FR2258002B1 - - Google Patents
Info
- Publication number
- FR2258002B1 FR2258002B1 FR7500823A FR7500823A FR2258002B1 FR 2258002 B1 FR2258002 B1 FR 2258002B1 FR 7500823 A FR7500823 A FR 7500823A FR 7500823 A FR7500823 A FR 7500823A FR 2258002 B1 FR2258002 B1 FR 2258002B1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Formation Of Insulating Films (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19742401613 DE2401613A1 (de) | 1974-01-14 | 1974-01-14 | Halbleitervorrichtung |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2258002A1 FR2258002A1 (no) | 1975-08-08 |
| FR2258002B1 true FR2258002B1 (no) | 1978-12-08 |
Family
ID=5904759
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR7500823A Expired FR2258002B1 (no) | 1974-01-14 | 1975-01-13 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPS50104572A (no) |
| DE (1) | DE2401613A1 (no) |
| FR (1) | FR2258002B1 (no) |
| GB (1) | GB1465650A (no) |
| IT (1) | IT1028249B (no) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2929339A1 (de) * | 1978-07-24 | 1980-02-14 | Citizen Watch Co Ltd | Halbleiteranordnung |
| JPS5850417B2 (ja) * | 1979-07-31 | 1983-11-10 | 富士通株式会社 | 半導体装置の製造方法 |
| JPS5632731A (en) * | 1979-08-27 | 1981-04-02 | Fujitsu Ltd | Semiconductor device |
| JPS5661130A (en) * | 1979-10-25 | 1981-05-26 | Fuji Electric Co Ltd | Semiconductor device |
| JPS5736835A (en) * | 1980-08-15 | 1982-02-27 | Nec Corp | Semiconductor device |
| JPS5739736U (no) * | 1980-08-18 | 1982-03-03 | ||
| JPS5740956A (en) * | 1980-08-25 | 1982-03-06 | Fujitsu Ltd | Semiconductor device |
| JPS5975648A (ja) * | 1982-10-23 | 1984-04-28 | Nippon Precision Saakitsutsu Kk | 半導体装置およびその製造方法 |
| FR2544132B1 (fr) * | 1983-04-08 | 1986-11-21 | Telecommunications Sa | Detecteur photoconducteur en immersion optique |
| JPS601846A (ja) * | 1983-06-18 | 1985-01-08 | Toshiba Corp | 多層配線構造の半導体装置とその製造方法 |
| DE3327960A1 (de) * | 1983-08-03 | 1985-02-14 | Telefunken electronic GmbH, 7100 Heilbronn | Halbleiteranordnung in einem isolierstoffgehaeuse |
| DE3415817A1 (de) * | 1984-04-27 | 1985-10-31 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum abdecken der vorderseite eines mit bauelementstrukturen versehenen substrates |
| DE4123900A1 (de) * | 1991-07-18 | 1993-01-21 | Siemens Ag | Schutzschicht fuer wafer |
| DE4435120C2 (de) * | 1994-09-30 | 2000-08-03 | Siemens Ag | Schutzschicht für Wafer und Verfahren zu deren Herstellung |
-
1974
- 1974-01-14 DE DE19742401613 patent/DE2401613A1/de active Pending
- 1974-12-24 GB GB5577174A patent/GB1465650A/en not_active Expired
-
1975
- 1975-01-09 IT IT1911175A patent/IT1028249B/it active
- 1975-01-13 FR FR7500823A patent/FR2258002B1/fr not_active Expired
- 1975-01-13 JP JP621875A patent/JPS50104572A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| FR2258002A1 (no) | 1975-08-08 |
| JPS50104572A (no) | 1975-08-18 |
| IT1028249B (it) | 1979-01-30 |
| DE2401613A1 (de) | 1975-07-17 |
| GB1465650A (en) | 1977-02-23 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |