FR2275967A1 - Positioning device for semiconductor substrate relative to mask - substrate support has resilient membrane connected to compressed air source - Google Patents

Positioning device for semiconductor substrate relative to mask - substrate support has resilient membrane connected to compressed air source

Info

Publication number
FR2275967A1
FR2275967A1 FR7421658A FR7421658A FR2275967A1 FR 2275967 A1 FR2275967 A1 FR 2275967A1 FR 7421658 A FR7421658 A FR 7421658A FR 7421658 A FR7421658 A FR 7421658A FR 2275967 A1 FR2275967 A1 FR 2275967A1
Authority
FR
France
Prior art keywords
compressed air
positioning device
semiconductor substrate
mask
support surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7421658A
Other languages
French (fr)
Other versions
FR2275967B1 (en
Inventor
Claude Gigoux
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Priority to FR7421658A priority Critical patent/FR2275967A1/en
Publication of FR2275967A1 publication Critical patent/FR2275967A1/en
Application granted granted Critical
Publication of FR2275967B1 publication Critical patent/FR2275967B1/fr
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0736—Methods for applying liquids, e.g. spraying
    • H05K2203/074—Features related to the fluid pressure

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

The positioning device is a support for the semiconductor substrate, having a planar support surface at least partially covered with a resilient membrane (20) fixed to the surface around its periphery. A supply channel for compressed air (22) is positioned in the support surface below the resilient membrane (20), to allow the compressed air to be introduced between the membrane and the support surface. Preferably a number of further channels (120) are positioned in the support surface, around the periphery of the membrane, and are connected to air evacuating means. The membrane may be positioned over a shallow similar shaped aperture (21) in the support surface.
FR7421658A 1974-06-21 1974-06-21 Positioning device for semiconductor substrate relative to mask - substrate support has resilient membrane connected to compressed air source Granted FR2275967A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR7421658A FR2275967A1 (en) 1974-06-21 1974-06-21 Positioning device for semiconductor substrate relative to mask - substrate support has resilient membrane connected to compressed air source

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7421658A FR2275967A1 (en) 1974-06-21 1974-06-21 Positioning device for semiconductor substrate relative to mask - substrate support has resilient membrane connected to compressed air source

Publications (2)

Publication Number Publication Date
FR2275967A1 true FR2275967A1 (en) 1976-01-16
FR2275967B1 FR2275967B1 (en) 1976-10-22

Family

ID=9140381

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7421658A Granted FR2275967A1 (en) 1974-06-21 1974-06-21 Positioning device for semiconductor substrate relative to mask - substrate support has resilient membrane connected to compressed air source

Country Status (1)

Country Link
FR (1) FR2275967A1 (en)

Also Published As

Publication number Publication date
FR2275967B1 (en) 1976-10-22

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ST Notification of lapse