FR2337893A1 - Procede de fabrication de micro-motifs et micro-substrats appropries - Google Patents

Procede de fabrication de micro-motifs et micro-substrats appropries

Info

Publication number
FR2337893A1
FR2337893A1 FR7700177A FR7700177A FR2337893A1 FR 2337893 A1 FR2337893 A1 FR 2337893A1 FR 7700177 A FR7700177 A FR 7700177A FR 7700177 A FR7700177 A FR 7700177A FR 2337893 A1 FR2337893 A1 FR 2337893A1
Authority
FR
France
Prior art keywords
micro
patterns
manufacturing process
appropriate
substrates manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7700177A
Other languages
English (en)
French (fr)
Other versions
FR2337893B1 (cg-RX-API-DMAC10.html
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dios Inc
Original Assignee
Dios Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dios Inc filed Critical Dios Inc
Publication of FR2337893A1 publication Critical patent/FR2337893A1/fr
Application granted granted Critical
Publication of FR2337893B1 publication Critical patent/FR2337893B1/fr
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03C—PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR, STEREO-PHOTOGRAPHIC PROCESSES; AUXILIARY PROCESSES IN PHOTOGRAPHY
    • G03C1/00—Photosensitive materials
    • G03C1/76—Photosensitive materials characterised by the base or auxiliary layers
    • G03C1/91—Photosensitive materials characterised by the base or auxiliary layers characterised by subbing layers or subbing means
    • G03C1/93—Macromolecular substances therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/002—Biomolecular computers, i.e. using biomolecules, proteins, cells
    • H10P14/683—
    • H10P76/2045—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H05K3/143—Masks therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/942—Masking
    • Y10S438/948—Radiation resist
    • Y10S438/949—Energy beam treating radiation resist on semiconductor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/261—In terms of molecular thickness or light wave length
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
    • Y10T428/264—Up to 3 mils
    • Y10T428/265—1 mil or less
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
    • Y10T428/31685—Natural source polyamide [e.g., casein, gelatin, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31688—Next to aldehyde or ketone condensation product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31692—Next to addition polymer from unsaturated monomers
    • Y10T428/31699—Ester, halide or nitrile of addition polymer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31725—Of polyamide
    • Y10T428/31768—Natural source-type polyamide [e.g., casein, gelatin, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31855—Of addition polymer from unsaturated monomers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31855—Of addition polymer from unsaturated monomers
    • Y10T428/31935—Ester, halide or nitrile of addition polymer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31942—Of aldehyde or ketone condensation product

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Biophysics (AREA)
  • Mathematical Physics (AREA)
  • Nanotechnology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Data Mining & Analysis (AREA)
  • General Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Artificial Intelligence (AREA)
  • Biomedical Technology (AREA)
  • Computational Linguistics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Evolutionary Computation (AREA)
  • General Health & Medical Sciences (AREA)
  • Molecular Biology (AREA)
  • Computing Systems (AREA)
  • Organic Chemistry (AREA)
  • Software Systems (AREA)
  • Materials Engineering (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Peptides Or Proteins (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Laminated Bodies (AREA)
  • Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Apparatus Associated With Microorganisms And Enzymes (AREA)
FR7700177A 1976-01-09 1977-01-05 Procede de fabrication de micro-motifs et micro-substrats appropries Granted FR2337893A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/647,871 US4103064A (en) 1976-01-09 1976-01-09 Microdevice substrate and method for making micropattern devices

Publications (2)

Publication Number Publication Date
FR2337893A1 true FR2337893A1 (fr) 1977-08-05
FR2337893B1 FR2337893B1 (cg-RX-API-DMAC10.html) 1982-06-25

Family

ID=24598598

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7700177A Granted FR2337893A1 (fr) 1976-01-09 1977-01-05 Procede de fabrication de micro-motifs et micro-substrats appropries

Country Status (7)

