FR2418606A1 - Plaquette de circuits imprimes avec composants implantes et procede de fabrication de ladite plaquette - Google Patents

Plaquette de circuits imprimes avec composants implantes et procede de fabrication de ladite plaquette

Info

Publication number
FR2418606A1
FR2418606A1 FR7827064A FR7827064A FR2418606A1 FR 2418606 A1 FR2418606 A1 FR 2418606A1 FR 7827064 A FR7827064 A FR 7827064A FR 7827064 A FR7827064 A FR 7827064A FR 2418606 A1 FR2418606 A1 FR 2418606A1
Authority
FR
France
Prior art keywords
board
printed circuit
components
manufacturing process
conductive tracks
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7827064A
Other languages
English (en)
Other versions
FR2418606B1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Technologies Corp
Original Assignee
Kollmorgen Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19787806329 external-priority patent/DE7806329U1/de
Priority claimed from DE2809013A external-priority patent/DE2809013C2/de
Application filed by Kollmorgen Technologies Corp filed Critical Kollmorgen Technologies Corp
Publication of FR2418606A1 publication Critical patent/FR2418606A1/fr
Application granted granted Critical
Publication of FR2418606B1 publication Critical patent/FR2418606B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09936—Marks, inscriptions, etc. for information
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10477—Inverted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

Plaquettes de circuits imprimés avec des composants implantés et procédé de fabrication de ces plaquettes. La plaquette est munie sur l'une des faces de pistes conductrices et comporte des trous métallisés. Les composants 6 sont disposés sur la face 8 munie des pistes conductrices 2 du plan de câblage de la plaquette 1, et les espaces intermédiaires entre la couche métallique 3 des parois des trous et les fils de connexion 5 des composants 6 sont alimentés en alliage de soudure 4 au moyen d'un processus de soudure, effectué à partir de la face 7 de la plaquette 1 dépourvue de pistes conductrices 2 du plan de câblage, par réchauffement des extrémités des fils de connexion 5 qui traversent les trous 9 dont ils font librement saillie. Applications à la fabrication de circuits imprimés.
FR7827064A 1978-02-28 1978-09-21 Plaquette de circuits imprimes avec composants implantes et procede de fabrication de ladite plaquette Granted FR2418606A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19787806329 DE7806329U1 (fr) 1978-02-28 1978-02-28
DE2809013A DE2809013C2 (de) 1978-02-28 1978-02-28 Verfahren zum Herstellen einer mit Bauelementen bestückten gedruckten Schaltungsplatte

Publications (2)

Publication Number Publication Date
FR2418606A1 true FR2418606A1 (fr) 1979-09-21
FR2418606B1 FR2418606B1 (fr) 1981-12-11

Family

ID=25773955

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7827064A Granted FR2418606A1 (fr) 1978-02-28 1978-09-21 Plaquette de circuits imprimes avec composants implantes et procede de fabrication de ladite plaquette

Country Status (4)

Country Link
CH (1) CH639516A5 (fr)
FR (1) FR2418606A1 (fr)
GB (1) GB2026918B (fr)
NL (1) NL185051C (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0393761A1 (fr) * 1989-04-20 1990-10-24 Koninklijke Philips Electronics N.V. Procédé de montage de composants électriques et/ou électroniques sur une platine à pistes imprimées à une seule face

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2210818A (en) * 1987-10-10 1989-06-21 Plessey Co Plc A process for soldering a component to a printed circuit board
CN115551188B (zh) * 2022-11-30 2023-07-25 苏州浪潮智能科技有限公司 交换机、车辆、光伏设备、电路板及电路板制造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1209146A (fr) * 1957-05-27 1960-02-29 Thomson Houston Comp Francaise Perfectionnements au montage d'éléments électriques sur des circuits imprimés
US3786172A (en) * 1972-12-07 1974-01-15 Accra Point Arrays Corp Printed circuit board method and apparatus

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1209146A (fr) * 1957-05-27 1960-02-29 Thomson Houston Comp Francaise Perfectionnements au montage d'éléments électriques sur des circuits imprimés
US3786172A (en) * 1972-12-07 1974-01-15 Accra Point Arrays Corp Printed circuit board method and apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0393761A1 (fr) * 1989-04-20 1990-10-24 Koninklijke Philips Electronics N.V. Procédé de montage de composants électriques et/ou électroniques sur une platine à pistes imprimées à une seule face

Also Published As

Publication number Publication date
GB2026918B (en) 1982-11-03
NL7810034A (nl) 1979-08-30
NL185051C (nl) 1990-01-02
GB2026918A (en) 1980-02-13
NL185051B (nl) 1989-08-01
FR2418606B1 (fr) 1981-12-11
CH639516A5 (de) 1983-11-15

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Legal Events

Date Code Title Description
ST Notification of lapse