FR2305478A1 - SCREENABLE PASTE FOR THICK LAYER CONDUCTORS TO BE DEPOSITED ON A CERAMIC SUBSTRATE AND PROCESS FOR PREPARING CONDUCTIVE LAYERS USING SUCH A PASTE - Google Patents
SCREENABLE PASTE FOR THICK LAYER CONDUCTORS TO BE DEPOSITED ON A CERAMIC SUBSTRATE AND PROCESS FOR PREPARING CONDUCTIVE LAYERS USING SUCH A PASTEInfo
- Publication number
- FR2305478A1 FR2305478A1 FR7509288A FR7509288A FR2305478A1 FR 2305478 A1 FR2305478 A1 FR 2305478A1 FR 7509288 A FR7509288 A FR 7509288A FR 7509288 A FR7509288 A FR 7509288A FR 2305478 A1 FR2305478 A1 FR 2305478A1
- Authority
- FR
- France
- Prior art keywords
- paste
- deposited
- ceramic substrate
- conductive layers
- thick layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
- C04B41/81—Coating or impregnation
- C04B41/85—Coating or impregnation with inorganic materials
- C04B41/88—Metals
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
- C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
- C04B41/5127—Cu, e.g. Cu-CuO eutectic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/14—Conductive material dispersed in non-conductive inorganic material
- H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7509288A FR2305478A1 (en) | 1975-03-25 | 1975-03-25 | SCREENABLE PASTE FOR THICK LAYER CONDUCTORS TO BE DEPOSITED ON A CERAMIC SUBSTRATE AND PROCESS FOR PREPARING CONDUCTIVE LAYERS USING SUCH A PASTE |
DE19762610303 DE2610303C2 (en) | 1975-03-25 | 1976-03-12 | Screen printing paste for thick, electrically conductive layers forming conductor tracks on a ceramic substrate |
IT2143276A IT1066171B (en) | 1975-03-25 | 1976-03-22 | PASTE FOR SCREEN PRINTING |
GB1141276A GB1489031A (en) | 1975-03-25 | 1976-03-22 | Silk screen printing paste |
JP3239576A JPS5830759B2 (en) | 1975-03-25 | 1976-03-24 | Screen printing paste and thick film conductive circuits |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7509288A FR2305478A1 (en) | 1975-03-25 | 1975-03-25 | SCREENABLE PASTE FOR THICK LAYER CONDUCTORS TO BE DEPOSITED ON A CERAMIC SUBSTRATE AND PROCESS FOR PREPARING CONDUCTIVE LAYERS USING SUCH A PASTE |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2305478A1 true FR2305478A1 (en) | 1976-10-22 |
FR2305478B1 FR2305478B1 (en) | 1981-09-25 |
Family
ID=9153042
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7509288A Granted FR2305478A1 (en) | 1975-03-25 | 1975-03-25 | SCREENABLE PASTE FOR THICK LAYER CONDUCTORS TO BE DEPOSITED ON A CERAMIC SUBSTRATE AND PROCESS FOR PREPARING CONDUCTIVE LAYERS USING SUCH A PASTE |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPS5830759B2 (en) |
DE (1) | DE2610303C2 (en) |
FR (1) | FR2305478A1 (en) |
GB (1) | GB1489031A (en) |
IT (1) | IT1066171B (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2397469A1 (en) * | 1977-02-22 | 1979-02-09 | Panoduz Anstalt | PROCEDURE FOR DEPOSING A LAYER OF CONDUCTIVE METAL ON AN INSULATING SUPPORT |
EP0076210B1 (en) * | 1981-09-28 | 1986-08-13 | ETAT-FRANCAIS représenté par le Délégué Général pour l' Armement | Electric bridge-wire initiator for pyrotechnic charges |
EP0262975A2 (en) * | 1986-10-02 | 1988-04-06 | General Electric Company | Thick-film copper conductor inks |
EP1165311A1 (en) * | 1999-02-09 | 2002-01-02 | Sarnoff Corporation | Multilayer ceramic circuit boards with embedded resistors |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2490210A1 (en) | 1980-09-15 | 1982-03-19 | Labo Electronique Physique | STARTING MIXTURE FOR A HIGHLY RESISTANT COMPOSITION, INK SERIGRAPHIABLE CONSTITUTED WITH AND ELECTRIC CIRCUITS SO PERFORMED |
