FR2564455B1 - Melange de depart pour une composition isolante, encre serigraphiable comportant un tel melange et utilisation de cette encre pour la realisation de microcircuits hybrides sur substrat colamine - Google Patents

Melange de depart pour une composition isolante, encre serigraphiable comportant un tel melange et utilisation de cette encre pour la realisation de microcircuits hybrides sur substrat colamine

Info

Publication number
FR2564455B1
FR2564455B1 FR8407769A FR8407769A FR2564455B1 FR 2564455 B1 FR2564455 B1 FR 2564455B1 FR 8407769 A FR8407769 A FR 8407769A FR 8407769 A FR8407769 A FR 8407769A FR 2564455 B1 FR2564455 B1 FR 2564455B1
Authority
FR
France
Prior art keywords
ink
mixture
serigraphiable
colamin
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8407769A
Other languages
English (en)
French (fr)
Other versions
FR2564455A1 (fr
Inventor
Hugues Baudry
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Laboratoires dElectronique Philips SAS
Original Assignee
Laboratoires dElectronique et de Physique Appliquee
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Laboratoires dElectronique et de Physique Appliquee filed Critical Laboratoires dElectronique et de Physique Appliquee
Priority to FR8407769A priority Critical patent/FR2564455B1/fr
Priority to US06/730,220 priority patent/US4618590A/en
Priority to EP85200734A priority patent/EP0168849B1/fr
Priority to DE8585200734T priority patent/DE3565616D1/de
Priority to JP60104087A priority patent/JPS60255661A/ja
Publication of FR2564455A1 publication Critical patent/FR2564455A1/fr
Priority to US06/882,124 priority patent/US4699827A/en
Application granted granted Critical
Publication of FR2564455B1 publication Critical patent/FR2564455B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
    • H01B3/12—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances ceramics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
    • H01B3/08—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances quartz; glass; glass wool; slag wool; vitreous enamels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
    • H05K3/4667—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders characterized by using an inorganic intermediate insulating layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/9265—Special properties
    • Y10S428/931—Components of differing electric conductivity
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12597—Noncrystalline silica or noncrystalline plural-oxide component [e.g., glass, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12611—Oxide-containing component
    • Y10T428/12618—Plural oxides
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component
    • Y10T428/12917—Next to Fe-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12951—Fe-base component

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Inorganic Insulating Materials (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
FR8407769A 1984-05-18 1984-05-18 Melange de depart pour une composition isolante, encre serigraphiable comportant un tel melange et utilisation de cette encre pour la realisation de microcircuits hybrides sur substrat colamine Expired FR2564455B1 (fr)

Priority Applications (6)

Application Number Priority Date Filing Date Title
FR8407769A FR2564455B1 (fr) 1984-05-18 1984-05-18 Melange de depart pour une composition isolante, encre serigraphiable comportant un tel melange et utilisation de cette encre pour la realisation de microcircuits hybrides sur substrat colamine
US06/730,220 US4618590A (en) 1984-05-18 1985-05-03 Starting mixture for a dielectric composition
EP85200734A EP0168849B1 (fr) 1984-05-18 1985-05-10 Mélange de départ pour une composition isolante, encre sérigraphiable comportant un tel mélange et utilisation de cette encre pour la réalisation de microcircuits hybrides sur substrat co-laminé
DE8585200734T DE3565616D1 (en) 1984-05-18 1985-05-10 Starting mixture for an insulating composition, silk screen printing ink comprising such a mixture for the manufacture of hybrid microcircuits on a colaminate substrate
JP60104087A JPS60255661A (ja) 1984-05-18 1985-05-17 シルク―スクリーニングインク
US06/882,124 US4699827A (en) 1984-05-18 1986-07-03 Electric device provided with a silk-screening dielectric coated conductive laminate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8407769A FR2564455B1 (fr) 1984-05-18 1984-05-18 Melange de depart pour une composition isolante, encre serigraphiable comportant un tel melange et utilisation de cette encre pour la realisation de microcircuits hybrides sur substrat colamine

Publications (2)

Publication Number Publication Date
FR2564455A1 FR2564455A1 (fr) 1985-11-22
FR2564455B1 true FR2564455B1 (fr) 1986-09-19

