FR2300146A1 - Bain pour l'electrodeposition d'alliages de palladium et de nickel - Google Patents

Bain pour l'electrodeposition d'alliages de palladium et de nickel

Info

Publication number
FR2300146A1
FR2300146A1 FR7603290A FR7603290A FR2300146A1 FR 2300146 A1 FR2300146 A1 FR 2300146A1 FR 7603290 A FR7603290 A FR 7603290A FR 7603290 A FR7603290 A FR 7603290A FR 2300146 A1 FR2300146 A1 FR 2300146A1
Authority
FR
France
Prior art keywords
electrodeposition
palladium
bath
nickel alloys
alloys
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7603290A
Other languages
English (en)
French (fr)
Other versions
FR2300146B1 (US20110009641A1-20110113-C00185.png
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bayer Pharma AG
Original Assignee
Schering AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schering AG filed Critical Schering AG
Publication of FR2300146A1 publication Critical patent/FR2300146A1/fr
Application granted granted Critical
Publication of FR2300146B1 publication Critical patent/FR2300146B1/fr
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/567—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of platinum group metals

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Manufacture And Refinement Of Metals (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
FR7603290A 1975-02-07 1976-02-06 Bain pour l'electrodeposition d'alliages de palladium et de nickel Granted FR2300146A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2506467A DE2506467C2 (de) 1975-02-07 1975-02-07 Bad und Verfahren zur galvanischen Abscheidung von Palladium-Nickel-Legierungen

Publications (2)

Publication Number Publication Date
FR2300146A1 true FR2300146A1 (fr) 1976-09-03
FR2300146B1 FR2300146B1 (US20110009641A1-20110113-C00185.png) 1979-06-22

Family

ID=5938990

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7603290A Granted FR2300146A1 (fr) 1975-02-07 1976-02-06 Bain pour l'electrodeposition d'alliages de palladium et de nickel

Country Status (12)

Country Link
US (1) US4299672A (US20110009641A1-20110113-C00185.png)
JP (1) JPS5830395B2 (US20110009641A1-20110113-C00185.png)
AT (1) AT341850B (US20110009641A1-20110113-C00185.png)
BE (1) BE838335A (US20110009641A1-20110113-C00185.png)
CA (1) CA1077429A (US20110009641A1-20110113-C00185.png)
CH (1) CH617966A5 (US20110009641A1-20110113-C00185.png)
DE (1) DE2506467C2 (US20110009641A1-20110113-C00185.png)
ES (1) ES442961A1 (US20110009641A1-20110113-C00185.png)
FR (1) FR2300146A1 (US20110009641A1-20110113-C00185.png)
GB (1) GB1536462A (US20110009641A1-20110113-C00185.png)
IT (1) IT1055872B (US20110009641A1-20110113-C00185.png)
NL (1) NL7601158A (US20110009641A1-20110113-C00185.png)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2356747A1 (fr) * 1976-06-28 1978-01-27 Systemes Traitements Surfaces Bain aqueux pour le depot electrolytique de palladium et ses alliages
FR2403399A1 (fr) * 1977-09-19 1979-04-13 Oxy Metal Industries Corp Bains de revetement electrolytique de palladium brillant
EP0059452A2 (en) * 1981-02-27 1982-09-08 Western Electric Company, Incorporated Palladium and palladium alloys electroplating procedure

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2657925A1 (de) * 1976-12-21 1978-06-22 Siemens Ag Ammoniakfreies, waessriges bad zur galvanischen abscheidung von palladium bzw. palladiumlegierungen
US4278514A (en) * 1980-02-12 1981-07-14 Technic, Inc. Bright palladium electrodeposition solution
DE3100997C2 (de) * 1981-01-15 1986-08-14 Degussa Ag, 6000 Frankfurt Bad zum galvanischen Abscheiden von Rhodiumüberzügen
US4486274A (en) * 1981-02-27 1984-12-04 At&T Bell Laboratories Palladium plating prodedure
US4743346A (en) * 1986-07-01 1988-05-10 E. I. Du Pont De Nemours And Company Electroplating bath and process for maintaining plated alloy composition stable
US4846941A (en) * 1986-07-01 1989-07-11 E. I. Du Pont De Nemours And Company Electroplating bath and process for maintaining plated alloy composition stable
US4849303A (en) * 1986-07-01 1989-07-18 E. I. Du Pont De Nemours And Company Alloy coatings for electrical contacts
US4778574A (en) * 1987-09-14 1988-10-18 American Chemical & Refining Company, Inc. Amine-containing bath for electroplating palladium
JP2008081765A (ja) * 2006-09-26 2008-04-10 Tanaka Kikinzoku Kogyo Kk パラジウム合金めっき液及びそのめっき液を用いためっき方法。
JP6663335B2 (ja) * 2016-10-07 2020-03-11 松田産業株式会社 パラジウム−ニッケル合金皮膜及びその製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2227343A1 (US20110009641A1-20110113-C00185.png) * 1973-04-27 1974-11-22 Oxy Metal Finishing Corp

