FR2551078B1 - Perfectionnements aux compositions pour la dissolution de metaux et procede de dissolution - Google Patents
Perfectionnements aux compositions pour la dissolution de metaux et procede de dissolutionInfo
- Publication number
- FR2551078B1 FR2551078B1 FR8405236A FR8405236A FR2551078B1 FR 2551078 B1 FR2551078 B1 FR 2551078B1 FR 8405236 A FR8405236 A FR 8405236A FR 8405236 A FR8405236 A FR 8405236A FR 2551078 B1 FR2551078 B1 FR 2551078B1
- Authority
- FR
- France
- Prior art keywords
- dissolution
- metals
- compositions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000004090 dissolution Methods 0.000 title 2
- 229910052751 metal Inorganic materials 0.000 title 1
- 239000002184 metal Substances 0.000 title 1
- 150000002739 metals Chemical class 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 239000000203 mixture Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US06/525,070 US4437928A (en) | 1983-08-22 | 1983-08-22 | Dissolution of metals utilizing a glycol ether |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2551078A1 FR2551078A1 (fr) | 1985-03-01 |
| FR2551078B1 true FR2551078B1 (fr) | 1988-04-08 |
Family
ID=24091788
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR8405236A Expired FR2551078B1 (fr) | 1983-08-22 | 1984-04-03 | Perfectionnements aux compositions pour la dissolution de metaux et procede de dissolution |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US4437928A (cg-RX-API-DMAC7.html) |
| JP (1) | JPS6050182A (cg-RX-API-DMAC7.html) |
| KR (1) | KR920006356B1 (cg-RX-API-DMAC7.html) |
| CA (1) | CA1194389A (cg-RX-API-DMAC7.html) |
| CH (1) | CH666059A5 (cg-RX-API-DMAC7.html) |
| DE (1) | DE3430341A1 (cg-RX-API-DMAC7.html) |
| FR (1) | FR2551078B1 (cg-RX-API-DMAC7.html) |
| GB (1) | GB2147547B (cg-RX-API-DMAC7.html) |
| IT (1) | IT1176621B (cg-RX-API-DMAC7.html) |
| MX (1) | MX162660A (cg-RX-API-DMAC7.html) |
| NL (1) | NL8401754A (cg-RX-API-DMAC7.html) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4859281A (en) * | 1987-06-04 | 1989-08-22 | Pennwalt Corporation | Etching of copper and copper bearing alloys |
| US5104326A (en) * | 1991-01-25 | 1992-04-14 | Molex Incorporated | Printed circuit board shielded electrical connector |
| US5492540A (en) * | 1994-06-13 | 1996-02-20 | S. C. Johnson & Son, Inc. | Soft surface cleaning composition and method with hydrogen peroxide |
| US5534167A (en) * | 1994-06-13 | 1996-07-09 | S. C. Johnson & Son, Inc. | Carpet cleaning and restoring composition |
| US6043209A (en) * | 1998-01-06 | 2000-03-28 | Playtex Products, Inc. | Stable compositions for removing stains from fabrics and carpets and inhibiting the resoiling of same |
| US6331490B1 (en) * | 1998-03-13 | 2001-12-18 | Semitool, Inc. | Process for etching thin-film layers of a workpiece used to form microelectric circuits or components |
| US6632292B1 (en) * | 1998-03-13 | 2003-10-14 | Semitool, Inc. | Selective treatment of microelectronic workpiece surfaces |
| ES2322932T3 (es) * | 1999-12-30 | 2009-07-02 | HENKEL AG & CO. KGAA | Abrillantamiento/pasivacion de superficies metalicas sin peligro de emisiones de oxidos de nitrogeno. |