Country Link
US (1) US4103064A (cg-RX-API-DMAC10.html)
JP (1) JPS5286077A (cg-RX-API-DMAC10.html)
CA (1) CA1066209A (cg-RX-API-DMAC10.html)
DE (1) DE2659604A1 (cg-RX-API-DMAC10.html)
FR (1) FR2337893A1 (cg-RX-API-DMAC10.html)
GB (1) GB1572510A (cg-RX-API-DMAC10.html)
NL (1) NL7614535A (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0007784A1 (en) * 1978-07-21 1980-02-06 Process Shizai Co. Ltd. Thermal recording material

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JPS5843634B2 (ja) * 1977-04-19 1983-09-28 旭有機材工業株式会社 蝶形弁
US4176003A (en) * 1978-02-22 1979-11-27 Ncr Corporation Method for enhancing the adhesion of photoresist to polysilicon
US4289845A (en) * 1978-05-22 1981-09-15 Bell Telephone Laboratories, Inc. Fabrication based on radiation sensitive resists and related products
US4253888A (en) * 1978-06-16 1981-03-03 Matsushita Electric Industrial Co., Ltd. Pretreatment of photoresist masking layers resulting in higher temperature device processing
US5500188A (en) * 1984-03-01 1996-03-19 Molecular Devices Corporation Device for photoresponsive detection and discrimination
US4613541A (en) * 1985-01-12 1986-09-23 Mitsubishi Denki Kabushiki Kaisha Electronic device using electron transport proteins
US5173365A (en) * 1985-03-25 1992-12-22 Nanofilm Corporation Ultra-thin molecular film
US4802951A (en) * 1986-03-07 1989-02-07 Trustees Of Boston University Method for parallel fabrication of nanometer scale multi-device structures
US4728591A (en) * 1986-03-07 1988-03-01 Trustees Of Boston University Self-assembled nanometer lithographic masks and templates and method for parallel fabrication of nanometer scale multi-device structures
JPH077852B2 (ja) * 1986-07-11 1995-01-30 三菱電機株式会社 生物電気素子回路
DE3721793A1 (de) * 1986-07-01 1988-04-07 Mitsubishi Electric Corp Elektrisches element mit verwendung von oxidations-reduktions-substanzen
US4764416A (en) * 1986-07-01 1988-08-16 Mitsubishi Denki Kabushiki Kaisha Electric element circuit using oxidation-reduction substances
JPH07118555B2 (ja) * 1986-07-01 1995-12-18 三菱電機株式会社 スイツチ素子
DE3722941A1 (de) * 1986-07-11 1988-01-21 Mitsubishi Electric Corp Hybridschaltkreiselement und verfahren zu seiner herstellung
JPS6319858A (ja) * 1986-07-11 1988-01-27 Mitsubishi Electric Corp 生物電気素子回路
JPH0682827B2 (ja) * 1986-07-11 1994-10-19 三菱電機株式会社 ハイブリツド回路素子
JPH0682826B2 (ja) * 1986-07-11 1994-10-19 三菱電機株式会社 モノリシツク回路素子
JPH077853B2 (ja) * 1986-07-11 1995-01-30 三菱電機株式会社 生物電気素子
JP2548703B2 (ja) * 1986-07-11 1996-10-30 三菱電機株式会社 論理回路
JPH0680814B2 (ja) * 1987-03-26 1994-10-12 三菱電機株式会社 スイツチ素子
US5391463A (en) * 1988-04-14 1995-02-21 The United States Of America As Represented By The Secretary Of The Navy Surface modification to create regions resistant to adsorption of biomolecules
DE3924454A1 (de) * 1989-07-24 1991-02-07 Cornelis P Prof Dr Hollenberg Die anwendung von dna und dna-technologie fuer die konstruktion von netzwerken zur verwendung in der chip-konstruktion und chip-produktion (dna chips)
US4971931A (en) * 1990-02-12 1990-11-20 Eastman Kodak Company Diffuser features for spin-coated films
AU9113991A (en) * 1990-11-19 1992-06-11 Biotechnology Research And Development Corporation Mutant orientable proteins and coated substrates
US6864570B2 (en) * 1993-12-17 2005-03-08 The Regents Of The University Of California Method and apparatus for fabricating self-assembling microstructures
US5736257A (en) * 1995-04-25 1998-04-07 Us Navy Photoactivatable polymers for producing patterned biomolecular assemblies
DE19747377A1 (de) 1996-10-25 1998-05-28 Fraunhofer Ges Forschung Verfahren zur Vorbereitung der Erzeugung strukturierter Metallschichten mit Hilfe von Proteinen
US6129896A (en) * 1998-12-17 2000-10-10 Drawn Optical Components, Inc. Biosensor chip and manufacturing method
KR20030005227A (ko) * 2000-03-16 2003-01-17 마츠시타 덴끼 산교 가부시키가이샤 미소구조체의 정밀가공방법
GR1004058B (el) 2001-05-31 2002-11-15 Φωτοπολυμερικα υλικα με βιοσυμβατες λιθογραφικες απαιτησεις καταλληλα για σχηματοποιηση επιστρωσεων πολλαπλων βioμοριων
EP1546320B1 (en) * 2002-09-07 2015-08-26 Vincent B. Pizziconi Nanoengineered biophotonic hybrid device
US8173407B2 (en) * 2002-09-07 2012-05-08 Labelle Jeffrey T Nanoengineered biophotonic hybrid device
US9034623B2 (en) 2002-09-07 2015-05-19 Jeffrey T. LaBelle Nanoengineered biophotonic hybrid device
US20040241659A1 (en) * 2003-05-30 2004-12-02 Applera Corporation Apparatus and method for hybridization and SPR detection
US7820227B2 (en) * 2003-12-11 2010-10-26 University Of Maryland, College Park Biolithographical deposition and materials and devices formed therefrom
JP2009264585A (ja) 2008-03-31 2009-11-12 Max Co Ltd 連結ファスナー
CN104459852B (zh) * 2013-09-22 2017-02-01 清华大学 金属光栅的制备方法
US10073340B2 (en) * 2014-10-02 2018-09-11 University Of Massachusetts Protein films and methods of forming the same