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4733177U (US20110009641A1-20110113-C00185.png) * 1971-05-12 1972-12-13

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2227343A1 (US20110009641A1-20110113-C00185.png) * 1973-04-27 1974-11-22 Oxy Metal Finishing Corp

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
CHEMICAL ABSTRACTS, VOL. 77, NO. 18, 30 OCTOBRE 1972, PAGE 525, NO. 121548H, CITE & JP-B-46 025 605 (SUWA SEIKOSHA CO.) *

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2356747A1 (fr) * 1976-06-28 1978-01-27 Systemes Traitements Surfaces Bain aqueux pour le depot electrolytique de palladium et ses alliages
FR2403399A1 (fr) * 1977-09-19 1979-04-13 Oxy Metal Industries Corp Bains de revetement electrolytique de palladium brillant
EP0059452A2 (en) * 1981-02-27 1982-09-08 Western Electric Company, Incorporated Palladium and palladium alloys electroplating procedure
EP0059452A3 (en) * 1981-02-27 1982-11-10 Western Electric Company, Incorporated Palladium and palladium alloys electroplating procedure

Also Published As

Publication number Publication date
JPS5830395B2 (ja) 1983-06-29
ES442961A1 (es) 1977-04-16
GB1536462A (en) 1978-12-20
DE2506467A1 (de) 1976-08-19
US4299672A (en) 1981-11-10
JPS51103827A (US20110009641A1-20110113-C00185.png) 1976-09-14
CA1077429A (en) 1980-05-13
BE838335A (fr) 1976-08-06
FR2300146B1 (US20110009641A1-20110113-C00185.png) 1979-06-22
CH617966A5 (US20110009641A1-20110113-C00185.png) 1980-06-30
DE2506467C2 (de) 1986-07-17
AT341850B (de) 1978-02-27
ATA888675A (de) 1977-06-15
NL7601158A (nl) 1976-08-10
IT1055872B (it) 1982-01-11

Similar Documents

Publication Publication Date Title
BE804544A (fr) Bain pour le depot galvanique d'or et d'alliages d'or
FR2285474A1 (fr) Bain pour l'electrodeposition d'alliages de metaux precieux
FR2300146A1 (fr) Bain pour l'electrodeposition d'alliages de palladium et de nickel
BE849410A (fr) Bain et procede pour l'electrodeposition d'un alliage d'etain et d'or
GB1543548A (en) Bath and method for the electrodeposition of bright nickel-iron deposits
CH534215A (fr) Bain électrolytique pour l'électrodéposition d'alliages d'or et une utilisation de celui-ci
JPS5211132A (en) Electroplating bath
JPS5565387A (en) Chromium alloy electroplating bath
JPS51121042A (en) Electrodeposition bath composition and electrodepositing method
BE891319A (fr) Electrodeposition du palladium et d'alliages de palladium
BE781965A (fr) Bain et procede pour l'electrodeposition de nickel
CH540344A (fr) Bain pour le dépôt électrolytique d'alliagesd'or
JPS5253735A (en) Silver plating method and silver plating bath
JPS51120938A (en) Nickel electroplating bath
BE861459A (fr) Bain et procede de placage electrolytique de nickel
JPS5534697A (en) Electroplating bath of gold alloy and method
CH525963A (fr) Bain galvanique pour l'électrodéposition de l'or et son utilisation en galvanoplastie
JPS5420927A (en) Electroplating of nickelliron alloy
JPS5215426A (en) Electroplating bath
JPS5292834A (en) Chromium*3* plating bath
JPS5220337A (en) Removal of electroplated nickelliron alloy
JPS5249936A (en) Nonnelectrolytic plating agent for metals of platinum group
JPS52105540A (en) Silver bath for lusterous plating of nonncyanide
JPS5249939A (en) Alloy plating bath in place of chromium
JPS5214537A (en) Rhodium plating bath

Legal Events

Date Code Title Description
ST Notification of lapse