FR2340621A1 - Transistor a effet de champ ayant une stabilite de seuil perfectionnee - Google Patents

Transistor a effet de champ ayant une stabilite de seuil perfectionnee

Info

Publication number
FR2340621A1
FR2340621A1 FR7623637A FR7623637A FR2340621A1 FR 2340621 A1 FR2340621 A1 FR 2340621A1 FR 7623637 A FR7623637 A FR 7623637A FR 7623637 A FR7623637 A FR 7623637A FR 2340621 A1 FR2340621 A1 FR 2340621A1
Authority
FR
France
Prior art keywords
field
effect transistor
threshold stability
advanced
advanced threshold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7623637A
Other languages
English (en)
Other versions
FR2340621B1 (fr
Inventor
Richard C Joy
Ingrid E Magdo
Alfred Phillips Jr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=24464629&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=FR2340621(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of FR2340621A1 publication Critical patent/FR2340621A1/fr
Application granted granted Critical
Publication of FR2340621B1 publication Critical patent/FR2340621B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/7833—Field effect transistors with field effect produced by an insulated gate with lightly doped drain or source extension, e.g. LDD MOSFET's; DDD MOSFET's
    • H01L29/7836—Field effect transistors with field effect produced by an insulated gate with lightly doped drain or source extension, e.g. LDD MOSFET's; DDD MOSFET's with a significant overlap between the lightly doped extension and the gate electrode
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/053—Field effect transistors fets
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/167—Two diffusions in one hole
FR7623637A 1975-09-22 1976-07-27 Transistor a effet de champ ayant une stabilite de seuil perfectionnee Granted FR2340621A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/615,251 US4028717A (en) 1975-09-22 1975-09-22 Field effect transistor having improved threshold stability

Publications (2)

Publication Number Publication Date
FR2340621A1 true FR2340621A1 (fr) 1977-09-02
FR2340621B1 FR2340621B1 (fr) 1979-03-02

Family

ID=24464629

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7623637A Granted FR2340621A1 (fr) 1975-09-22 1976-07-27 Transistor a effet de champ ayant une stabilite de seuil perfectionnee

Country Status (10)

Country Link
US (3) US4028717A (fr)
JP (1) JPS5239381A (fr)
CA (1) CA1049154A (fr)
CH (1) CH600575A5 (fr)
DE (1) DE2636214C2 (fr)
FR (1) FR2340621A1 (fr)
GB (1) GB1497626A (fr)
IT (1) IT1074051B (fr)
NL (1) NL7609801A (fr)
PT (1) PT65536B (fr)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4028717A (en) * 1975-09-22 1977-06-07 Ibm Corporation Field effect transistor having improved threshold stability
JPS52124166U (fr) * 1976-03-16 1977-09-21
JPS53128281A (en) * 1977-04-15 1978-11-09 Hitachi Ltd Insulated gate field effect type semiconductor device for large power
US4145233A (en) * 1978-05-26 1979-03-20 Ncr Corporation Method for making narrow channel FET by masking and ion-implantation
US4263057A (en) * 1978-04-19 1981-04-21 Rca Corporation Method of manufacturing short channel MOS devices
US4225875A (en) * 1978-04-19 1980-09-30 Rca Corporation Short channel MOS devices and the method of manufacturing same
DE2821975C2 (de) * 1978-05-19 1983-01-27 Siemens AG, 1000 Berlin und 8000 München Metall-Halbleiter-Feldeffekttransistor (MESFET) und Verfahren zu dessen Herstellung
JPS5553462A (en) * 1978-10-13 1980-04-18 Int Rectifier Corp Mosfet element
US4218267A (en) * 1979-04-23 1980-08-19 Rockwell International Corporation Microelectronic fabrication method minimizing threshold voltage variation
US4257826A (en) * 1979-10-11 1981-03-24 Texas Instruments Incorporated Photoresist masking in manufacture of semiconductor device
US4369072A (en) * 1981-01-22 1983-01-18 International Business Machines Corp. Method for forming IGFET devices having improved drain voltage characteristics
JPS5833870A (ja) * 1981-08-24 1983-02-28 Hitachi Ltd 半導体装置
JPS5950562A (ja) * 1982-09-17 1984-03-23 Toshiba Corp 半導体装置
US4602965A (en) * 1984-03-13 1986-07-29 Communications Satellite Corporation Method of making FETs in GaAs by dual species implantation of silicon and boron
JPH0612822B2 (ja) * 1984-07-27 1994-02-16 株式会社日立製作所 半導体装置
US4691433A (en) * 1985-04-12 1987-09-08 General Electric Company Hybrid extended drain concept for reduced hot electron effect
US4680603A (en) * 1985-04-12 1987-07-14 General Electric Company Graded extended drain concept for reduced hot electron effect
JPS63119574A (ja) * 1986-11-07 1988-05-24 Toshiba Corp 半導体装置の製造方法
JPS63302535A (ja) * 1987-06-03 1988-12-09 Mitsubishi Electric Corp ガリウム砒素集積回路
US5024960A (en) * 1987-06-16 1991-06-18 Texas Instruments Incorporated Dual LDD submicron CMOS process for making low and high voltage transistors with common gate
US5021851A (en) * 1988-05-03 1991-06-04 Texas Instruments Incorporated NMOS source/drain doping with both P and As
US5006477A (en) * 1988-11-25 1991-04-09 Hughes Aircraft Company Method of making a latch up free, high voltage, CMOS bulk process for sub-half micron devices
GB8907898D0 (en) 1989-04-07 1989-05-24 Inmos Ltd Semiconductor devices and fabrication thereof
US5550069A (en) * 1990-06-23 1996-08-27 El Mos Electronik In Mos Technologie Gmbh Method for producing a PMOS transistor
DE4020076A1 (de) * 1990-06-23 1992-01-09 El Mos Elektronik In Mos Techn Verfahren zur herstellung eines pmos-transistors sowie pmos-transistor
US5397715A (en) * 1993-10-21 1995-03-14 Micrel, Incorporated MOS transistor having increased gate-drain capacitance
US5453392A (en) * 1993-12-02 1995-09-26 United Microelectronics Corporation Process for forming flat-cell mask ROMS
US5744372A (en) * 1995-04-12 1998-04-28 National Semiconductor Corporation Fabrication of complementary field-effect transistors each having multi-part channel
FR2794898B1 (fr) 1999-06-11 2001-09-14 France Telecom Dispositif semi-conducteur a tension de seuil compensee et procede de fabrication
US7259072B2 (en) * 2004-04-21 2007-08-21 Chartered Semiconductor Manufacturing Ltd. Shallow low energy ion implantation into pad oxide for improving threshold voltage stability
US7419892B2 (en) * 2005-12-13 2008-09-02 Cree, Inc. Semiconductor devices including implanted regions and protective layers and methods of forming the same
US7807555B2 (en) * 2007-07-31 2010-10-05 Intersil Americas, Inc. Method of forming the NDMOS device body with the reduced number of masks

