FR2383519A1 - Procede de fabrication d'un boitier de composant a semi-conducteur - Google Patents

Procede de fabrication d'un boitier de composant a semi-conducteur

Info

Publication number
FR2383519A1
FR2383519A1 FR7720810A FR7720810A FR2383519A1 FR 2383519 A1 FR2383519 A1 FR 2383519A1 FR 7720810 A FR7720810 A FR 7720810A FR 7720810 A FR7720810 A FR 7720810A FR 2383519 A1 FR2383519 A1 FR 2383519A1
Authority
FR
France
Prior art keywords
semiconductor component
manufacturing
component case
blank
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7720810A
Other languages
English (en)
Other versions
FR2383519B1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Luvata Ohio Inc
Original Assignee
Nippert Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippert Co filed Critical Nippert Co
Publication of FR2383519A1 publication Critical patent/FR2383519A1/fr
Application granted granted Critical
Publication of FR2383519B1 publication Critical patent/FR2383519B1/fr
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/14—Soldering, e.g. brazing, or unsoldering specially adapted for soldering seams
    • B23K1/18—Soldering, e.g. brazing, or unsoldering specially adapted for soldering seams circumferential seams, e.g. of shells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4878—Mechanical treatment, e.g. deforming
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S29/00—Metal working
    • Y10S29/047—Extruding with other step
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Forging (AREA)
  • Die Bonding (AREA)

Abstract

Procédé de fabrication d'un boîtier de diode ou autre composant à semi-conducteur. Il consiste à centrer un tube 20 d'acier dans une ébauche 10 en utilisant un évidement ou un bossage présenté par la surface supérieure de cette ébauche et réalisé par formage à froid. Domaine d'application : boîtiers pour composants à semi-conducteur.
FR7720810A 1977-03-11 1977-07-06 Procede de fabrication d'un boitier de composant a semi-conducteur Granted FR2383519A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/776,709 US4049185A (en) 1977-03-11 1977-03-11 Method of forming double extruded mount

Publications (2)

Publication Number Publication Date
FR2383519A1 true FR2383519A1 (fr) 1978-10-06
FR2383519B1 FR2383519B1 (fr) 1984-10-05

Family

ID=25108154

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7720810A Granted FR2383519A1 (fr) 1977-03-11 1977-07-06 Procede de fabrication d'un boitier de composant a semi-conducteur

Country Status (6)

Country Link
US (1) US4049185A (fr)
JP (1) JPS5812735B2 (fr)
CA (1) CA1075376A (fr)
DE (1) DE2726773C3 (fr)
FR (1) FR2383519A1 (fr)
GB (1) GB1581937A (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4624303A (en) * 1985-04-29 1986-11-25 The Nippert Company Heat sink mounting and method of making
CA1238161A (fr) * 1985-12-02 1988-06-21 Jobst U. Gellert Fabrication de buses a fenetres configurables au choix pour le moulage par injection
CN100349687C (zh) * 2004-08-08 2007-11-21 湖北汽车工业学院 点焊电极表面电火花熔敷涂层用的熔敷棒及其制备方法
US7538294B2 (en) * 2005-05-17 2009-05-26 Huys Industries Limited Welding electrode and method
AU2015283806B2 (en) * 2014-06-30 2020-02-20 Sunspin Pty Ltd A method of forming a sealed joint between a tubular article and a sheet article

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2113995A1 (fr) * 1970-11-16 1972-06-30 Sato Yoshio
US3893226A (en) * 1970-03-06 1975-07-08 Gkn Floform Ltd Method of making semi-conductor mounts
US3918625A (en) * 1974-10-03 1975-11-11 Nippert Co Method of making a double extruded semiconductor joint

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL120008C (fr) * 1959-05-15
US3015760A (en) * 1959-06-10 1962-01-02 Philips Corp Semi-conductor devices
US3005867A (en) * 1959-10-30 1961-10-24 Westinghouse Electric Corp Hermetically sealed semiconductor devices
US3197843A (en) * 1961-05-19 1965-08-03 Nippert Electric Products Comp Method of forming a mount for semiconductors
US3197857A (en) * 1962-12-21 1965-08-03 Nippert Electric Products Comp Method of producing cup-shaped conductive semi-conductor housing
NL295109A (fr) * 1962-12-26
US3408451A (en) * 1965-09-01 1968-10-29 Texas Instruments Inc Electrical device package

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3893226A (en) * 1970-03-06 1975-07-08 Gkn Floform Ltd Method of making semi-conductor mounts
FR2113995A1 (fr) * 1970-11-16 1972-06-30 Sato Yoshio
US3918625A (en) * 1974-10-03 1975-11-11 Nippert Co Method of making a double extruded semiconductor joint

Also Published As

Publication number Publication date
DE2726773A1 (de) 1978-09-14
CA1075376A (fr) 1980-04-08
JPS5812735B2 (ja) 1983-03-10
FR2383519B1 (fr) 1984-10-05
JPS53112665A (en) 1978-10-02
DE2726773C3 (de) 1981-10-29
DE2726773B2 (de) 1980-10-16
GB1581937A (en) 1980-12-31
US4049185A (en) 1977-09-20

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Legal Events

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ST Notification of lapse