FR2462026A1 - Procede de fabrication d'un circuit hybride sur un substrat en acier et circuit en resultant - Google Patents

Procede de fabrication d'un circuit hybride sur un substrat en acier et circuit en resultant Download PDF

Info

Publication number
FR2462026A1
FR2462026A1 FR7918950A FR7918950A FR2462026A1 FR 2462026 A1 FR2462026 A1 FR 2462026A1 FR 7918950 A FR7918950 A FR 7918950A FR 7918950 A FR7918950 A FR 7918950A FR 2462026 A1 FR2462026 A1 FR 2462026A1
Authority
FR
France
Prior art keywords
layer
hybrid circuit
circuit
hybrid
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7918950A
Other languages
English (en)
French (fr)
Other versions
FR2462026B1 (https=
Inventor
Jean Joly
Michele Moulin
Jean-Bernard Ranger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lignes Telegraphiques et Telephoniques LTT SA
Original Assignee
Lignes Telegraphiques et Telephoniques LTT SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lignes Telegraphiques et Telephoniques LTT SA filed Critical Lignes Telegraphiques et Telephoniques LTT SA
Priority to FR7918950A priority Critical patent/FR2462026A1/fr
Publication of FR2462026A1 publication Critical patent/FR2462026A1/fr
Application granted granted Critical
Publication of FR2462026B1 publication Critical patent/FR2462026B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/6875—Shapes or dispositions thereof being on a metallic substrate, e.g. insulated metal substrates [IMS]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
FR7918950A 1979-07-23 1979-07-23 Procede de fabrication d'un circuit hybride sur un substrat en acier et circuit en resultant Granted FR2462026A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR7918950A FR2462026A1 (fr) 1979-07-23 1979-07-23 Procede de fabrication d'un circuit hybride sur un substrat en acier et circuit en resultant

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7918950A FR2462026A1 (fr) 1979-07-23 1979-07-23 Procede de fabrication d'un circuit hybride sur un substrat en acier et circuit en resultant

Publications (2)

Publication Number Publication Date
FR2462026A1 true FR2462026A1 (fr) 1981-02-06
FR2462026B1 FR2462026B1 (https=) 1983-03-18

Family

ID=9228174

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7918950A Granted FR2462026A1 (fr) 1979-07-23 1979-07-23 Procede de fabrication d'un circuit hybride sur un substrat en acier et circuit en resultant

Country Status (1)

Country Link
FR (1) FR2462026A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1417628A (fr) * 1963-12-19 1965-11-12 Thermonic Sa Fabrication de circuits imprimés
US3607381A (en) * 1968-06-14 1971-09-21 Platron Corp Spray process for creating electrical circuits
FR2145720A1 (https=) * 1971-07-14 1973-02-23 Lucas Industries Ltd

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1417628A (fr) * 1963-12-19 1965-11-12 Thermonic Sa Fabrication de circuits imprimés
US3607381A (en) * 1968-06-14 1971-09-21 Platron Corp Spray process for creating electrical circuits
FR2145720A1 (https=) * 1971-07-14 1973-02-23 Lucas Industries Ltd

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
EXBK/79 *

Also Published As

Publication number Publication date
FR2462026B1 (https=) 1983-03-18

Similar Documents

Publication Publication Date Title
EP1302954B1 (fr) Réalisation d'inductance et de via dans un circuit monolithique
US3386894A (en) Formation of metallic contacts
FR2566181A1 (fr) Procede d'autopositionnement d'une ligne d'interconnexion sur un trou de contact electrique d'un circuit integre
FR2646018A1 (fr) Dispositif semiconducteur et son procede de fabrication
GB2150749A (en) Integrated circuits
JPH0144024B2 (https=)
JP2014022699A (ja) パッケージおよびその製造方法
FR2462026A1 (fr) Procede de fabrication d'un circuit hybride sur un substrat en acier et circuit en resultant
CN111146155B (zh) 一种微波功放芯片载体及其制备方法
US9162878B2 (en) Wafer level hermetic bond using metal alloy with raised feature and wetting layer
US11676872B2 (en) Materials and methods for passivation of metal-plated through glass vias
FR2459557A1 (fr) Support metallique pour reseau d'interconnexion de composants electroniques et procede de fabrication de ce support
US6908561B1 (en) Polymide-to-substrate adhesion promotion in HDI
US3836446A (en) Semiconductor devices manufacture
FR2466103A1 (fr) Procede de realisation d'un reseau d'interconnexion de composants electroniques a conducteurs en aluminium et isolant en alumine et reseau d'interconnexion obtenu par ce procede
KR100720403B1 (ko) 구리배선의 표면 처리방법
US3978517A (en) Titanium-silver-palladium metallization system and process therefor
JPH0394451A (ja) 半導体装置の配線構造
FR2842351A1 (fr) Adaptation d'un circuit integre a des besoins specifiques
EP0997936B1 (fr) Procédé de fabrication d'une électrode de commande de grille pour transistor IGBT.
JPS5814541A (ja) 半導体素子用基板
FR2532472A1 (fr) Procede de fabrication de connexions electriques pour circuit hybride et circuit hybride comportant de telles connexions
US4214953A (en) Process for making semiconductor devices passivated by an integrated heat sink
JPH01262646A (ja) 半導体装置の製造方法
JPS6113375B2 (https=)

Legal Events

Date Code Title Description
ST Notification of lapse