FR2454178A1 - Procede pour ameliorer magnetiquement la pulverisation cathodique de cibles permeables magnetiquement et dispositif de pulverisation cathodique - Google Patents
Procede pour ameliorer magnetiquement la pulverisation cathodique de cibles permeables magnetiquement et dispositif de pulverisation cathodiqueInfo
- Publication number
- FR2454178A1 FR2454178A1 FR8007827A FR8007827A FR2454178A1 FR 2454178 A1 FR2454178 A1 FR 2454178A1 FR 8007827 A FR8007827 A FR 8007827A FR 8007827 A FR8007827 A FR 8007827A FR 2454178 A1 FR2454178 A1 FR 2454178A1
- Authority
- FR
- France
- Prior art keywords
- magnetically
- cathode spraying
- improving
- permeable targets
- spraying device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005507 spraying Methods 0.000 title abstract 4
- 238000000034 method Methods 0.000 title abstract 2
- 239000002245 particle Substances 0.000 abstract 1
- 229910000859 α-Fe Inorganic materials 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
- H01J37/3426—Material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
- H01J37/3408—Planar magnetron sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
- H01J37/3452—Magnet distribution
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Coating By Spraying Or Casting (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US2843479A | 1979-04-09 | 1979-04-09 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2454178A1 true FR2454178A1 (fr) | 1980-11-07 |
| FR2454178B1 FR2454178B1 (cg-RX-API-DMAC10.html) | 1983-11-25 |
Family
ID=21843423
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR8007827A Granted FR2454178A1 (fr) | 1979-04-09 | 1980-04-08 | Procede pour ameliorer magnetiquement la pulverisation cathodique de cibles permeables magnetiquement et dispositif de pulverisation cathodique |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPS593546B2 (cg-RX-API-DMAC10.html) |
| CA (1) | CA1153733A (cg-RX-API-DMAC10.html) |
| DE (1) | DE3012935C2 (cg-RX-API-DMAC10.html) |
| FR (1) | FR2454178A1 (cg-RX-API-DMAC10.html) |
| GB (1) | GB2051877B (cg-RX-API-DMAC10.html) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2517330A1 (fr) * | 1981-11-30 | 1983-06-03 | Anelva Corp | Appareil de projection de metal sur un substrat, en particulier du type a magnetron |
| EP0051635A4 (en) * | 1980-05-16 | 1983-09-26 | Varian Associates | Sputter target and device for coating by means of glow discharge. |
| FR2531810A1 (fr) * | 1982-08-16 | 1984-02-17 | Vac Tec Syst | Appareil a magnetron pour pulverisation a debit eleve de matiere a permeabilite elevee |
| EP0223975A3 (en) * | 1985-11-29 | 1989-02-08 | Materials Research Corporation | Diverter magnet arrangement for plasma processing system |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH649578A5 (de) * | 1981-03-27 | 1985-05-31 | Ulvac Corp | Hochgeschwindigkeits-kathoden-zerstaeubungsvorrichtung. |
| GB2096177B (en) * | 1981-04-07 | 1985-07-17 | Fournier Paul R | Improved integrated sputtering apparatus and method |
| JPS58130277A (ja) * | 1982-01-27 | 1983-08-03 | Clarion Co Ltd | マグネトロンスパツタ装置 |
| JPS5989769A (ja) * | 1982-11-15 | 1984-05-24 | Hitachi Ltd | プレ−ナマグネトロン型スパツタ電極 |
| US4581118A (en) * | 1983-01-26 | 1986-04-08 | Materials Research Corporation | Shaped field magnetron electrode |
| US4515675A (en) * | 1983-07-06 | 1985-05-07 | Leybold-Heraeus Gmbh | Magnetron cathode for cathodic evaportion apparatus |
