FR2090206A1 - - Google Patents

Info

Publication number
FR2090206A1
FR2090206A1 FR7118100A FR7118100A FR2090206A1 FR 2090206 A1 FR2090206 A1 FR 2090206A1 FR 7118100 A FR7118100 A FR 7118100A FR 7118100 A FR7118100 A FR 7118100A FR 2090206 A1 FR2090206 A1 FR 2090206A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR7118100A
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of FR2090206A1 publication Critical patent/FR2090206A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/16Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • H01L23/04Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157Partial encapsulation or coating
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01079Gold [Au]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701Low temperature co-fired ceramic [LTCC]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/12Passive devices, e.g. 2 terminal devices
    • H01L2924/1204Optical Diode
    • H01L2924/12044OLED

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Thyristors (AREA)
FR7118100A 1970-05-22 1971-05-19 Withdrawn FR2090206A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US3965070A 1970-05-22 1970-05-22

Publications (1)

Publication Number Publication Date
FR2090206A1 true FR2090206A1 (en) 1972-01-14

Family

ID=21906611

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7118100A Withdrawn FR2090206A1 (en) 1970-05-22 1971-05-19

Country Status (4)

Country Link
DE (2) DE2125106A1 (en)
FR (1) FR2090206A1 (en)
GB (1) GB1356157A (en)
IE (1) IE35063B1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS508469A (en) * 1973-05-21 1975-01-28
FR2320634A1 (en) * 1975-08-04 1977-03-04 Gen Electric SEMICONDUCTOR ELEMENT WITH A PROTECTIVE POLYMER LAYER
FR2335960A1 (en) * 1975-12-18 1977-07-15 Gen Electric PERFECTED SEMICONDUCTOR ELEMENT
EP0491389A1 (en) * 1990-12-19 1992-06-24 Siemens Aktiengesellschaft Semiconductor power component

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009017732A1 (en) * 2009-04-11 2010-10-21 Semikron Elektronik Gmbh & Co. Kg Power semiconductor component with an edge passivation and method for its production
CN104124215B (en) * 2014-06-26 2017-02-15 江苏省宜兴电子器件总厂 Packaging structure and packaging technology capable of synchronously completing welding, bonding and sealing

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS508469A (en) * 1973-05-21 1975-01-28
JPS5754043B2 (en) * 1973-05-21 1982-11-16
FR2320634A1 (en) * 1975-08-04 1977-03-04 Gen Electric SEMICONDUCTOR ELEMENT WITH A PROTECTIVE POLYMER LAYER
FR2335960A1 (en) * 1975-12-18 1977-07-15 Gen Electric PERFECTED SEMICONDUCTOR ELEMENT
EP0491389A1 (en) * 1990-12-19 1992-06-24 Siemens Aktiengesellschaft Semiconductor power component

Also Published As

Publication number Publication date
GB1356157A (en) 1974-06-12
IE35063L (en) 1971-11-22
DE2125106A1 (en) 1971-12-02
DE7119711U (en) 1972-02-03
IE35063B1 (en) 1975-10-29

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Legal Events

Date Code Title Description
ST Notification of lapse