JPS5811565A (en) * | 1981-07-14 | 1983-01-22 | Murata Mfg Co Ltd | Electrically conductive paint |
JPS5879837A (en) * | 1981-10-31 | 1983-05-13 | Tdk Corp | Electrically conductive paste composition |
FR2564455B1 (en) * | 1984-05-18 | 1986-09-19 | Labo Electronique Physique | STARTING MIXTURE FOR AN INSULATING COMPOSITION, SERIGRAPHIABLE INK COMPRISING SUCH A MIXTURE AND USE OF THIS INK FOR THE PRODUCTION OF HYBRID MICROCIRCUITS ON COLAMIN SUBSTRATE |
FR2566386A1 (en) * | 1984-06-22 | 1985-12-27 | Labo Electronique Physique | INTAKE MIXTURE FOR AN INSULATING COMPOSITION COMPRISING A LEAD-BASED GLASS, PRINTING INK HAVING SUCH A MIXTURE AND USE OF THIS INK FOR THE PROTECTION OF HYBRID MICROCIRCUITS ON A CERAMIC SUBSTRATE |
FR2575331B1 (en) * | 1984-12-21 | 1987-06-05 | Labo Electronique Physique | HOUSING FOR ELECTRONIC COMPONENT |
JPS6248097A (en) * | 1985-08-28 | 1987-03-02 | 日本特殊陶業株式会社 | Manufacture of multilayer circuit board |
JPS62211994A (en) * | 1986-03-13 | 1987-09-17 | 三井金属鉱業株式会社 | Multilayer circuit board and manufacture of the same |
JP2006107776A (en) * | 2004-09-30 | 2006-04-20 | Toshiba Corp | Manufacturing method of image display device |
DE102005007933A1 (en) * | 2005-02-10 | 2006-08-17 | Schott Ag | Preparation of heat conductive layer on ceramic, glass/ceramic or glass with preparation of slip from electrically conductive material and binder useful in cooking plate production involving, application of slip to selected substrate region |
CN112259279B (en) * | 2020-10-19 | 2022-03-18 | 厦门翰森达电子科技有限公司 | Environment-friendly waterborne conductive silver paste for automobile glass |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2993815A (en) * | 1959-05-25 | 1961-07-25 | Bell Telephone Labor Inc | Metallizing refractory substrates |
-
1975
- 1975-03-25 FR FR7509288A patent/FR2305478A1/en active Granted
-
1976
- 1976-03-12 DE DE19762610303 patent/DE2610303C2/en not_active Expired
- 1976-03-22 GB GB1141276A patent/GB1489031A/en not_active Expired
- 1976-03-22 IT IT2143276A patent/IT1066171B/en active
- 1976-03-24 JP JP3239576A patent/JPS5830759B2/en not_active Expired
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2397469A1 (en) * | 1977-02-22 | 1979-02-09 | Panoduz Anstalt | PROCEDURE FOR DEPOSING A LAYER OF CONDUCTIVE METAL ON AN INSULATING SUPPORT |
EP0076210B1 (en) * | 1981-09-28 | 1986-08-13 | ETAT-FRANCAIS représenté par le Délégué Général pour l' Armement | Electric bridge-wire initiator for pyrotechnic charges |
EP0262975A2 (en) * | 1986-10-02 | 1988-04-06 | General Electric Company | Thick-film copper conductor inks |
EP0262975A3 (en) * | 1986-10-02 | 1989-02-08 | General Electric Company | Thick-film copper conductor inks |
EP1165311A1 (en) * | 1999-02-09 | 2002-01-02 | Sarnoff Corporation | Multilayer ceramic circuit boards with embedded resistors |
EP1165311A4 (en) * | 1999-02-09 | 2008-06-04 | Lamina Ceramics Inc | Multilayer ceramic circuit boards with embedded resistors |
Also Published As
Publication number | Publication date |
---|---|
FR2305478B1 (en) | 1981-09-25 |
GB1489031A (en) | 1977-10-19 |
IT1066171B (en) | 1985-03-04 |
DE2610303A1 (en) | 1976-10-07 |
DE2610303C2 (en) | 1983-04-21 |
JPS5830759B2 (en) | 1983-07-01 |
JPS51119973A (en) | 1976-10-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
CD | Change of name or company name | ||
ST | Notification of lapse |