| DE3429988A1 (de) * | 1983-12-05 | 1985-06-13 | Leybold-Heraeus GmbH, 5000 Köln | Magnetronkatode zum zerstaeuben ferromagnetischer targets |
| CH659484A5 (de) * | 1984-04-19 | 1987-01-30 | Balzers Hochvakuum | Anordnung zur beschichtung von substraten mittels kathodenzerstaeubung. |
| JPH0633454B2 (ja) * | 1984-11-20 | 1994-05-02 | 松下電器産業株式会社 | スパツタリング装置 |
| JPS62153365U (cg-RX-API-DMAC10.html) * | 1987-02-12 | 1987-09-29 | ||
| GB2209769A (en) * | 1987-09-16 | 1989-05-24 | Ion Tech Ltd | Sputter coating |
| JPH0219462A (ja) * | 1988-07-06 | 1990-01-23 | Ube Ind Ltd | マグネトロンスパッタリング方法及びその装置 |
| JP5869560B2 (ja) * | 2011-04-26 | 2016-02-24 | 株式会社アルバック | カソードユニット |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3878085A (en) * | 1973-07-05 | 1975-04-15 | Sloan Technology Corp | Cathode sputtering apparatus |
| FR2352393A1 (fr) * | 1976-05-19 | 1977-12-16 | Battelle Memorial Institute | Procede pour effectuer un depot dans une decharge luminescente sur au moins un substrat, et un decapage ionique de ce substrat et dispositif pour la mise en oeuvre de ce procede |
| US4094761A (en) * | 1977-07-25 | 1978-06-13 | Motorola, Inc. | Magnetion sputtering of ferromagnetic material |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3956093A (en) * | 1974-12-16 | 1976-05-11 | Airco, Inc. | Planar magnetron sputtering method and apparatus |
| NL7607473A (nl) * | 1976-07-07 | 1978-01-10 | Philips Nv | Verstuifinrichting en werkwijze voor het ver- stuiven met een dergelijke inrichting. |
-
1980
- 1980-03-27 GB GB8010244A patent/GB2051877B/en not_active Expired
- 1980-04-01 CA CA000349015A patent/CA1153733A/en not_active Expired
- 1980-04-02 DE DE19803012935 patent/DE3012935C2/de not_active Expired
- 1980-04-08 FR FR8007827A patent/FR2454178A1/fr active Granted
- 1980-04-08 JP JP4614480A patent/JPS593546B2/ja not_active Expired
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3878085A (en) * | 1973-07-05 | 1975-04-15 | Sloan Technology Corp | Cathode sputtering apparatus |
| FR2352393A1 (fr) * | 1976-05-19 | 1977-12-16 | Battelle Memorial Institute | Procede pour effectuer un depot dans une decharge luminescente sur au moins un substrat, et un decapage ionique de ce substrat et dispositif pour la mise en oeuvre de ce procede |
| US4094761A (en) * | 1977-07-25 | 1978-06-13 | Motorola, Inc. | Magnetion sputtering of ferromagnetic material |
| FR2398810A1 (fr) * | 1977-07-25 | 1979-02-23 | Motorola Inc | Procede de projection d'une matiere ferromagnetique |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0051635A4 (en) * | 1980-05-16 | 1983-09-26 | Varian Associates | Sputter target and device for coating by means of glow discharge. |
| FR2517330A1 (fr) * | 1981-11-30 | 1983-06-03 | Anelva Corp | Appareil de projection de metal sur un substrat, en particulier du type a magnetron |
| FR2531810A1 (fr) * | 1982-08-16 | 1984-02-17 | Vac Tec Syst | Appareil a magnetron pour pulverisation a debit eleve de matiere a permeabilite elevee |
| EP0223975A3 (en) * | 1985-11-29 | 1989-02-08 | Materials Research Corporation | Diverter magnet arrangement for plasma processing system |
Also Published As
| Publication number | Publication date |
|---|---|
| DE3012935C2 (de) | 1983-04-14 |
| CA1153733A (en) | 1983-09-13 |
| DE3012935A1 (de) | 1980-10-23 |
| JPS593546B2 (ja) | 1984-01-24 |
| FR2454178B1 (cg-RX-API-DMAC10.html) | 1983-11-25 |
| GB2051877A (en) | 1981-01-21 |
| JPS55148770A (en) | 1980-11-19 |
| GB2051877B (en) | 1983-03-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |