FR2543737B1 - Procede de fabrication d'une pellicule fine multicomposant - Google Patents
Procede de fabrication d'une pellicule fine multicomposantInfo
- Publication number
- FR2543737B1 FR2543737B1 FR8405098A FR8405098A FR2543737B1 FR 2543737 B1 FR2543737 B1 FR 2543737B1 FR 8405098 A FR8405098 A FR 8405098A FR 8405098 A FR8405098 A FR 8405098A FR 2543737 B1 FR2543737 B1 FR 2543737B1
- Authority
- FR
- France
- Prior art keywords
- manufacturing
- fine film
- component fine
- component
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System
- H01L29/1604—Amorphous materials
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/0021—Reactive sputtering or evaporation
- C23C14/0036—Reactive sputtering
- C23C14/0057—Reactive sputtering using reactive gases other than O2, H2O, N2, NH3 or CH4
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/505—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
- C23C16/509—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges using internal electrodes
- C23C16/5096—Flat-bed apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02532—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/02549—Antimonides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/0257—Doping during depositing
- H01L21/02573—Conductivity type
- H01L21/02576—N-type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/0257—Doping during depositing
- H01L21/02573—Conductivity type
- H01L21/02579—P-type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02631—Physical deposition at reduced pressure, e.g. MBE, sputtering, evaporation
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58053850A JPS59179152A (ja) | 1983-03-31 | 1983-03-31 | アモルファスシリコン半導体薄膜の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2543737A1 FR2543737A1 (fr) | 1984-10-05 |
FR2543737B1 true FR2543737B1 (fr) | 1987-05-29 |
Family
ID=12954240
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR8405098A Expired FR2543737B1 (fr) | 1983-03-31 | 1984-03-30 | Procede de fabrication d'une pellicule fine multicomposant |
Country Status (5)
Country | Link |
---|---|
US (1) | US4496450A (fr) |
JP (1) | JPS59179152A (fr) |
DE (1) | DE3411702A1 (fr) |
FR (1) | FR2543737B1 (fr) |
GB (1) | GB2138450B (fr) |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4681653A (en) * | 1984-06-01 | 1987-07-21 | Texas Instruments Incorporated | Planarized dielectric deposited using plasma enhanced chemical vapor deposition |
JPS6174293A (ja) * | 1984-09-17 | 1986-04-16 | シャープ株式会社 | 薄膜el素子の製造方法 |
US4551352A (en) * | 1985-01-17 | 1985-11-05 | Rca Corporation | Method of making P-type hydrogenated amorphous silicon |
DE3608887A1 (de) * | 1985-03-22 | 1986-10-02 | Canon K.K., Tokio/Tokyo | Waermeerzeugungs-widerstandselement und waermeerzeugungs-widerstandsvorrichtung unter verwendung des waermeerzeugungs-widerstandselements |
DE3609503A1 (de) * | 1985-03-22 | 1986-10-02 | Canon K.K., Tokio/Tokyo | Heizwiderstandselement und heizwiderstand unter verwendung desselben |
US4783369A (en) * | 1985-03-23 | 1988-11-08 | Canon Kabushiki Kaisha | Heat-generating resistor and heat-generating resistance element using same |
GB2174877B (en) * | 1985-03-23 | 1989-03-15 | Canon Kk | Thermal recording head |
US4845513A (en) * | 1985-03-23 | 1989-07-04 | Canon Kabushiki Kaisha | Thermal recording head |
DE3609975A1 (de) * | 1985-03-25 | 1986-10-02 | Canon K.K., Tokio/Tokyo | Thermoaufzeichnungskopf |
GB2176443B (en) * | 1985-06-10 | 1990-11-14 | Canon Kk | Liquid jet recording head and recording system incorporating the same |
US4681818A (en) * | 1986-03-18 | 1987-07-21 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Oxygen diffusion barrier coating |
JPH0750631B2 (ja) * | 1986-06-23 | 1995-05-31 | 沖電気工業株式会社 | Elパネルの形成方法 |
JPS63277755A (ja) * | 1987-05-07 | 1988-11-15 | Matsushita Electric Ind Co Ltd | 薄膜の製造方法 |
DE3810667A1 (de) * | 1988-03-29 | 1989-10-19 | Siemens Ag | Elektrisches widerstandsmaterial fuer elektrothermische wandler in duennschichttechnik |
US4992153A (en) * | 1989-04-26 | 1991-02-12 | Balzers Aktiengesellschaft | Sputter-CVD process for at least partially coating a workpiece |
DE3935863C2 (de) * | 1989-10-27 | 1993-10-21 | Philips Patentverwaltung | CVD (Chemical Vapour Deposition)-Vorrichtung |
JPH0816266B2 (ja) * | 1990-10-31 | 1996-02-21 | インターナショナル・ビジネス・マシーンズ・コーポレーション | 高アスペクト比の穴に材料を付着させる装置 |
