high temperatures how they are beneficial for contacting achieved will. If, as is usually the case, the ladder pulls out the printed circuit and the correction wire If copper is present, the copper will melt the contact point at a melting temperature of about 1085 ° C. Allow through the specified welding procedures the temperatures required for welding are short  reach in a timely and local manner, so that a cer Malfunction of the circuit board on which the printed scarf tion is applied, remains avoided. Also becomes surplus heat quickly from the point to be contacted through the remaining part of the correction wire derived.

A further simplification of the assembly with the corrective turleiter can be achieved by this with the deducted the required length from a supply roll will. The correction wire can go through the same Energy source, d. H. through laser beam energy, through elec resistance heat or electrons radiation energy can be cut to length. Here can you can use the same energy source as you did with the Welding process is used for contacting. Before A laser beam is used because it depends the energy of the laser depends on the pump power supplied simply controls rays.

At the high temperatures used Layers of tin, which are printed on the printed circuit Circuit or even on the copper wire of the correction conductor are present, evaporated away before the welding process, so that it does not affect the welding process at the welding point pregnant.

It is also advantageous to fix the correction head on the circuit board. The fixation can be in certain places of the correction manager. This can be done, for example the wire insulation softened or melted be and then cool again, so that one Fixation on the circuit board achieved. To this This also ensures that the correction manager in  a desired shape or positioning on the ladder plate is held so that the subsequent assembly is not hindered by the components. The correction wire can be in a desired course on the circuit board to be ordered. There are also adhesive films for this with which the correction manager is fixed. Furthermore, NEN also on the circuit board, for example by gluing adhesive molded parts, the stamped parts, injection molded parts or Like. Can be to fix the correction manager multiple places on the circuit board.

The preferred wire locations where the contacting is performed, the ends of the correction wire. It However, it is also possible to use the correction wire on one or any number of additional positions with the ladder trains to contact the printed circuit. You can also more than a correction wire to change the printed Circuit can be used. Of course, contacting of the components on the circuit board also using SMD technology be carried out, the heat supply using IR radiation or other suitable means can be done.

Exemplary embodiments of the invention are shown in the figures posed. It shows:

Fig. 1 shows a schematic representation of an apparatus for contacting a lead wire or correction conductor with a conductor tracks provided on a printed circuit board circuit which is an embodiment of the invention;

Fig. 2 shows a second embodiment of the invention, in which a laser beam is used for contacting a wire;

Fig. 3 shows a third embodiment of the invention, in which resistance welding or spot welding is used for contacting the line wire;

Fig. 4 shows a fourth embodiment of the invention, in which an electron beam is used to contact a wire;

Fig. 5 is a schematic representation of a guide device for the lead wire at a bending point;

Fig. 6 to 9 different embodiments of fixing means for fixing the lead wire on the circuit board;

Fig. 10 shows an embodiment for a wire holding device;

Fig. 11 shows a fifth embodiment of the invention for a modified over the embodiment of Figure 2 arrangement of the laser beam.

Fig. 12 shows another embodiment of the invention in a breadboard and

Fig. 13 shows another embodiment for fixing the lead wire.

In Fig. 1, an embodiment of a device for contacting a lead wire, in particular correction conductor with conductors of a circuit board 15 is shown schematically. This device has a drive device to 4 for a welding device 1, it being possible to the welding device 1 back to the driving device 4 in the direction of arrow A via the circuit board 15, and reciprocated. Furthermore, the welding device 1 can be moved in a direction perpendicular to the circuit board 15 . This direction is illustrated by the double arrows B in FIGS. 2 to 4. Furthermore, the contact device has a wire holding device 2 , with which a wire point 5 to be contacted 5 of a correction conductor 3 can be held on a contact point 6 of a printed circuit board 7 . During contacting, the welding device 1 supplies sufficient energy to the point of contact between the wire to be contacted 5 , which in the illustrated embodiment is a wire end, and the contact point 6 of the printed circuit board 7 , so that a material combination between the material of the conductor strip Printed circuit 7 and the wire point 5 or the wire end during welding. During the contacting or welding process, the wire holding device 2 can exert pressure on the wire point 5 , so that the advantages of pressure welding are also exploited here.

The drive device 4 can be connected to a control device, not shown in more detail, into which the corresponding contacting points on the printed circuit board 15 are programmed. Depending on this, the drive device 4 then controls the movement of the welding device 1 to the corresponding points at which wire points 5 with contact points 6 of the printed circuit device 7 are to be contacted.