Family Cites Families (19)

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Publication number Priority date Publication date Assignee Title
US3408543A (en) * 1964-06-01 1968-10-29 Hitachi Ltd Combination capacitor and fieldeffect transistor
US3397326A (en) * 1965-03-30 1968-08-13 Westinghouse Electric Corp Bipolar transistor with field effect biasing means
US3340598A (en) * 1965-04-19 1967-09-12 Teledyne Inc Method of making field effect transistor device
US3434021A (en) * 1967-01-13 1969-03-18 Rca Corp Insulated gate field effect transistor
GB1280022A (en) * 1968-08-30 1972-07-05 Mullard Ltd Improvements in and relating to semiconductor devices
US3614555A (en) * 1968-12-23 1971-10-19 Bell Telephone Labor Inc Monolithic integrated circuit structure
US4005450A (en) * 1970-05-13 1977-01-25 Hitachi, Ltd. Insulated gate field effect transistor having drain region containing low impurity concentration layer
JPS4936514B1 (fr) * 1970-05-13 1974-10-01
NL7017066A (fr) * 1970-11-21 1972-05-24
US3974516A (en) * 1970-11-21 1976-08-10 U.S. Philips Corporation Method of manufacturing a semiconductor device having at least one insulated gate field effect transistor, and semiconductor device manufactured by using the method
US3879236A (en) * 1971-03-26 1975-04-22 Ibm Method of making a semiconductor resistor
US3793721A (en) * 1971-08-02 1974-02-26 Texas Instruments Inc Integrated circuit and method of fabrication
US3895390A (en) * 1972-11-24 1975-07-15 Signetics Corp Metal oxide semiconductor structure and method using ion implantation
JPS49105490A (fr) * 1973-02-07 1974-10-05
JPS5636585B2 (fr) * 1973-07-02 1981-08-25
US3986903A (en) * 1974-03-13 1976-10-19 Intel Corporation Mosfet transistor and method of fabrication
US3959025A (en) * 1974-05-01 1976-05-25 Rca Corporation Method of making an insulated gate field effect transistor
JPS6014512B2 (ja) * 1975-03-04 1985-04-13 日本電信電話株式会社 絶縁ゲ−ト型電界効果トランジスタ
US4028717A (en) * 1975-09-22 1977-06-07 Ibm Corporation Field effect transistor having improved threshold stability

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
IBM TECHNICAL DISCLOSURE BULLETIN, VOLUME 15, NO. 6, NOVEMBRE 1972, NEW YORK *
P. KRICK ET P. PLESHKO: "INTEGRATABLE, SYMMETRICAL HIGH-VOLTAGE MOSFET STRUCTURE", PAGES 1884-1885) *

Also Published As

Publication number Publication date
GB1497626A (en) 1978-01-12
JPS5239381A (en) 1977-03-26
CA1049154A (fr) 1979-02-20
DE2636214A1 (de) 1977-03-31
DE2636214C2 (de) 1983-09-22
NL7609801A (nl) 1977-03-24
IT1074051B (it) 1985-04-17
FR2340621B1 (fr) 1979-03-02
US4154626A (en) 1979-05-15
JPS5626146B2 (fr) 1981-06-17
US4028717A (en) 1977-06-07
CH600575A5 (fr) 1978-06-15
US4089712A (en) 1978-05-16
PT65536A (en) 1976-09-01
PT65536B (en) 1978-02-22

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Legal Events

Date Code Title Description
ST Notification of lapse