FR2476428A1 - Procede de fixation de composants electroniques sur un circuit imprime et produit obtenu par ce procede - Google Patents

Procede de fixation de composants electroniques sur un circuit imprime et produit obtenu par ce procede Download PDF

Info

Publication number
FR2476428A1
FR2476428A1 FR8003413A FR8003413A FR2476428A1 FR 2476428 A1 FR2476428 A1 FR 2476428A1 FR 8003413 A FR8003413 A FR 8003413A FR 8003413 A FR8003413 A FR 8003413A FR 2476428 A1 FR2476428 A1 FR 2476428A1
Authority
FR
France
Prior art keywords
components
printed circuit
welding
collective
electronic components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR8003413A
Other languages
English (en)
French (fr)
Other versions
FR2476428B1 (OSRAM
Inventor
Alain Sevestre
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TECH ELECTRO CIE INDLE
Original Assignee
TECH ELECTRO CIE INDLE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TECH ELECTRO CIE INDLE filed Critical TECH ELECTRO CIE INDLE
Priority to FR8003413A priority Critical patent/FR2476428A1/fr
Priority to EP81400208A priority patent/EP0034530A1/fr
Publication of FR2476428A1 publication Critical patent/FR2476428A1/fr
Application granted granted Critical
Publication of FR2476428B1 publication Critical patent/FR2476428B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/304—Protecting a component during manufacturing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3468—Application of molten solder, e.g. dip soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating processes for reflow soldering
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
FR8003413A 1980-02-15 1980-02-15 Procede de fixation de composants electroniques sur un circuit imprime et produit obtenu par ce procede Granted FR2476428A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR8003413A FR2476428A1 (fr) 1980-02-15 1980-02-15 Procede de fixation de composants electroniques sur un circuit imprime et produit obtenu par ce procede
EP81400208A EP0034530A1 (fr) 1980-02-15 1981-02-10 Procédé de fixation de composants électroniques sur un circuit imprimé, et produit obtenu par ce procédé

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8003413A FR2476428A1 (fr) 1980-02-15 1980-02-15 Procede de fixation de composants electroniques sur un circuit imprime et produit obtenu par ce procede

Publications (2)

Publication Number Publication Date
FR2476428A1 true FR2476428A1 (fr) 1981-08-21
FR2476428B1 FR2476428B1 (OSRAM) 1983-11-25

Family

ID=9238644

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8003413A Granted FR2476428A1 (fr) 1980-02-15 1980-02-15 Procede de fixation de composants electroniques sur un circuit imprime et produit obtenu par ce procede

Country Status (2)

Country Link
EP (1) EP0034530A1 (OSRAM)
FR (1) FR2476428A1 (OSRAM)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0228791A3 (en) * 1985-11-12 1988-11-17 Raychem Corporation (A Delaware Corporation) Materials for use in forming electronic interconnect

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8322474D0 (en) * 1983-08-20 1983-09-21 Int Computers Ltd Printed circuit boards
GB8322473D0 (en) * 1983-08-20 1983-09-21 Int Computers Ltd Printed circuit boards
FR2556550B1 (fr) * 1983-12-09 1987-01-30 Lignes Telegraph Telephon Procede de brasage de composants electroniques sur un circuit imprime et circuit hybride obtenu par ce procede
DE3510000A1 (de) * 1985-03-20 1986-10-02 Ka We electronic GmbH & Co KG, 4796 Salzkotten Thermoplastisches loetmittel und verfahren und vorrichtung zu dessen verwendung
US4722470A (en) * 1986-12-01 1988-02-02 International Business Machines Corporation Method and transfer plate for applying solder to component leads
JPH0319389A (ja) * 1989-06-16 1991-01-28 Fujitsu Ltd プリント回路基板
CN104393467B (zh) * 2014-11-21 2017-02-01 中国航天科技集团公司第九研究院第七七一研究所 一种连接器中间部分搪锡的方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2755926A1 (de) * 1976-12-17 1978-06-29 Matsushita Electric Ind Co Ltd Schaltungsplatine sowie verfahren zu ihrer herstellung

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2755926A1 (de) * 1976-12-17 1978-06-29 Matsushita Electric Ind Co Ltd Schaltungsplatine sowie verfahren zu ihrer herstellung

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0228791A3 (en) * 1985-11-12 1988-11-17 Raychem Corporation (A Delaware Corporation) Materials for use in forming electronic interconnect

Also Published As

Publication number Publication date
FR2476428B1 (OSRAM) 1983-11-25
EP0034530A1 (fr) 1981-08-26

Similar Documents

Publication Publication Date Title
US4921157A (en) Fluxless soldering process
EP0006810B1 (fr) Procédé de fabrication d'un circuit intégré hybride
US5164566A (en) Method and apparatus for fluxless solder reflow
US3986255A (en) Process for electrically interconnecting chips with substrates employing gold alloy bumps and magnetic materials therein
CH622659A5 (OSRAM)
JPH08316624A (ja) 電子回路の製造方法
US5152451A (en) Controlled solder oxidation process
US4702941A (en) Gold metallization process
EP0034530A1 (fr) Procédé de fixation de composants électroniques sur un circuit imprimé, et produit obtenu par ce procédé
JPH0238309B2 (OSRAM)
JP2865770B2 (ja) 電子回路装置の製造方法
JP2626001B2 (ja) フラックスレス接合方法
JPH10233484A (ja) 半導体装置の組立方法および装置
US5679266A (en) Method for assembly of printed circuit boards with ultrafine pitch components using organic solderability preservatives
FR2556550A1 (fr) Procede de brasage de composants electroniques sur un circuit imprime et circuit hybride obtenu par ce procede
FR2598055A1 (fr) Procede de brasage de composants de surface sur un circuit imprime
JP2625924B2 (ja) リードの前処理方法
KR840001121B1 (ko) 튜너등의 샤시의 제조방법
JPS5937599B2 (ja) フラツト・リ−ド予備半田付け方法
JPS6011822B2 (ja) チユ−ナ等のシヤ−シの製造方法
JPS63168043A (ja) リ−ドフレ−ム
JPH04265281A (ja) セラミックスと金メッキ部品の接合方法
JPS6349383B2 (OSRAM)
JPH03250692A (ja) プリント配線板の表面実装方法
JP2527278C (OSRAM)

Legal Events

Date Code Title Description
TP Transmission of property
ST Notification of lapse