FR2090206A1 - - Google Patents
Info
- Publication number
- FR2090206A1 FR2090206A1 FR7118100A FR7118100A FR2090206A1 FR 2090206 A1 FR2090206 A1 FR 2090206A1 FR 7118100 A FR7118100 A FR 7118100A FR 7118100 A FR7118100 A FR 7118100A FR 2090206 A1 FR2090206 A1 FR 2090206A1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Electrodes Of Semiconductors (AREA)
- Thyristors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US3965070A | 1970-05-22 | 1970-05-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
FR2090206A1 true FR2090206A1 (en) | 1972-01-14 |
Family
ID=21906611
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7118100A Withdrawn FR2090206A1 (en) | 1970-05-22 | 1971-05-19 |
Country Status (4)
Country | Link |
---|---|
DE (2) | DE2125106A1 (en) |
FR (1) | FR2090206A1 (en) |
GB (1) | GB1356157A (en) |
IE (1) | IE35063B1 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS508469A (en) * | 1973-05-21 | 1975-01-28 | ||
FR2320634A1 (en) * | 1975-08-04 | 1977-03-04 | Gen Electric | SEMICONDUCTOR ELEMENT WITH A PROTECTIVE POLYMER LAYER |
FR2335960A1 (en) * | 1975-12-18 | 1977-07-15 | Gen Electric | PERFECTED SEMICONDUCTOR ELEMENT |
EP0491389A1 (en) * | 1990-12-19 | 1992-06-24 | Siemens Aktiengesellschaft | Semiconductor power component |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102009017732A1 (en) * | 2009-04-11 | 2010-10-21 | Semikron Elektronik Gmbh & Co. Kg | Power semiconductor component with an edge passivation and method for its production |
CN104124215B (en) * | 2014-06-26 | 2017-02-15 | 江苏省宜兴电子器件总厂 | Packaging structure and packaging technology capable of synchronously completing welding, bonding and sealing |
-
1971
- 1971-04-16 IE IE47371A patent/IE35063B1/en unknown
- 1971-05-19 FR FR7118100A patent/FR2090206A1/fr not_active Withdrawn
- 1971-05-21 DE DE19712125106 patent/DE2125106A1/en active Pending
- 1971-05-21 DE DE19717119711 patent/DE7119711U/en not_active Expired
- 1971-05-24 GB GB1675671A patent/GB1356157A/en not_active Expired
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS508469A (en) * | 1973-05-21 | 1975-01-28 | ||
JPS5754043B2 (en) * | 1973-05-21 | 1982-11-16 | ||
FR2320634A1 (en) * | 1975-08-04 | 1977-03-04 | Gen Electric | SEMICONDUCTOR ELEMENT WITH A PROTECTIVE POLYMER LAYER |
FR2335960A1 (en) * | 1975-12-18 | 1977-07-15 | Gen Electric | PERFECTED SEMICONDUCTOR ELEMENT |
EP0491389A1 (en) * | 1990-12-19 | 1992-06-24 | Siemens Aktiengesellschaft | Semiconductor power component |
Also Published As
Publication number | Publication date |
---|---|
GB1356157A (en) | 1974-06-12 |
IE35063L (en) | 1971-11-22 |
DE2125106A1 (en) | 1971-12-02 |
DE7119711U (en) | 1972-02-03 |
IE35063B1 (en) | 1975-10-29 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |