FR2400304B1 - - Google Patents

Info

Publication number
FR2400304B1
FR2400304B1 FR7810552A FR7810552A FR2400304B1 FR 2400304 B1 FR2400304 B1 FR 2400304B1 FR 7810552 A FR7810552 A FR 7810552A FR 7810552 A FR7810552 A FR 7810552A FR 2400304 B1 FR2400304 B1 FR 2400304B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7810552A
Other versions
FR2400304A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Technologies Corp
Original Assignee
Kollmorgen Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Technologies Corp filed Critical Kollmorgen Technologies Corp
Publication of FR2400304A1 publication Critical patent/FR2400304A1/fr
Application granted granted Critical
Publication of FR2400304B1 publication Critical patent/FR2400304B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/06—Wiring by machine
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
FR7810552A 1977-08-09 1978-04-10 Procedes et appareils perfectionnes pour la realisation de circuits a conducteurs filaires Granted FR2400304A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US82315377A 1977-08-09 1977-08-09

Publications (2)

Publication Number Publication Date
FR2400304A1 FR2400304A1 (fr) 1979-03-09
FR2400304B1 true FR2400304B1 (fr) 1982-02-12

Family

ID=25237948

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7810552A Granted FR2400304A1 (fr) 1977-08-09 1978-04-10 Procedes et appareils perfectionnes pour la realisation de circuits a conducteurs filaires

Country Status (14)

Country Link
JP (1) JPS5430470A (fr)
AT (1) AT377890B (fr)
AU (1) AU508357B2 (fr)
BR (1) BR7707302A (fr)
CA (1) CA1102924A (fr)
CH (1) CH629058A5 (fr)
DE (1) DE2811458C2 (fr)
FR (1) FR2400304A1 (fr)
GB (1) GB1593235A (fr)
IL (1) IL54283A (fr)
IT (1) IT1155890B (fr)
NL (1) NL7806258A (fr)
SE (1) SE429702B (fr)
ZA (1) ZA775455B (fr)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2466936A1 (fr) * 1979-09-28 1981-04-10 Cii Honeywell Bull Appareil de cablage a la surface d'un substrat d'interconnexion
US4500389A (en) * 1981-04-14 1985-02-19 Kollmorgen Technologies Corporation Process for the manufacture of substrates to interconnect electronic components
FR2507855A1 (fr) * 1981-06-11 1982-12-17 Kurganov Vladimir Tete de distribution d'une machine de cablage automatique
FR2509950A1 (fr) * 1981-07-16 1983-01-21 Egorenkov Arvit Dispositif pour le montage d'un cable sur une plaque
JPS59186851A (ja) * 1983-04-04 1984-10-23 Kataoka Kikai Seisakusho:Kk シ−ト巻取り準備装置
US4711026A (en) * 1985-07-19 1987-12-08 Kollmorgen Technologies Corporation Method of making wires scribed circuit boards
FR2585210B1 (fr) * 1985-07-19 1994-05-06 Kollmorgen Technologies Corp Procede de fabrication de plaquettes a circuits d'interconnexion
US4818322A (en) * 1985-07-19 1989-04-04 Kollmorgen Technologies Corporation Method for scribing conductors via laser
US4859807A (en) * 1985-07-19 1989-08-22 Kollmorgen Technologies Corporation Wire scribed circuit boards and method of manufacture
US4641773A (en) * 1985-08-09 1987-02-10 Kollmorgen Technologies Corp. Ultrasonic stylus position stabilizer
US4908939A (en) * 1985-10-18 1990-03-20 Kollmorgen Corporation Method of making coaxial interconnection boards
JP2612038B2 (ja) * 1988-06-22 1997-05-21 大日本印刷株式会社 小巻き用ボビンへのフイルム接着装置
JP2672925B2 (ja) * 1992-08-26 1997-11-05 ワイケイケイ株式会社 テープ状体の自動巻取機
WO2006050691A2 (fr) 2004-11-02 2006-05-18 Imasys Ag Dispositif de pose, dispositif d'etablissement de contact, systeme d'avance, unite de pose et d'etablissement de contact, installation de production, procede de production et ensemble transpondeur
US7971339B2 (en) 2006-09-26 2011-07-05 Hid Global Gmbh Method and apparatus for making a radio frequency inlay
US8322624B2 (en) 2007-04-10 2012-12-04 Feinics Amatech Teoranta Smart card with switchable matching antenna
US8608080B2 (en) 2006-09-26 2013-12-17 Feinics Amatech Teoranta Inlays for security documents
US7979975B2 (en) 2007-04-10 2011-07-19 Feinics Amatech Teavanta Methods of connecting an antenna to a transponder chip
US7546671B2 (en) 2006-09-26 2009-06-16 Micromechanic And Automation Technology Ltd. Method of forming an inlay substrate having an antenna wire
US7581308B2 (en) 2007-01-01 2009-09-01 Advanced Microelectronic And Automation Technology Ltd. Methods of connecting an antenna to a transponder chip
US8286332B2 (en) 2006-09-26 2012-10-16 Hid Global Gmbh Method and apparatus for making a radio frequency inlay
US7980477B2 (en) 2007-05-17 2011-07-19 Féinics Amatech Teoranta Dual interface inlays
DE602007010634D1 (de) 2007-09-18 2010-12-30 Baile Na Habhann Co Galway Verfahren zur Kontaktierung eines Drahtleiters gelegt auf ein Substrat
EP2704186A1 (fr) * 2012-08-27 2014-03-05 Garreth Finlay Procédé pour poser un fil conducteur sur un substrat et permettant de le relier à une puce

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE663052A (fr) * 1964-04-27
US3674914A (en) * 1968-02-09 1972-07-04 Photocircuits Corp Wire scribed circuit boards and method of manufacture
JPS5550399B1 (fr) * 1970-03-05 1980-12-17
FR2304247A1 (fr) * 1975-03-12 1976-10-08 Commissariat Energie Atomique Procede et dispositif d'interconnexion de composants electroniques

Also Published As

Publication number Publication date
IT7848473A0 (it) 1978-03-17
JPS618596B2 (fr) 1986-03-15
IT1155890B (it) 1987-01-28
ZA775455B (en) 1978-07-26
DE2811458A1 (de) 1979-02-15
SE429702B (sv) 1983-09-19
DE2811458C2 (de) 1983-12-29
SE7802720L (sv) 1979-02-10
JPS5430470A (en) 1979-03-06
AU508357B2 (en) 1980-03-20
IL54283A0 (en) 1978-06-15
AU3026177A (en) 1979-05-10
ATA183578A (de) 1984-09-15
BR7707302A (pt) 1979-05-29
IL54283A (en) 1980-07-31
CA1102924A (fr) 1981-06-09
GB1593235A (en) 1981-07-15
CH629058A5 (en) 1982-03-31
NL7806258A (nl) 1979-02-13
FR2400304A1 (fr) 1979-03-09
AT377890B (de) 1985-05-10

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Legal Events

Date Code Title Description
TP Transmission of property
TP Transmission of property
ST Notification of lapse