FR2572218B1 - Procede de decoupe de composants electroniques sur un substrat semi-conducteur - Google Patents

Procede de decoupe de composants electroniques sur un substrat semi-conducteur

Info

Publication number
FR2572218B1
FR2572218B1 FR8416176A FR8416176A FR2572218B1 FR 2572218 B1 FR2572218 B1 FR 2572218B1 FR 8416176 A FR8416176 A FR 8416176A FR 8416176 A FR8416176 A FR 8416176A FR 2572218 B1 FR2572218 B1 FR 2572218B1
Authority
FR
France
Prior art keywords
semiconductor substrate
electronic components
cutting electronic
cutting
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8416176A
Other languages
English (en)
Other versions
FR2572218A1 (fr
Inventor
Jean-Claude Mauduit
Gerard Haldemann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Laboratoires dElectronique Philips SAS
Original Assignee
Laboratoires dElectronique et de Physique Appliquee
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Laboratoires dElectronique et de Physique Appliquee filed Critical Laboratoires dElectronique et de Physique Appliquee
Priority to FR8416176A priority Critical patent/FR2572218B1/fr
Publication of FR2572218A1 publication Critical patent/FR2572218A1/fr
Application granted granted Critical
Publication of FR2572218B1 publication Critical patent/FR2572218B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H01L21/3043—Making grooves, e.g. cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
FR8416176A 1984-10-23 1984-10-23 Procede de decoupe de composants electroniques sur un substrat semi-conducteur Expired FR2572218B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR8416176A FR2572218B1 (fr) 1984-10-23 1984-10-23 Procede de decoupe de composants electroniques sur un substrat semi-conducteur

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8416176A FR2572218B1 (fr) 1984-10-23 1984-10-23 Procede de decoupe de composants electroniques sur un substrat semi-conducteur

Publications (2)

Publication Number Publication Date
FR2572218A1 FR2572218A1 (fr) 1986-04-25
FR2572218B1 true FR2572218B1 (fr) 1987-06-05

Family

ID=9308902

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8416176A Expired FR2572218B1 (fr) 1984-10-23 1984-10-23 Procede de decoupe de composants electroniques sur un substrat semi-conducteur

Country Status (1)

Country Link
FR (1) FR2572218B1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5157001A (en) * 1989-09-18 1992-10-20 Matsushita Electric Industrial Co., Ltd. Method of dicing semiconductor wafer along protective film formed on scribe lines
DE19725445A1 (de) * 1997-06-16 1998-12-17 Siemens Ag Bauteilträger für Multi-Chip-Module

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4033027A (en) * 1975-09-26 1977-07-05 Bell Telephone Laboratories, Incorporated Dividing metal plated semiconductor wafers
DE2730130C2 (de) * 1976-09-14 1987-11-12 Mitsubishi Denki K.K., Tokyo Verfahren zum Herstellen von Halbleiterbauelementen
JPS58137228A (ja) * 1982-02-09 1983-08-15 Toshiba Corp 半導体装置の製造方法

Also Published As

Publication number Publication date
FR2572218A1 (fr) 1986-04-25

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Legal Events

Date Code Title Description
ST Notification of lapse