FR2522459B1 - - Google Patents
Info
- Publication number
- FR2522459B1 FR2522459B1 FR8203301A FR8203301A FR2522459B1 FR 2522459 B1 FR2522459 B1 FR 2522459B1 FR 8203301 A FR8203301 A FR 8203301A FR 8203301 A FR8203301 A FR 8203301A FR 2522459 B1 FR2522459 B1 FR 2522459B1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09645—Patterning on via walls; Plural lands around one hole
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09845—Stepped hole, via, edge, bump or conductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09854—Hole or via having special cross-section, e.g. elliptical
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09981—Metallised walls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8203301A FR2522459A1 (fr) | 1982-02-26 | 1982-02-26 | Circuit electrique imprime |
PCT/FR1983/000031 WO1983003040A1 (fr) | 1982-02-26 | 1983-02-22 | Circuit electrique imprime |
JP50077083A JPS59500295A (ja) | 1982-02-26 | 1983-02-22 | プリント回路 |
EP19830900717 EP0101703A1 (fr) | 1982-02-26 | 1983-02-22 | Circuit electrique imprime |
AU12278/83A AU1227883A (en) | 1982-02-26 | 1983-02-22 | Circuit electricque imprime |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8203301A FR2522459A1 (fr) | 1982-02-26 | 1982-02-26 | Circuit electrique imprime |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2522459A1 FR2522459A1 (fr) | 1983-09-02 |
FR2522459B1 true FR2522459B1 (ko) | 1985-04-26 |
Family
ID=9271416
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR8203301A Granted FR2522459A1 (fr) | 1982-02-26 | 1982-02-26 | Circuit electrique imprime |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0101703A1 (ko) |
JP (1) | JPS59500295A (ko) |
FR (1) | FR2522459A1 (ko) |
WO (1) | WO1983003040A1 (ko) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3429236A1 (de) * | 1984-08-08 | 1986-02-13 | Krone Gmbh, 1000 Berlin | Folie mit beidseitig aufgedruckten elektrischen leiterbahnen |
US4802741A (en) * | 1987-10-09 | 1989-02-07 | Eastman Kodak Company | In-depth electrode light valve array devices and improved fabrication method therefor |
DE69942279D1 (de) * | 1998-09-17 | 2010-06-02 | Ibiden Co Ltd | Vielschichtig aufgebaute leiterplatte |
JP5773633B2 (ja) * | 2010-12-13 | 2015-09-02 | キヤノン株式会社 | 配線基板の製造方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3400210A (en) * | 1966-04-26 | 1968-09-03 | Automatic Elect Lab | Interlayer connection technique for multilayer printed wiring boards |
FR1493316A (fr) * | 1966-09-20 | 1967-08-25 | Litton Industries Inc | Panneau de circuit à couches multiples |
DE2323529A1 (de) * | 1973-05-10 | 1974-11-28 | Peter Kammermeier | Leiterplatte mit aufgedruckten oder aufplattierten leiterbahnen |
FR2296988A1 (fr) * | 1974-12-31 | 1976-07-30 | Ibm France | Perfectionnement aux procedes de fabrication d'un module de circuits multicouches en ceramique |
-
1982
- 1982-02-26 FR FR8203301A patent/FR2522459A1/fr active Granted
-
1983
- 1983-02-22 EP EP19830900717 patent/EP0101703A1/fr not_active Withdrawn
- 1983-02-22 JP JP50077083A patent/JPS59500295A/ja active Pending
- 1983-02-22 WO PCT/FR1983/000031 patent/WO1983003040A1/fr not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
EP0101703A1 (fr) | 1984-03-07 |
JPS59500295A (ja) | 1984-02-23 |
WO1983003040A1 (fr) | 1983-09-01 |
FR2522459A1 (fr) | 1983-09-02 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
TP | Transmission of property | ||
ST | Notification of lapse |