FR2395675A1 - Multilayer circuit board with integral flexible appendages - uses array of flexible circuit layers bonded between rigid layers having suitable electrical connections - Google Patents

Multilayer circuit board with integral flexible appendages - uses array of flexible circuit layers bonded between rigid layers having suitable electrical connections

Info

Publication number
FR2395675A1
FR2395675A1 FR7718934A FR7718934A FR2395675A1 FR 2395675 A1 FR2395675 A1 FR 2395675A1 FR 7718934 A FR7718934 A FR 7718934A FR 7718934 A FR7718934 A FR 7718934A FR 2395675 A1 FR2395675 A1 FR 2395675A1
Authority
FR
France
Prior art keywords
flexible
layers
circuit board
rigid
electrical connections
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7718934A
Other languages
French (fr)
Other versions
FR2395675B3 (en
Inventor
Glen James Taylor
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Martin Marietta Corp
Original Assignee
Martin Marietta Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Martin Marietta Corp filed Critical Martin Marietta Corp
Priority to FR7718934A priority Critical patent/FR2395675A1/en
Publication of FR2395675A1 publication Critical patent/FR2395675A1/en
Application granted granted Critical
Publication of FR2395675B3 publication Critical patent/FR2395675B3/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/0909—Preformed cutting or breaking line

Abstract

All the layers are substantially larger than the size the finished circuit board is to be and selectively bonded and slotted in pre-selected locations, and maintained in this over-sized condition throughout the procedure in which holes for interconnections are drilled, and plated through with conductive material. Only after the plating procedure has been completed are the portions of the upper and lower rigid layers removed from locations above and below the appendage portions, thus allowing them to attain the desired, flexible condition. By keeping the rigid layers intact, the assemblage is maintained rigid during the plating, thereby avoiding work hardening of the flexible portions even without tools for restraining the flexible portions.
FR7718934A 1977-06-21 1977-06-21 Multilayer circuit board with integral flexible appendages - uses array of flexible circuit layers bonded between rigid layers having suitable electrical connections Granted FR2395675A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR7718934A FR2395675A1 (en) 1977-06-21 1977-06-21 Multilayer circuit board with integral flexible appendages - uses array of flexible circuit layers bonded between rigid layers having suitable electrical connections

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7718934A FR2395675A1 (en) 1977-06-21 1977-06-21 Multilayer circuit board with integral flexible appendages - uses array of flexible circuit layers bonded between rigid layers having suitable electrical connections

Publications (2)

Publication Number Publication Date
FR2395675A1 true FR2395675A1 (en) 1979-01-19
FR2395675B3 FR2395675B3 (en) 1980-03-21

Family

ID=9192336

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7718934A Granted FR2395675A1 (en) 1977-06-21 1977-06-21 Multilayer circuit board with integral flexible appendages - uses array of flexible circuit layers bonded between rigid layers having suitable electrical connections

Country Status (1)

Country Link
FR (1) FR2395675A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2470519A1 (en) * 1979-11-20 1981-05-29 Kollmorgen Tech Corp CONDUCTIVE PADS HAVING RIGID AND FLEXIBLE REGIONS AND METHOD FOR MANUFACTURING THE SAME

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2470519A1 (en) * 1979-11-20 1981-05-29 Kollmorgen Tech Corp CONDUCTIVE PADS HAVING RIGID AND FLEXIBLE REGIONS AND METHOD FOR MANUFACTURING THE SAME

Also Published As

Publication number Publication date
FR2395675B3 (en) 1980-03-21

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