| US6858097B2 (en) * | 1999-12-30 | 2005-02-22 | Henkel Kommanditgesellschaft Auf Aktien (Henkel Kgaa) | Brightening/passivating metal surfaces without hazard from emissions of oxides of nitrogen |
| TWI568859B (zh) | 2010-04-15 | 2017-02-01 | 恩特葛瑞斯股份有限公司 | 廢棄印刷電路板之回收利用方法 |
| ES2619568T3 (es) | 2011-12-15 | 2017-06-26 | Entegris Inc. | Aparato y método de extracción de metales de soldadura durante el reciclaje de equipo eléctrico y electrónico de desecho |
| JP2015507692A (ja) * | 2011-12-20 | 2015-03-12 | ソルベイ (チャイナ) カンパニー リミテッド | 金属表面の腐食のための活性化剤としてのフェノール化合物の使用 |
| DE102014101813A1 (de) | 2013-02-26 | 2014-08-28 | Buchen Umweltservice Gmbh | Haltevorrichtung für eine Reinigungsvorrichtung an einem Rohr sowie Hochdruckreinigungsvorrichtung zur Reinigung von Rohren |
| USD808799S1 (en) | 2015-11-17 | 2018-01-30 | Hunter Fan Company | Carton with color striping |
| CN113529086A (zh) * | 2021-07-28 | 2021-10-22 | 南通群安电子材料有限公司 | 适用于硫酸-双氧水体系的减铜加速剂 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5037159B2 (cg-RX-API-DMAC7.html) * | 1973-02-21 | 1975-12-01 | ||
| GB1449525A (en) * | 1974-08-21 | 1976-09-15 | Tokai Electro Chemical Co | Method of stabilizing acid aqueous solutions of hydrogen peroxide |
| JPS5286933A (en) * | 1976-01-14 | 1977-07-20 | Tokai Electro Chemical Co | Method of treating surface of copper and copper alloy |
| US4236957A (en) | 1979-06-25 | 1980-12-02 | Dart Industries Inc. | Dissolution of metals utilizing an aqueous H2 SOY --H2 O.sub. -mercapto containing heterocyclic nitrogen etchant |
-
1983
- 1983-08-22 US US06/525,070 patent/US4437928A/en not_active Expired - Lifetime
-
1984
- 1984-02-23 CA CA000448144A patent/CA1194389A/en not_active Expired
- 1984-02-24 KR KR1019840000911A patent/KR920006356B1/ko not_active Expired
- 1984-03-15 GB GB08406798A patent/GB2147547B/en not_active Expired
- 1984-04-03 FR FR8405236A patent/FR2551078B1/fr not_active Expired
- 1984-04-27 MX MX201156A patent/MX162660A/es unknown
- 1984-05-11 JP JP59093057A patent/JPS6050182A/ja active Granted
- 1984-05-30 NL NL8401754A patent/NL8401754A/nl not_active Application Discontinuation
- 1984-08-15 CH CH3922/84A patent/CH666059A5/de not_active IP Right Cessation
- 1984-08-17 DE DE19843430341 patent/DE3430341A1/de not_active Withdrawn
- 1984-08-21 IT IT22377/84A patent/IT1176621B/it active
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0427306B2 (cg-RX-API-DMAC7.html) | 1992-05-11 |
| IT1176621B (it) | 1987-08-18 |
| IT8422377A0 (it) | 1984-08-21 |
| GB2147547A (en) | 1985-05-15 |
| CH666059A5 (de) | 1988-06-30 |
| NL8401754A (nl) | 1985-03-18 |
| KR850002838A (ko) | 1985-05-20 |
| FR2551078A1 (fr) | 1985-03-01 |
| MX162660A (es) | 1991-06-13 |
| GB2147547B (en) | 1987-09-30 |
| KR920006356B1 (ko) | 1992-08-03 |
| US4437928A (en) | 1984-03-20 |
| JPS6050182A (ja) | 1985-03-19 |
| DE3430341A1 (de) | 1985-03-14 |
| GB8406798D0 (en) | 1984-04-18 |
| CA1194389A (en) | 1985-10-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |