FR2506555A1 - Plaque de circuits imprimes avec un cablage enrobe sur la face des composants et son procede de fabrication - Google Patents

Plaque de circuits imprimes avec un cablage enrobe sur la face des composants et son procede de fabrication

Info

Publication number
FR2506555A1
FR2506555A1 FR8121504A FR8121504A FR2506555A1 FR 2506555 A1 FR2506555 A1 FR 2506555A1 FR 8121504 A FR8121504 A FR 8121504A FR 8121504 A FR8121504 A FR 8121504A FR 2506555 A1 FR2506555 A1 FR 2506555A1
Authority
FR
France
Prior art keywords
components
face
printed
board
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR8121504A
Other languages
English (en)
Other versions
FR2506555B1 (fr
Inventor
Richard C Holt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Augat Inc
Original Assignee
Augat Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Augat Inc filed Critical Augat Inc
Publication of FR2506555A1 publication Critical patent/FR2506555A1/fr
Application granted granted Critical
Publication of FR2506555B1 publication Critical patent/FR2506555B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/222—Completing of printed circuits by adding non-printed jumper connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)

Abstract

L'INVENTION CONCERNE UNE PLAQUE DE CIRCUITS IMPRIMES AVEC UN CABLAGE ENROBE SUR LA FACE DES COMPOSANTS, ET SON PROCEDE DE FABRICATION. LE SUBSTRAT DE LA PLAQUE DE CIRCUITS IMPRIMES COMPORTE DES SURFACES DE CONTACTS METALLISEES AVEC DES TROUS METALLISES POUR RECEVOIR LES CONDUCTEURS DES COMPOSANTS. LES INTERCONNEXIONS ENTRE LES SURFACES DE CONTACT METALLISEES SONT ETABLIES PAR DES FILS DISPOSES AU MOYEN D'UN DISPOSITIF AUTOMATIQUE, ET GUIDES LE LONG DE BROCHES AFIN D'EVITER LES POSITIONS DE MONTAGE DES COMPOSANTS. LES BROCHES SONT ENSUITE ENLEVEES ET LA PLAQUE EST COUVERTE D'UNE PELLICULE DE MATIERE PLASTIQUE THERMODURCISSABLE QUI EST FIXEE A CHAUD ET SOUS PRESSION. L'INVENTION S'APPLIQUE NOTAMMENT A LA FABRICATION DE PLAQUES DE CIRCUITS IMPRIMES EN MOYENNES SERIES.
FR8121504A 1981-05-22 1981-11-17 Plaque de circuits imprimes avec un cablage enrobe sur la face des composants et son procede de fabrication Expired FR2506555B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/266,620 US4414741A (en) 1981-05-22 1981-05-22 Process for interconnecting components on a PCB

Publications (2)

Publication Number Publication Date
FR2506555A1 true FR2506555A1 (fr) 1982-11-26
FR2506555B1 FR2506555B1 (fr) 1987-01-30

Family

ID=23015316

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8121504A Expired FR2506555B1 (fr) 1981-05-22 1981-11-17 Plaque de circuits imprimes avec un cablage enrobe sur la face des composants et son procede de fabrication

Country Status (6)

Country Link
US (1) US4414741A (fr)
JP (1) JPS57196595A (fr)
CA (1) CA1167976A (fr)
DE (1) DE3149641A1 (fr)
FR (1) FR2506555B1 (fr)
GB (1) GB2099225B (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0311222A2 (fr) 1983-11-04 1989-04-12 Augat Inc. Natte de fils pouvant se coller sur une plaque de circuit