In FIG. 2, an embodiment is shown, in which the welding means is formed as a laser-beam device from. The laser beam device has a laser, which can preferably be a solid-state (eg neodymium) laser or a carbon dioxide laser. The laser beam emitted by the laser 8 is focused in a focal point F by a focusing device 9 , which can be a focusing lens. The focal point F lies at the point at which the welding process between the wire point 5 and the contact point 6 is carried out. The focusing device 9 , the laser 8 and the wire holding device 2 form a unit, which are connected to one another by a schematically illustrated frame 19 , which can also be a corresponding housing. The laser 8 can also be arranged outside the unit consisting of the wire holding device 2 and the focusing device 9 , the laser light then being guided to the focusing device 9 , for example, via mirrors, prisms, light guides or the like. However, for the laser beam to be brought to the contacting point without problems, it is necessary that the focusing device 9 and the wire holding device 2 form a unit. The wire holding device 2 can be moved in the vertical direction (double arrow C ). The arrangement shown in FIG. 2 has a viewing direction perpendicular to the arrangement shown in FIG. 1. With this arrangement of the welding device, the laser beam is directed obliquely from above onto the welding point (wire point 5 and contact point 6 ). The unit consisting of the wire holding device 2 , the focusing device 9 and optionally the laser 8 can be moved in the direction of the double arrow B , controlled by the drive device 4 . Furthermore, it can also be moved in the direction perpendicular thereto (double arrow A in FIG. 1) over the printed circuit board 15 .

The arrangement, in particular the focusing device 9, can also be such that the laser beam with its focal point F is directed from above onto the wire point 5 to be welded on (arrangement of FIG. 11). The energy of the laser beam can be set so that it penetrates through the diameter of the wire 3 and causes the desired welding to the wire point 5 at the contact point 6 .

In the embodiment shown in FIG. 3, the welding device is designed as a resistance welding device 10 . For this purpose, the wire holding device 2 can be designed as a welding electrode 11 . It is also possible to install the welding electrode 11 in the wire holder 2 be movable (double arrow direction C ). Here too, the resistance welding device 10 is moved by the drive device 4 in the direction of the double arrow B and perpendicularly thereto (double arrow A in FIG. 1) over the printed circuit board 15 .

In the embodiment shown in FIG. 4, the welding device is designed as an electron beam welding device 12 . The electron beam welding device 12 has an electron beam generator 13 which consists of a cathode 16 which sends the electron beam out and an anode 17 . The electron beam emitted by the electron beam generator 13 is focused using a focusing device 18 . The focused electron beam 14 is directed towards the weld. This is the contact area between the kon to lactating wire stop 5 of the correction conductor 3 and the contact area between the wire to be contacted point 5 of the correction conductor 3 and the contact point 6 on the corresponding conductor track of the printed circuit. 7 During the process, the wire point 5 to be contacted is pressed onto the contact point 6 by the wire holding device 2 . For this purpose, the wire holding device 2 can be moved in the direction of the double arrow C in the vertical direction. Here too, the wire holding device 2 and the electron beam welding device 12 or the electron beam generator 13 are coupled to one another in such a way that the focused electron beam 14 is directed precisely at the points to be welded during the welding process. Here, too, the electron beam welding device 12 is moved together with the wire holding device 2 in the direction of the double arrow B , depending on the control of the drive device 4 . In this embodiment, too, the movement of the electron beam welding device 12 and the wire holding device 2 perpendicular to it (arrow direction A in FIG. 1) is possible. In this way, all points te on the circuit board 15 can be approached.

In Fig. 5, a wire bending device is shown schematically ge. This essentially has a deflection roller 20 , which can also be a deflection pin. Furthermore, a in the direction of the double arrow D about the center of the deflection roller 20 or the deflection pin pivotable second roller 21 , which is a bending roller, is provided. The bending roller 21 can be brought from the dashed position in the direction of the double arrow D during the bending process into a position in which it is shown with solid lines. During this pivoting movement, the correction conductor 3 is deflected or bent around the deflection roller 20 without bulging. A right-angled bend is shown in FIG . Depending on the dimensioning of the pivoting of the bending roller 21 , other deflection angles can also be achieved for the correction conductor 3 . The bending roll 21 can be designed as a bending pin. As shown in FIG. 5, the correction conductor 3 to be guided is guided between the deflection roller 20 and the bending roller 21 .