Citations (1)

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Publication number Priority date Publication date Assignee Title
FR2265809A1 (cg-RX-API-DMAC10.html) * 1974-03-25 1975-10-24 Ibm

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US2051603A (en) * 1932-06-09 1936-08-18 Hruska Rudolf Process for the production of the explanatory titles for the pictures on cinematographic films
US3535137A (en) * 1967-01-13 1970-10-20 Ibm Method of fabricating etch resistant masks
US3520758A (en) * 1967-08-07 1970-07-14 Eastman Kodak Co Laminated photographic identification card
UST875030I4 (en) 1970-01-26 1970-06-30 Defensive publication
US3746564A (en) * 1970-11-19 1973-07-17 Eastman Kodak Co Photographic diffusion transfer product and process
US3914462A (en) * 1971-06-04 1975-10-21 Hitachi Ltd Method for forming a resist mask using a positive electron resist
US3779806A (en) * 1972-03-24 1973-12-18 Ibm Electron beam sensitive polymer t-butyl methacrylate resist
US3883352A (en) * 1973-04-05 1975-05-13 Grace W R & Co Process for forming a photocured solder resist

Patent Citations (1)

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Publication number Priority date Publication date Assignee Title
FR2265809A1 (cg-RX-API-DMAC10.html) * 1974-03-25 1975-10-24 Ibm

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0007784A1 (en) * 1978-07-21 1980-02-06 Process Shizai Co. Ltd. Thermal recording material

Also Published As

Publication number Publication date
FR2337893B1 (cg-RX-API-DMAC10.html) 1982-06-25
NL7614535A (nl) 1977-07-12
CA1066209A (en) 1979-11-13
GB1572510A (en) 1980-07-30
JPS6153850B2 (cg-RX-API-DMAC10.html) 1986-11-19
JPS5286077A (en) 1977-07-16
DE2659604A1 (de) 1977-07-14
US4103064A (en) 1978-07-25

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