Family

ID=9304147

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8407769A Expired FR2564455B1 (fr) 1984-05-18 1984-05-18 Melange de depart pour une composition isolante, encre serigraphiable comportant un tel melange et utilisation de cette encre pour la realisation de microcircuits hybrides sur substrat colamine

Country Status (5)

Country Link
US (2) US4618590A (OSRAM)
EP (1) EP0168849B1 (OSRAM)
JP (1) JPS60255661A (OSRAM)
DE (1) DE3565616D1 (OSRAM)
FR (1) FR2564455B1 (OSRAM)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2507418B2 (ja) * 1986-05-02 1996-06-12 旭硝子株式会社 回路基板用組成物
DE3788432T2 (de) * 1986-07-15 1994-06-09 Du Pont Glaskeramische dielektrische Zusammensetzungen.
US4997795A (en) * 1986-10-02 1991-03-05 General Electric Company Dielectric compositions of devitrified glass containing small amounts of lead oxide and iron oxide
US4966926A (en) * 1988-08-01 1990-10-30 E. I. Du Pont De Nemours And Company Encapsulant composition
JPH02296877A (ja) * 1989-05-10 1990-12-07 Matsushita Electric Ind Co Ltd 絶縁体ペーストおよび絶縁体の形成方法
US4959330A (en) * 1989-06-20 1990-09-25 E. I. Du Pont De Nemours And Company Crystallizable glass and thick film compositions thereof
US5397830A (en) * 1994-01-24 1995-03-14 Ferro Corporation Dielectric materials
US5714246A (en) * 1994-05-13 1998-02-03 Ferro Corporation Conductive silver low temperature cofired metallic green tape
JP3327045B2 (ja) * 1995-04-28 2002-09-24 株式会社村田製作所 誘電体ペースト及びそれを用いた厚膜コンデンサ
US6007900A (en) * 1995-04-28 1999-12-28 Murata Manufacturing Co., Ltd. Dielectric paste and thick-film capacitor using same
JP3647130B2 (ja) * 1996-02-06 2005-05-11 昭栄化学工業株式会社 絶縁体ガラス組成物とこれを用いた厚膜多層回路絶縁層用ガラス組成物
US5998036A (en) * 1997-02-11 1999-12-07 Stein; Sidney J. Dielectric pastes and tapes, and metal substrates coated therewith
JP4370686B2 (ja) * 1999-06-09 2009-11-25 旭硝子株式会社 バリウムホウケイ酸ガラスおよびガラスセラミックス組成物
US9005748B1 (en) 2011-03-04 2015-04-14 Insulating Coatings Of America, Inc. Coating containing borosilicate flake glass
DE102013102848B3 (de) * 2013-03-20 2014-02-06 Schott Ag Hochbrechende Dünngläser, Verfahren zu deren Herstellung, Schichtverbund und Verwendung
CN103436078A (zh) * 2013-08-07 2013-12-11 苏州凹凸彩印厂 一种陶瓷用丝网贴花纸油墨
CN106456964A (zh) 2014-02-04 2017-02-22 莱雅公司 包括至少两个隔室的电面膜
FR3024368A1 (fr) 2014-07-29 2016-02-05 Oreal Dispositif d'iontophorese a embout multi-electrodes

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2305478A1 (fr) * 1975-03-25 1976-10-22 Labo Electronique Physique Pate serigraphiable pour conducteurs en couches epaisses a deposer sur un substrat ceramique et procede de preparation de couches conductrices utilisant une telle pate
FR2388381A1 (fr) * 1976-12-27 1978-11-17 Labo Electronique Physique Composition dielectrique, pate serigraphiable comportant une telle composition et produits obtenus
FR2451899A1 (fr) * 1979-03-23 1980-10-17 Labo Electronique Physique Composition dielectrique, encre serigraphiable comportant une telle composition, et produits obtenus
US4619590A (en) * 1985-04-22 1986-10-28 Johnson Kenneth A Air diverter for supercharger

Also Published As

Publication number Publication date
US4699827A (en) 1987-10-13
DE3565616D1 (en) 1988-11-17
US4618590A (en) 1986-10-21
EP0168849A1 (fr) 1986-01-22
FR2564455A1 (fr) 1985-11-22
EP0168849B1 (fr) 1988-10-12
JPS60255661A (ja) 1985-12-17
JPH0515662B2 (OSRAM) 1993-03-02

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