The correction conductor 3 to be provided on the printed circuit board can be withdrawn from a supply roll (not shown in more detail) with the aid of a wire feeder (also not shown in more detail).

In Figs. 6 to 9 show various types of fixing for fixing the correction conductor 3 are shown on the printed circuit board 15. The correction conductors 3 have an approximately Z-shaped course on the printed circuit board 15 . With the help of the bending device shown in FIG. 5, other courses of the correction conductor 3 - depending on the requirements - can be produced.

In Fig. 6 different fixing means in the form of injection molded parts are shown which len at various places fix the correction conductor 3 on the circuit board 15. The injection molded parts can be attached to the circuit board 15 by means of adhesive.

In Fig. 7 is an elongated molded part, for example made of rubber, provided for fixing of the correction conductor 3. In the Fig. 6 (b) and 7 (b) the cross-sectional shapes of the injection part and the elongate molding are shown. In this case, the slots in which the correction conductors 3 are inserted can be narrowed at the top, so that proper mounting is ensured.

An adhesive tape is provided in FIG. 8 with which the correction conductor 3 is fixed in the longitudinal direction on the printed circuit board 15 . In FIG. 9, the correction conductor 3 is by means of an acrylate adhesive (cyanoacrylate) to the circuit board 15 fixed.

The contacting points for the correction conductor 3 can be provided on the surfaces of the conductor tracks of the printed circuit 7 . However, it is also possible to put the contact points for the correction conductor 3 at the punched holes at which the electrical components are contacted. In particular, the wire ends of the correction conductor can then be contacted here.

Fig. 10 shows a preferred embodiment for a wire holding device, in which a resiliently formed wire hold-down device 22 is provided, which is resiliently bent at its lower end and is fork-shaped, as seen from the top view of Fig. 10 (c) is seen. In the lower position, which is shown in Fig. 10 (b), the wire hold-down device presses the wire end to be contacted onto the corresponding contact point of the printed circuit. When using a laser beam or an electron beam for welding, the laser beam or electron beam is moved laterally, as shown in FIGS. 2 and 4, to the contact point. If resistance welding is used, the corresponding power supply can follow it through the hold-down device or it can also be supplied by an additional welding electrode that is pressed onto the wire end.

In the embodiment shown in FIG. 12, the lead wires 3 are contacted with contact points 24 at their respective ends. The contacting can be carried out using one of the methods and arrangements shown in FIGS. 1 to 4 and 11. The contact points 24 are located around holes 25 . These holes 25 are arranged in a grid on a printed circuit board designed as a grid pattern 23 . The holes 25 are used for fastening supply components, not shown, with which the circuit board can be equipped. By the corre sponding arrangement of the lead wires 3 and the contacting of these lead wires with the corresponding contact points 24 , a circuit on the breadboard 23 can be produced. Such circuits can be used for small series or for the creation of prototypes of circuits, in particular also of printed circuits. In the circuit arrangement shown in FIG. 12, the line wires 3 provided with an insulation, in particular an insulating varnish, can also cross and run in any angular arrangement with one another and parallel to one another.

A further fixing method is shown schematically in FIG. 13. With the aid of tool parts 26 , 27 which can be attached to the conductor wire to be fixed, press-in chambers are created, into which an adhesive 28 is filled. The adhesive can be designed so that it takes on adhesive properties when heated and hardens when cooled, so that a fixation of the lead wires 3 is achieved on the circuit board at desired locations.

With the aid of the energy sources shown in FIGS. 1 to 4 and 11, which supply the welding energy (laser, electron beam, heating device), defective spots on conductor tracks can also be removed from existing printed circuits on printed circuit boards, so that separation points in the conductor tracks arise. The separation points can then be bridged by welding lead wires, in particular correction wires, so that a perfect contact is achieved. As a result, the committee can be reduced. In addition, modifications of existing printed circuits can also be carried out by such separation points and, if appropriate, by additionally arranging correction wires.