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4442938A (en) * 1983-03-22 1984-04-17 Advanced Interconnections Socket terminal positioning method and construction
US4648180A (en) * 1983-11-04 1987-03-10 Augat Inc. Method of producing a wired circuit board
US4698275A (en) * 1983-11-04 1987-10-06 Augat Inc. Wire mat mateable with a circuit board
FR2555011B1 (fr) * 1983-11-15 1986-01-24 Thomson Csf Carte imprimee a empreintes
US4562513A (en) * 1984-05-21 1985-12-31 International Business Machines Corporation Process for forming a high density metallurgy system on a substrate and structure thereof
EP0168602A1 (fr) * 1984-06-25 1986-01-22 Kollmorgen Technologies Corporation Procédé de fabrication de plaques de circuit d'interconnexion
JPS61216389A (ja) * 1985-02-26 1986-09-26 富士通株式会社 プリント回路ユニツトのデイスクリ−ト布線方法
US4588468A (en) * 1985-03-28 1986-05-13 Avco Corporation Apparatus for changing and repairing printed circuit boards
US4702785A (en) * 1985-06-24 1987-10-27 President Engineering Corporation Process for manufacturing multilayer PC boards
US4818322A (en) * 1985-07-19 1989-04-04 Kollmorgen Technologies Corporation Method for scribing conductors via laser
US4859807A (en) * 1985-07-19 1989-08-22 Kollmorgen Technologies Corporation Wire scribed circuit boards and method of manufacture
US4693778A (en) * 1985-07-19 1987-09-15 Kollmorgen Technologies Corporation Apparatus for making scribed circuit boards and circuit board modifications
US4711026A (en) * 1985-07-19 1987-12-08 Kollmorgen Technologies Corporation Method of making wires scribed circuit boards
US4769309A (en) * 1986-10-21 1988-09-06 Westinghouse Electric Corp. Printed circuit boards and method for manufacturing printed circuit boards
DE3629296A1 (de) * 1986-11-17 1988-03-10 Standard Elektrik Lorenz Ag Baugruppe der nachrichtentechnik
US4915607A (en) * 1987-09-30 1990-04-10 Texas Instruments Incorporated Lead frame assembly for an integrated circuit molding system
DE3743335A1 (de) * 1987-12-21 1989-06-29 Standard Elektrik Lorenz Ag Leiterplatte
DE3937496A1 (de) * 1989-11-07 1990-05-23 Matouschek Thomas Neue produktionsweise zur herstellung einer alarmgebenden stromleiterflaeche zur aussenkantsicherung von wertbehaeltern
US5294754A (en) * 1992-12-24 1994-03-15 Iternational Business Machines Corporation Direct write EC single metal layer
DE19816670C2 (de) * 1998-04-15 2001-02-22 Vero Electronics Gmbh Standardschaltung mit variierbarer Pinbelegung
US7310212B2 (en) * 2005-04-25 2007-12-18 Alcor Micro, Corp. Connector
JP4912917B2 (ja) * 2007-02-22 2012-04-11 京セラ株式会社 回路基板、携帯電子機器及び回路基板の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3644792A (en) * 1970-07-02 1972-02-22 Honeywell Inf Systems Reusable circuit board for constructing logic circuits using integrated circuit elements
US3646246A (en) * 1970-05-22 1972-02-29 Honeywell Inf Systems Circuit board and method of making
US3842190A (en) * 1969-12-15 1974-10-15 Computer Ind Inc Wire routing system

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3353263A (en) * 1964-08-17 1967-11-21 Texas Instruments Inc Successively stacking, and welding circuit conductors through insulation by using electrodes engaging one conductor
US3567999A (en) * 1968-09-30 1971-03-02 Methode Electronics Inc Integrated circuit panel
US3633096A (en) * 1969-07-01 1972-01-04 Mc Donnell Douglas Corp Wire harness jigboard having a plurality of wire retaining pins detachably embedded in spaced woven screen elements
DE7014723U (de) * 1970-04-22 1970-08-06 Lehmann H Leitungsstütze
US3786172A (en) * 1972-12-07 1974-01-15 Accra Point Arrays Corp Printed circuit board method and apparatus
US3981076A (en) * 1974-11-27 1976-09-21 Commissariat A L'energie Atomique Method of connecting electronic microcomponents
JPS51106059A (ja) * 1975-03-14 1976-09-20 Nippon Denso Co Denkikiki

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3842190A (en) * 1969-12-15 1974-10-15 Computer Ind Inc Wire routing system
US3646246A (en) * 1970-05-22 1972-02-29 Honeywell Inf Systems Circuit board and method of making
US3701838A (en) * 1970-05-22 1972-10-31 Honeywell Inf Systems Circuit board
US3644792A (en) * 1970-07-02 1972-02-22 Honeywell Inf Systems Reusable circuit board for constructing logic circuits using integrated circuit elements

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0311222A2 (fr) 1983-11-04 1989-04-12 Augat Inc. Natte de fils pouvant se coller sur une plaque de circuit

Also Published As

Publication number Publication date
GB2099225B (en) 1985-06-05
GB2099225A (en) 1982-12-01
JPS57196595A (en) 1982-12-02
FR2506555B1 (fr) 1987-01-30
DE3149641A1 (de) 1982-12-16
DE3149641C2 (fr) 1988-02-25
US4414741A (en) 1983-11-15
CA1167976A (fr) 1984-05-22
JPS647516B2 (fr) 1989-02-09

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Legal Events

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ST Notification of lapse