FR2429494A1 - Encapsulation semiconductor chip connector - has continuous metal strip with contact points bearing on chip - Google Patents

Encapsulation semiconductor chip connector - has continuous metal strip with contact points bearing on chip

Info

Publication number
FR2429494A1
FR2429494A1 FR7818528A FR7818528A FR2429494A1 FR 2429494 A1 FR2429494 A1 FR 2429494A1 FR 7818528 A FR7818528 A FR 7818528A FR 7818528 A FR7818528 A FR 7818528A FR 2429494 A1 FR2429494 A1 FR 2429494A1
Authority
FR
France
Prior art keywords
chip
contact points
metal strip
continuous metal
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7818528A
Other languages
French (fr)
Other versions
FR2429494B1 (en
Inventor
Alain Berest
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Le Materiel Telephonique Thomson CSF
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Le Materiel Telephonique Thomson CSF filed Critical Le Materiel Telephonique Thomson CSF
Priority to FR7818528A priority Critical patent/FR2429494A1/en
Publication of FR2429494A1 publication Critical patent/FR2429494A1/en
Application granted granted Critical
Publication of FR2429494B1 publication Critical patent/FR2429494B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

The method is suitable for mass-production techniques and consists of running the chips (P), previously part encapsulated within individual standard enclosures, beneath an insulating strip (I) carrying an interrupted copper or copper alloy ribbon (C) on its lower surface. This has small metallic contact points (1-4) which bear down on the contact area of the chip. Connection is made by an operation such as thermo-compression. The contact lead-out strips are finally bent into the required shape and a final encapsulation material injected into each enclosure.
FR7818528A 1978-06-21 1978-06-21 Encapsulation semiconductor chip connector - has continuous metal strip with contact points bearing on chip Granted FR2429494A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR7818528A FR2429494A1 (en) 1978-06-21 1978-06-21 Encapsulation semiconductor chip connector - has continuous metal strip with contact points bearing on chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7818528A FR2429494A1 (en) 1978-06-21 1978-06-21 Encapsulation semiconductor chip connector - has continuous metal strip with contact points bearing on chip

Publications (2)

Publication Number Publication Date
FR2429494A1 true FR2429494A1 (en) 1980-01-18
FR2429494B1 FR2429494B1 (en) 1982-11-26

Family

ID=9209793

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7818528A Granted FR2429494A1 (en) 1978-06-21 1978-06-21 Encapsulation semiconductor chip connector - has continuous metal strip with contact points bearing on chip

Country Status (1)

Country Link
FR (1) FR2429494A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4234993A1 (en) * 1991-10-18 1993-04-22 Samsung Electronics Co Ltd SEMICONDUCTOR HOUSING

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1471243A (en) * 1966-01-19 1967-03-03 Radiotechnique Enhancements to semiconductor devices embedded in a molded insulating protective coating
US3781596A (en) * 1972-07-07 1973-12-25 R Galli Semiconductor chip carriers and strips thereof
US3793714A (en) * 1971-05-27 1974-02-26 Texas Instruments Inc Integrated circuit assembly using etched metal patterns of flexible insulating film
US3838984A (en) * 1973-04-16 1974-10-01 Sperry Rand Corp Flexible carrier and interconnect for uncased ic chips
US3868724A (en) * 1973-11-21 1975-02-25 Fairchild Camera Instr Co Multi-layer connecting structures for packaging semiconductor devices mounted on a flexible carrier

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1471243A (en) * 1966-01-19 1967-03-03 Radiotechnique Enhancements to semiconductor devices embedded in a molded insulating protective coating
US3793714A (en) * 1971-05-27 1974-02-26 Texas Instruments Inc Integrated circuit assembly using etched metal patterns of flexible insulating film
US3781596A (en) * 1972-07-07 1973-12-25 R Galli Semiconductor chip carriers and strips thereof
US3838984A (en) * 1973-04-16 1974-10-01 Sperry Rand Corp Flexible carrier and interconnect for uncased ic chips
US3868724A (en) * 1973-11-21 1975-02-25 Fairchild Camera Instr Co Multi-layer connecting structures for packaging semiconductor devices mounted on a flexible carrier

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4234993A1 (en) * 1991-10-18 1993-04-22 Samsung Electronics Co Ltd SEMICONDUCTOR HOUSING

Also Published As

Publication number Publication date
FR2429494B1 (en) 1982-11-26

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Legal Events

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CL Concession to grant licences
ST Notification of lapse