Claims (22)

1. A method of contacting an electrical line wire with contact points on a circuit board, which is equipped with components that are electrically connected to each other via the contact points, characterized in that the electrical lead wires before loading the circuit board with the components with the ent speaking contact points are electrically contacted with an energy supply that is higher than the energy supply, with which the components are then contacted with the respective contact points. 2. The method according to claim 1 for contacting an as Correction conductor serving wire with conductor tracks a printed scarf provided on a printed circuit board tion, through the components attached to the circuit board be electrically connected to each other by the a correction wire serving as a correction conductor the existing printed circuit is achieved, thereby characterized in that between the completion of the printed circuit and populating the circuit board with the components of the line serving as correction manager wire with the printed circuit wiring an energy supply is electrically contacted, the higher is than the energy supply with which the components with the Conduct the printed circuit then contact be animals. 3. The method according to claim 1 for producing a scarf on a printed circuit board with a hole pattern, when contacting at the respective grid holes places are available for assembly with construction elements ten, characterized in that for the production of a Circuit on the PCB before assembling the Components lead wires with the appropriate contact places are electrically contacted, the at Contacting the lead wires used energy supply is higher than the energy supply with which the components then contacted with the respective contact points will.   4. The method according to any one of claims 1 to 3, characterized ge indicates that the lead wire at a higher Ver temperature with the printed circuit wiring is tied up when she subsequently contacts the Components is applied. 5. The method according to any one of claims 1 to 4, characterized ge indicates that the lead wire is in contact with its wire locations by welding with the conductor tracks the printed circuit is contacted. 6. The method according to claim 5, characterized in that welding using a focused laser beam, the to the contact point between those to be contacted Wire point of the lead wire and contact point on the Lei terzug is directed, is carried out. 7. The method according to claim 5, characterized in that the contacting of the lead wire with the help of cons Stand welding on the respective wire to be contacted places is carried out. 8. The method according to claim 5, characterized in that the contacting of the lead wire with the help of elec electron beam welding is carried out, in which the Elek Tronenstrahl on the contact point between the Kon tact of the printed circuit and the contact the wire point is directed. 9. The method according to any one of claims 1 to 8, characterized ge indicates that the lead wire on the component side the circuit board is attached.   10. The method according to any one of claims 1 to 9, characterized ge indicates that the lead wire from a supply roll by the length required for contacting process is deducted. 11. The method according to any one of claims 1 to 10, characterized ge indicates that the lead wire using the same Energy source which is the one required for contacting Provides energy, is cut to length. 12. The method according to any one of claims 1 to 9, characterized ge indicates that the lead wire after contacting is fixed to the circuit board. 13. The method according to claim 12, characterized in that the lead wire by melting and subsequent Er cold the wire insulation at certain fixing points is fixed. 14. The method according to claim 12, characterized in that the lead wire is fixed with adhesive tape. 15. The method according to claim 12, characterized in that the lead wire through one or more on the conductor plate adhesive molded parts, which hal the lead wire ten is fixed. 16. The method according to claim 12, characterized in that the lead wire using an outside on the wire iso applied, initially adhesive by heating made and then hardening when cooling fixation is fixed by means of.   17. The method according to any one of claims 1 to 3, characterized ge indicates that with the help of the same energy source, wel used when contacting the lead wire, existing conductor tracks on the circuit board are separated. 18. The method according to claim 17, characterized in that the point of separation of the conductor track by a lead wire is bridged. 19. Device for contacting a correction conductor with a printed circuit provided on a printed circuit board for performing a method according to one of claims 1 to 3, characterized by a welding device ( 1 ) having a wire holding device ( 2 ) for the lead wire ( 3 ) , as well as by a drive device ( 4 ) which controls the movement of the wire holding device ( 2 ) so that the wire to be contacted ( 5 ) is applied to a specific contact point ( 6 ) of the printed circuit ( 7 ), and a device for supplying the welding energy to the contact point ( 6 ). 20. The apparatus according to claim 19, characterized in that the welding device ( 1 ) is designed as a laser ( 8 ) with focusing device ( 9 ) for a laser beam, and the focusing device ( 9 ) is connected to the wire holding device ( 2 ) in such a way that the focal point ( F ) of the focusing device ( 9 ) when placed on the contact point ( 6 ) of the printed circuit ( 7 ) to be contacted wire point ( 5 ) at the connection point between the contact point ( 6 ) and the wire point ( 5 ). 21. The apparatus according to claim 19, characterized in that the welding device ( 1 ) is a resistance welding device ( 10 ), and the wire holding device ( 2 ) in the region of the wire point to be contacted ( 5 ) is designed as a welding electrode ( 11 ). 22. The apparatus according to claim 19, characterized in that the welding device ( 1 ) is an electron beam welding device ( 12 ), the electron beam generator ( 13 ) is coupled to the wire holding device ( 2 ) such that at the contact point ( 6 ) of the printed circuit ( 7 ) put on, to be contacted wire point ( 5 ) the electron beam ( 14 ) on the contact point between the wire point ( 5 ) and contact point ( 6 ) is directed.