US5158933A (en) * | 1990-11-15 | 1992-10-27 | Holtz Ronald L | Phase separated composite materials |
JPH0653137A (ja) * | 1992-07-31 | 1994-02-25 | Canon Inc | 水素化アモルファスシリコン膜の形成方法 |
JP3351843B2 (ja) * | 1993-02-24 | 2002-12-03 | 忠弘 大見 | 成膜方法 |
US5425860A (en) * | 1993-04-07 | 1995-06-20 | The Regents Of The University Of California | Pulsed energy synthesis and doping of silicon carbide |
US20010028922A1 (en) * | 1995-06-07 | 2001-10-11 | Sandhu Gurtej S. | High throughput ILD fill process for high aspect ratio gap fill |
US5993598A (en) * | 1996-07-30 | 1999-11-30 | The Dow Chemical Company | Magnetron |
US5900284A (en) * | 1996-07-30 | 1999-05-04 | The Dow Chemical Company | Plasma generating device and method |
US5865699A (en) * | 1996-10-03 | 1999-02-02 | Sandvik Ab | Coated chain saw nose sprocket |
US6055929A (en) * | 1997-09-24 | 2000-05-02 | The Dow Chemical Company | Magnetron |
DE19919742A1 (de) * | 1999-04-30 | 2000-11-02 | Fraunhofer Ges Forschung | Verfahren zum Beschichten von Substraten aus dotiertem Silizium mit einer Antireflexschicht für Solarzellen mittels einer in einer Vakuumkammer betriebenen Zerstäubungskathode mit einem Magnetsystem |
US6596133B1 (en) * | 2001-06-14 | 2003-07-22 | Cvc Products, Inc. | Method and system for physically-assisted chemical-vapor deposition |
US20040129223A1 (en) * | 2002-12-24 | 2004-07-08 | Park Jong Hyurk | Apparatus and method for manufacturing silicon nanodot film for light emission |
EP1729331A4 (fr) * | 2004-03-26 | 2008-10-15 | Nissin Electric Co Ltd | Methode et appareil de formation de points en silicone |
JP4880033B2 (ja) * | 2007-12-28 | 2012-02-22 | パナソニック株式会社 | 半導体装置の製造方法 |
US10738375B2 (en) | 2016-11-15 | 2020-08-11 | HPVico AB | Hard thin films |
EP3542194B1 (fr) * | 2016-11-15 | 2023-06-21 | HPViCo AB | Films minces durs |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1104935A (en) * | 1964-05-08 | 1968-03-06 | Standard Telephones Cables Ltd | Improvements in or relating to a method of forming a layer of an inorganic compound |
US3786323A (en) * | 1972-07-03 | 1974-01-15 | Bell Telephone Labor Inc | Capacitor with anodized electrode of tantalum silicon alloy |
US3979271A (en) * | 1973-07-23 | 1976-09-07 | Westinghouse Electric Corporation | Deposition of solid semiconductor compositions and novel semiconductor materials |
US3991229A (en) * | 1974-09-16 | 1976-11-09 | Fengler Werner H | High-wear-resistant composite seal and method of making the same |
US4058638A (en) * | 1974-12-19 | 1977-11-15 | Texas Instruments Incorporated | Method of optical thin film coating |
US4056642A (en) * | 1976-05-14 | 1977-11-01 | Data General Corporation | Method of fabricating metal-semiconductor interfaces |
JPS5811370B2 (ja) * | 1977-03-14 | 1983-03-02 | 箕村 茂 | 金属間化合物の金属的変態物質とその製造法 |
AU530905B2 (en) * | 1977-12-22 | 1983-08-04 | Canon Kabushiki Kaisha | Electrophotographic photosensitive member |
US4218291A (en) * | 1978-02-28 | 1980-08-19 | Vlsi Technology Research Association | Process for forming metal and metal silicide films |
DD141932B1 (de) * | 1978-12-18 | 1982-06-30 | Guenter Reisse | Verfahren und vorrichtung zur teilchenstromionisierung und hochratebeschichtung |
US4234622A (en) * | 1979-04-11 | 1980-11-18 | The United States Of American As Represented By The Secretary Of The Army | Vacuum deposition method |
JPS574172A (en) * | 1980-06-09 | 1982-01-09 | Canon Inc | Light conductive member |
JPS57186321A (en) * | 1981-05-12 | 1982-11-16 | Fuji Electric Corp Res & Dev Ltd | Producing method for amorphous silicon film |
-
1983
- 1983-03-31 JP JP58053850A patent/JPS59179152A/ja active Granted
-
1984
- 1984-03-29 DE DE19843411702 patent/DE3411702A1/de active Granted
- 1984-03-29 US US06/594,828 patent/US4496450A/en not_active Expired - Lifetime
- 1984-03-30 FR FR8405098A patent/FR2543737B1/fr not_active Expired
- 1984-03-30 GB GB08408203A patent/GB2138450B/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
DE3411702C2 (fr) | 1991-08-29 |
JPS6349751B2 (fr) | 1988-10-05 |
FR2543737A1 (fr) | 1984-10-05 |
GB2138450A (en) | 1984-10-24 |
JPS59179152A (ja) | 1984-10-11 |
US4496450A (en) | 1985-01-29 |
GB2138450B (en) | 1986-06-18 |
GB8408203D0 (en) | 1984-05-10 |
DE3411702A1 (de) | 1984-10-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |