FR2320634A1 - SEMICONDUCTOR ELEMENT WITH A PROTECTIVE POLYMER LAYER - Google Patents

SEMICONDUCTOR ELEMENT WITH A PROTECTIVE POLYMER LAYER

Info

Publication number
FR2320634A1
FR2320634A1 FR7623319A FR7623319A FR2320634A1 FR 2320634 A1 FR2320634 A1 FR 2320634A1 FR 7623319 A FR7623319 A FR 7623319A FR 7623319 A FR7623319 A FR 7623319A FR 2320634 A1 FR2320634 A1 FR 2320634A1
Authority
FR
France
Prior art keywords
semiconductor element
polymer layer
protective polymer
protective
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7623319A
Other languages
French (fr)
Other versions
FR2320634B1 (en
Inventor
Alexander John Yerman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US05/601,839 external-priority patent/US4017340A/en
Application filed by General Electric Co filed Critical General Electric Co
Publication of FR2320634A1 publication Critical patent/FR2320634A1/en
Application granted granted Critical
Publication of FR2320634B1 publication Critical patent/FR2320634B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H01L23/3171—Partial encapsulation or coating the coating being directly applied to the semiconductor body, e.g. passivation layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H01L23/3192—Multilayer coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10156—Shape being other than a cuboid at the periphery

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Formation Of Insulating Films (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
FR7623319A 1975-08-04 1976-07-30 SEMICONDUCTOR ELEMENT WITH A PROTECTIVE POLYMER LAYER Granted FR2320634A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US60183875A 1975-08-04 1975-08-04
US05/601,839 US4017340A (en) 1975-08-04 1975-08-04 Semiconductor element having a polymeric protective coating and glass coating overlay

Publications (2)

Publication Number Publication Date
FR2320634A1 true FR2320634A1 (en) 1977-03-04
FR2320634B1 FR2320634B1 (en) 1983-01-07

Family

ID=27083963

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7623319A Granted FR2320634A1 (en) 1975-08-04 1976-07-30 SEMICONDUCTOR ELEMENT WITH A PROTECTIVE POLYMER LAYER

Country Status (6)

Country Link
JP (1) JPS584816B2 (en)
DE (1) DE2634568C2 (en)
FR (1) FR2320634A1 (en)
GB (1) GB1553243A (en)
NL (1) NL185044C (en)
SE (1) SE429699B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0347518A1 (en) * 1988-03-28 1989-12-27 Asea Brown Boveri Ag Passivation of a semiconductor device

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE418433B (en) * 1975-12-11 1981-05-25 Gen Electric SEMICONDUCTOR ELEMENT WITH A LAYER OF A POLYMERIC SILOXAN-CONTAINING MEMBRANE MEMBRANE MATERIAL WITH VARIABLE PERMEABILITY APPLIED ON SELECTED SURFACE OF THE ELEMENT
GB1563421A (en) * 1975-12-18 1980-03-26 Gen Electric Polyimide-siloxane copolymer protective coating for semiconductor devices
JPS5978954A (en) * 1982-10-22 1984-05-08 Nitto Electric Ind Co Ltd Coating material for optical glass fiber
JPH0693451B2 (en) * 1984-03-31 1994-11-16 株式会社東芝 Semiconductor device and manufacturing method thereof
WO1997012403A1 (en) * 1995-09-27 1997-04-03 Hitachi, Ltd. Diode
FR2797995B1 (en) * 1999-08-25 2002-03-22 Gemplus Card Int METHOD FOR PROTECTING INTEGRATED CIRCUIT CHIPS BY INSULATING THIN FILM DEPOSITION
FR2797996B1 (en) * 1999-08-25 2003-10-03 Gemplus Card Int METHOD FOR PROTECTING INTEGRATED CIRCUIT CHIPS BY INSULATING THIN FILM DEPOSITION
DE102007033288A1 (en) 2007-07-17 2009-01-22 Siemens Ag Electronic component and device with high insulation resistance and method for their production
EP3113219B1 (en) * 2015-06-30 2020-03-11 SEMIKRON Elektronik GmbH & Co. KG Semiconductor device and manufacturing method thereof
JP6704359B2 (en) * 2017-01-10 2020-06-03 三菱電機株式会社 Power semiconductor device

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3481781A (en) * 1967-03-17 1969-12-02 Rca Corp Silicate glass coating of semiconductor devices
US3597269A (en) * 1969-09-30 1971-08-03 Westinghouse Electric Corp Surfce stabilization of semiconductor power devices and article
US3619733A (en) * 1969-08-18 1971-11-09 Rca Corp Semiconductor device with multilevel metalization and method of making the same
FR2090208A1 (en) * 1970-05-22 1972-01-14 Gen Electric
FR2090206A1 (en) * 1970-05-22 1972-01-14 Gen Electric

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3034079A (en) * 1959-05-11 1962-05-08 Microwave Ass Hermetically sealed semiconductors
US3338859A (en) * 1966-06-30 1967-08-29 Dow Corning Silicone polyimides
US3615913A (en) * 1968-11-08 1971-10-26 Westinghouse Electric Corp Polyimide and polyamide-polyimide as a semiconductor surface passivator and protectant coating
IE35247B1 (en) * 1970-06-08 1975-12-24 Gen Electric Improvements in ceramic passivated semi-conductor device and process for its manufacture
JPS4723980U (en) * 1971-03-19 1972-11-17
US3740305A (en) * 1971-10-01 1973-06-19 Gen Electric Composite materials bonded with siloxane containing polyimides
JPS5144071B2 (en) * 1972-06-14 1976-11-26

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3481781A (en) * 1967-03-17 1969-12-02 Rca Corp Silicate glass coating of semiconductor devices
US3619733A (en) * 1969-08-18 1971-11-09 Rca Corp Semiconductor device with multilevel metalization and method of making the same
US3597269A (en) * 1969-09-30 1971-08-03 Westinghouse Electric Corp Surfce stabilization of semiconductor power devices and article
FR2090208A1 (en) * 1970-05-22 1972-01-14 Gen Electric
FR2090206A1 (en) * 1970-05-22 1972-01-14 Gen Electric

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0347518A1 (en) * 1988-03-28 1989-12-27 Asea Brown Boveri Ag Passivation of a semiconductor device

Also Published As

Publication number Publication date
DE2634568A1 (en) 1977-02-17
GB1553243A (en) 1979-09-26
SE7608727L (en) 1977-02-05
JPS584816B2 (en) 1983-01-27
NL7608544A (en) 1977-02-08
DE2634568C2 (en) 1985-06-20
SE429699B (en) 1983-09-19
JPS5228266A (en) 1977-03-03
FR2320634B1 (en) 1983-01-07
NL185044C (en) 1990-01-02
NL185044B (en) 1989-08-01

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Legal Events

Date Code Title Description
ST Notification of lapse